JPH0256449U - - Google Patents

Info

Publication number: JPH0256449U
Authority: JP; Japan
Prior art keywords: resin; resin thickness; view; package; lead frame
Prior art date: 1988-10-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1988135626U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-10-18

Filing date

1988-10-18

Publication date

1990-04-24

1988-10-18 Application filed filed Critical

1988-10-18 Priority to JP1988135626U priority Critical patent/JPH0256449U/ja

1990-04-24 Publication of JPH0256449U publication Critical patent/JPH0256449U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

JP1988135626U 1988-10-18 1988-10-18 Pending JPH0256449U (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988135626U JPH0256449U (fr)	1988-10-18	1988-10-18

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988135626U JPH0256449U (fr)	1988-10-18	1988-10-18

Publications (1)

Publication Number	Publication Date
JPH0256449U true JPH0256449U (fr)	1990-04-24

Family

ID=31395422

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988135626U Pending JPH0256449U (fr)	1988-10-18	1988-10-18

Country Status (1)

Country	Link
JP (1)	JPH0256449U (fr)

1988
- 1988-10-18 JP JP1988135626U patent/JPH0256449U/ja active Pending

Publication	Publication Date	Title
JPH0258345U (fr)	1990-04-26
JPH0369248U (fr)	1991-07-09
JPS63178342U (fr)	1988-11-18
JPS61144650U (fr)	1986-09-06
JPH01145140U (fr)	1989-10-05
JPH03122545U (fr)	1991-12-13
JPH0313754U (fr)	1991-02-12
JPH0245646U (fr)	1990-03-29
JPH024258U (fr)	1990-01-11
JPH0444145U (fr)	1992-04-15
JPH02140857U (fr)	1990-11-26
JPS6430854U (fr)	1989-02-27
JPH01107157U (fr)	1989-07-19
JPH0217855U (fr)	1990-02-06
JPS63200355U (fr)	1988-12-23
JPH0323939U (fr)	1991-03-12
JPS6278758U (fr)	1987-05-20
JPS63142855U (fr)	1988-09-20
JPH02739U (fr)	1990-01-05
JPH0252452U (fr)	1990-04-16
JPH0260255U (fr)	1990-05-02
JPH0328757U (fr)	1991-03-22
JPS61151350U (fr)	1986-09-18
JPH0252446U (fr)	1990-04-16
JPH0442742U (fr)	1992-04-10