JPH0256452U - - Google Patents
Info
- Publication number
- JPH0256452U JPH0256452U JP13521588U JP13521588U JPH0256452U JP H0256452 U JPH0256452 U JP H0256452U JP 13521588 U JP13521588 U JP 13521588U JP 13521588 U JP13521588 U JP 13521588U JP H0256452 U JPH0256452 U JP H0256452U
- Authority
- JP
- Japan
- Prior art keywords
- package
- stitch
- mounting
- semiconductor device
- bondable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Description
第１図は本考案に係る半導体装置搭載用パツケ
ージの一実施例を示す斜視図である。
１１……パツケージ、１２……アイランド部、
１３……ステツチ、１４……リード。
FIG. 1 is a perspective view showing an embodiment of a package for mounting a semiconductor device according to the present invention. 11...Package, 12...Island Club,
13...Stitch, 14...Lead.
Claims (1)
有することを特徴とする半導体装置搭載用パツケ
ージ。 A package for mounting a semiconductor device, characterized by having a bondable stitch in an island portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13521588U JPH0256452U (en) | 1988-10-17 | 1988-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13521588U JPH0256452U (en) | 1988-10-17 | 1988-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256452U true JPH0256452U (en) | 1990-04-24 |
Family
ID=31394647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13521588U Pending JPH0256452U (en) | 1988-10-17 | 1988-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256452U (en) |
-
1988
- 1988-10-17 JP JP13521588U patent/JPH0256452U/ja active Pending