JPH0256357U - - Google Patents
Info
- Publication number
- JPH0256357U JPH0256357U JP13621588U JP13621588U JPH0256357U JP H0256357 U JPH0256357 U JP H0256357U JP 13621588 U JP13621588 U JP 13621588U JP 13621588 U JP13621588 U JP 13621588U JP H0256357 U JPH0256357 U JP H0256357U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- conductive sheet
- circuit boards
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例に用いられる導電性シートを示す斜視
図、第３図はケース材と導電性シートとが一体化
された平面図、第４図は第３図Ａ―Ａ断面図及び
第５図は従来例を示す図である。
１，２……混成集積回路基板、３……ケース材
、４……導電性シート。
Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a perspective view showing a conductive sheet used in this embodiment, and Fig. 3 is a plan view in which the case material and the conductive sheet are integrated. , FIG. 4 is a sectional view taken along line AA in FIG. 3, and FIG. 5 is a diagram showing a conventional example. 1, 2... Hybrid integrated circuit board, 3... Case material, 4... Conductive sheet.
Claims (1)
電路が形成され、前記導電路上に複数の半導体素
子が固着され夫々の前記半導体素子が対向する様
に前記二枚の混成集積回路基板がケース材により
離間固着された混成集積回路において、 前記ケース材と一体化され、前記二枚の混成集
積回路基板の終端辺部間に前記二枚の基板上に形
成された夫々の前記導電路を接続する導電性シー
トが配置されていることを特徴とする混成集積回
路。 (2) 前記導電性シートは帯状に形成され、その
側面と前記二枚の混成集積回路基板の終端辺とが
同一面で配置されていることを特徴とする請求項
１記載の混成集積回路。 (3) 前記導電性シートの両面からは多数の線状
導体が突出されていることを特徴とする請求項１
記載の混成集積回路。 (4) 前記二枚の混成集積回路基板は金属基板で
あることを特徴とする請求項１記載の混成集積回
路。[Claims for Utility Model Registration] (1) A conductive path of a desired shape is formed on two hybrid integrated circuit boards, and a plurality of semiconductor elements are fixed on the conductive path so that the semiconductor elements face each other. In the hybrid integrated circuit in which the two hybrid integrated circuit boards are spaced apart and fixed by a case material, the hybrid integrated circuit board is integrated with the case material and is placed between the terminal sides of the two hybrid integrated circuit boards on the two boards. A hybrid integrated circuit characterized in that a conductive sheet is arranged to connect each of the formed conductive paths. (2) The hybrid integrated circuit according to claim 1, wherein the conductive sheet is formed in a band shape, and a side surface of the conductive sheet and a terminal edge of the two hybrid integrated circuit boards are arranged on the same plane. (3) Claim 1, characterized in that a large number of linear conductors protrude from both sides of the conductive sheet.
Hybrid integrated circuit as described. (4) The hybrid integrated circuit according to claim 1, wherein the two hybrid integrated circuit boards are metal substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13621588U JPH0256357U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13621588U JPH0256357U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256357U true JPH0256357U (en) | 1990-04-24 |
Family
ID=31396514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13621588U Pending JPH0256357U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256357U (en) |
-
1988
- 1988-10-19 JP JP13621588U patent/JPH0256357U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6166993U (en) | ||
| JPH0256357U (en) | ||
| JPS6240863U (en) | ||
| JPS61158910U (en) | ||
| JPS6331572U (en) | ||
| JPH03122574U (en) | ||
| JPH0270438U (en) | ||
| JPS6448068U (en) | ||
| JPH0256356U (en) | ||
| JPS61107238U (en) | ||
| JPS6260066U (en) | ||
| JPS62108265U (en) | ||
| JPS624169U (en) | ||
| JPS61112677U (en) | ||
| JPS62108264U (en) | ||
| JPS61173176U (en) | ||
| JPS63133074U (en) | ||
| JPS5999478U (en) | Wiring structure of multilayer circuit board | |
| JPS6197857U (en) | ||
| JPS6292669U (en) | ||
| JPH01139470U (en) | ||
| JPS61162074U (en) | ||
| JPH01160808U (en) | ||
| JPS6343430U (en) | ||
| JPS62112177U (en) |