JPH0256449U - - Google Patents

Info

Publication number
JPH0256449U
JPH0256449U JP1988135626U JP13562688U JPH0256449U JP H0256449 U JPH0256449 U JP H0256449U JP 1988135626 U JP1988135626 U JP 1988135626U JP 13562688 U JP13562688 U JP 13562688U JP H0256449 U JPH0256449 U JP H0256449U
Authority
JP
Japan
Prior art keywords
resin
resin thickness
view
package
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988135626U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988135626U priority Critical patent/JPH0256449U/ja
Publication of JPH0256449U publication Critical patent/JPH0256449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す断面図、第
２図はその―線における断面図、第３図はそ
の平面図、第４図はこの考案の他の実施例を示す
斜視図、第５図は従来装置を示す断面図、第６図
はその―線における断面図、第７図は従来装
置のモールド成形過程を示す断面図である。 各図において、１はリードフレーム、２はダイ
パツト、４はチツプ、５はワイヤー、６はパツケ
ージである。なお、各図中、同一符号は同一、又
は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームにボンデイングされたチツプを
    、樹脂封止する半導体装置において、パツケージ
    外形の一部に凹部を設けワイヤーボンド側の樹脂
    厚さとダイパツト裏側の樹脂厚さとを略同一にし
    たことを特徴とする半導体装置。
JP1988135626U 1988-10-18 1988-10-18 Pending JPH0256449U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988135626U JPH0256449U (ja) 1988-10-18 1988-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988135626U JPH0256449U (ja) 1988-10-18 1988-10-18

Publications (1)

Publication Number Publication Date
JPH0256449U true JPH0256449U (ja) 1990-04-24

Family

ID=31395422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988135626U Pending JPH0256449U (ja) 1988-10-18 1988-10-18

Country Status (1)

Country Link
JP (1) JPH0256449U (ja)

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