JPH0256385U - - Google Patents
Info
- Publication number
- JPH0256385U JPH0256385U JP13640488U JP13640488U JPH0256385U JP H0256385 U JPH0256385 U JP H0256385U JP 13640488 U JP13640488 U JP 13640488U JP 13640488 U JP13640488 U JP 13640488U JP H0256385 U JPH0256385 U JP H0256385U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit component
- socket
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 2
- 230000005489 elastic deformation Effects 0.000 claims 1
Landscapes
- Connecting Device With Holders (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の一実施例のおけるＩＣ用ソケ
ツトとそれに挿入されるＩＣの概略を示す斜視図
、第２図は従来のＩＣ用ソケツトとそれに挿入さ
れるＩＣの概略を示す斜視図、第３図は同ＩＣ用
ソケツトの一部断面図である。
１……半導体パツケージ、２……ＩＣの接続電
極、３……収納凹部、４……ＩＣ用ソケツト本体
、５……ＩＣ用ソケツトの接続電極。
FIG. 1 is a perspective view schematically showing an IC socket and an IC inserted therein in an embodiment of the present invention, FIG. 2 is a perspective view schematically showing a conventional IC socket and an IC inserted therein, FIG. 3 is a partial sectional view of the IC socket. 1... Semiconductor package, 2... IC connection electrode, 3... Storage recess, 4... IC socket body, 5... IC socket connection electrode.
Claims (1)
に挿入される収納凹部の内側壁に沿つて、前記半
導体集積回路部品の側面に形成された接続電極に
それぞれ当接するように形状記憶合金よりなるＵ
字状に折曲された接続電極を複数個設け、前記接
続電極の弾性変形を利用して前記収納凹部内に半
導体集積回路部品を保持することを特徴とする半
導体集積回路用ソケツト。 (2) 接続電極は常温より高い予め定められた温
度で所定の形状の記憶がなされた形状記憶合金よ
りなることを特徴とする実用新案登録請求の範囲
第１項に記載の半導体集積回路用ソケツト。[Claims for Utility Model Registration] (1) Along the inner wall of the storage recess into which the semiconductor integrated circuit component to be mounted is removably inserted, contacting electrodes formed on the sides of the semiconductor integrated circuit component are provided. U made of shape memory alloy in contact with
1. A socket for a semiconductor integrated circuit, characterized in that a plurality of connection electrodes are provided which are bent into a character shape, and a semiconductor integrated circuit component is held within the storage recess by utilizing elastic deformation of the connection electrodes. (2) The socket for a semiconductor integrated circuit according to claim 1, wherein the connecting electrode is made of a shape memory alloy that memorizes a predetermined shape at a predetermined temperature higher than room temperature. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13640488U JPH0256385U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13640488U JPH0256385U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256385U true JPH0256385U (en) | 1990-04-24 |
Family
ID=31396881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13640488U Pending JPH0256385U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256385U (en) |
-
1988
- 1988-10-19 JP JP13640488U patent/JPH0256385U/ja active Pending
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