JPH0256807B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a solid electrolytic capacitor, and more particularly to a method for manufacturing a solid electrolytic capacitor block.

Conventionally, it has become necessary to mount a plurality of solid electrolytic capacitors all at once on a printed wiring board. To this end, it is easy to consider preparing a container that can accommodate a predetermined number of solid electrolytic capacitors and storing them in the container. In this case, if the number of solid electrolytic capacitors to be mounted at once differs, it is necessary to prepare and manufacture containers corresponding to the number. Therefore, such a method has poor productivity. Furthermore, when combining the elements into a block, it was necessary to cover the entire block with a mold, which made the work complicated. Furthermore, if defective products were mixed together or if even one of the blocks deteriorated during assembly, the block became defective.

An object of the present invention is to provide a solid electrolytic capacitor block with excellent productivity.

Embodiments of the present invention will be described below with reference to the drawings. In this example, two adjacent side-open containers were used.

FIG. 1 is a perspective view of an embodiment of the present invention. The solid electrolytic capacitor block B consists of individual solid electrolytic capacitors B1, B2, . . . , Bn. As shown in Figure 2, each solid electrolytic capacitor B1, B
2,...,Bn are two adjacent sides 1a, 1b
It consists of an open rectangular container 2 and a capacitor element 14 housed within the container 2. Leads 10 and 12 are exposed and fixed to the container 2, extending downward in FIG. In this embodiment, the surface on which the leads 10 and 12 are exposed is designated as 3a, the surface that is not joined to other capacitor containers and adjacent to 3a is designated as 3b and 3c, and the surface that is joined to other capacitor containers is designated as 3b and 3c. The surface opposite to the open side 1a is designated as 3d. The connecting portion 5 between the one surface 3a where the leads 10 and 12 are exposed and the one surface 3b continuous to the one surface is formed into a planar shape by cutting out the intersection 5a of the one surface 3a and the one surface 3b. Ru. A container 2a is placed on the surface 3d opposite to the open side 1a of the container 2.
A solid electrolytic capacitor block B is manufactured by connecting a plurality of capacitors so that one side 1a of the capacitors are facing each other, and by injecting and solidifying a synthetic resin into the blocks as shown in FIG.

4 and 5 are enlarged perspective views of the lead 10 and its vicinity. The lead 10 has a flat plate shape,
Leads 10 on the surface 3a where the leads 10 are exposed
A recess 7 may be formed near the base of.
Alternatively, the lead 10 may be bent and processed to be substantially parallel to one surface 3a so as to be accommodated in the recess 7 as shown in FIG. The same applies to the lead 12. This provides stability when mounting the solid electrolytic capacitor block B on the circuit board. That is, lead 10,1
When bending and processing container 2, one surface 3 of container 2
It is difficult to form the leads 10, 1 parallel to a.
If 2 protrudes beyond one surface 3a, a positional shift occurs when solid electrolytic capacitor block B is fixed on the circuit board by soldering, etc., and the leads 10, 12 and the printed wiring part on the circuit board may become misaligned. There is a risk that it will not be possible to connect accurately. On the other hand, when the bent leads 10 and 12 are housed in the recess 7, there is no risk of positional displacement and they can be stably fixed onto the circuit board.

In this embodiment, the leads 10 and 12 are formed into a flat plate shape, but in another embodiment, the leads 10 and 12 may be shaped into a cylinder and cut along a plane perpendicular to the axis. In yet another embodiment, the recess 7 may be filled with solder. Furthermore, the recess 7 may be elongated and formed into a groove shape. By doing so, machining of the recess 7 becomes easier.

FIG. 6 is a diagram showing a state in which a plurality of solid electrolytic capacitor blocks B are mounted on a circuit board. Solid electrolytic capacitor block B is placed on printed wiring portion 11 of circuit board 9 with leads 10 and 12 in contact with each other, and fixed by soldering or the like. At this time, since the intersection point 5a between one surface 3a where the leads 10 and 12 are exposed and the surface 3b connected to the one surface 3a is cut out to form a planar shape, the molten solder will not touch the adjacent solid electrolytic capacitor block. This prevents it from leaking to B. That is, the leads of adjacent solid electrolytic capacitor blocks B are prevented from being erroneously connected by molten solder. Therefore, when mounting a plurality of solid electrolytic capacitor blocks B on the circuit board 9, there is no need to leave a gap between them, so the space on the circuit board 9 required to mount the solid electrolytic capacitor blocks B can be reduced. less.

In this embodiment, the connecting portion 5 is formed by cutting into a planar shape, but it may be formed by cutting into a curved shape or other shapes.

FIG. 7 is a front view of the container 2, FIG. 8 is a side view thereof, FIG. 91 is a sectional view taken along the cutting plane line - of FIG. 7, and FIG. It is a sectional view of a container of an example. The container 2 has a generally rectangular shape and has edges 6a, 6b, 6c arranged in a frame shape around the periphery of the rectangular bottom 4, and two adjacent sides 1a, 1b are open. It has a shape. A notch 8 is formed at a portion where the outer surfaces of the edges 6a and 6b are connected. Notch 8 in edge 6b
The tip 10a of the flat lead 10 is embedded from the vicinity of the edge 6a to the center of the edge 6a.
a is partially exposed at the notch 8. The tip portion 12a of the flat lead 12 passes through the edge portion 6b, reaches the bottom portion 4, and is fixed to the edge portion 6c side of the edge portion 6b. In such a container 2, the 10th
A capacitor element 14 is housed as shown in the figure. The capacitor element 14 has a flat plate shape, and a cathode section 16 is formed on its outer surface, and an anode lead wire 18 is led out from one corner of the cathode section 16. The cathode section 16 is connected to the tip end 12a of the lead 12 by, for example, soldering, and the anode lead wire 18
is located at the same height as the lead 10 and is exposed at the notch 8.
It is welded to a. The notch 8 has a lead 10,
A connecting portion 5 formed by cutting one surface 3a where 12 is exposed and a surface 3b continuous to the one surface 3a.
It has the meaning of

FIG. 92 is a sectional view of a container according to another embodiment of the present invention, and corresponds to FIG. 91 described above. In this embodiment, the container 42 is open on one side (the right side in FIG. 9 2), and its open end 43 is connected to the adjacent container 42 on the opposite side to the one side 43. A space 4 that abuts the surface 44 and is open to one side 43
5 is filled with synthetic resin, and in this way, a desired number of solid electrolytic capacitors are integrally formed into a block body. The container 42 used here is provided with a support piece 49 that supports the tip 47 in the mold when partially embedding the lead 46 therein, so that no resin is present in this part, and after the completion of the molding, there is no resin. A recess 48 connected to the tip 47 is formed in the container 42 of the solid electrolytic capacitor. The synthetic resin filled in the space 45 of the solid electrolytic capacitor block to which a plurality of capacitors are fixed adjacently enters the recess 48, thus improving the adhesion strength between adjacent solid electrolytic capacitors. .

Such solid electrolytic capacitors B1,...,Bn
is manufactured by the following procedure. First, as shown in FIG. 11, a lead frame 21 is manufactured by punching out a metal plate and forming a large number of pairs of leads 10 and 12 at intervals on a band-shaped support 20. Band-shaped support 2 of the lead frame 21
A plurality of feed holes 22 are bored in the hole 0 . Next, the tips 10a and 10b of each lead 10 and 12 are placed in a resin mold, and a thermoplastic resin, such as polyphenylsulfone resin, is injected into the mold, and as shown in FIG. 12 tip portions 10a, 1
A container 2 is formed in 2a. Furthermore, anode lead wire 18
A large number of capacitor elements 14 having the following values are manufactured.
As shown in FIG. 13, this capacitor element is supported by welding its anode lead wire 18 onto a band-shaped support 24. A plurality of holes 26 for positioning are bored in the band-shaped support 24. The arrangement interval of each capacitor element 14 is made to match the arrangement interval of each container 2 shown in FIG. Next, a conductive bonding agent is injected so as to contact the leads 12 in each container 2, and as shown in FIG. 14, the band-shaped supports 20 and 24 are overlapped. At this time, the anode lead wire 18 and the tip portion 10a of the lead 10 come into contact with each other at the notch 8, and the cathode portion 16 comes into contact with the lead 12 via the conductive bonding agent. Next, the contact portion between the anode lead wire 18 and the lead 10 is welded, and the anode lead wire 18 is cut as close to the notch 8 as possible, as shown by the dotted line in FIG. Further, the conductive bonding agent is heated and cured to form a cathode portion 1 of the capacitor element 14.
6 and lead 12 are connected. Next, lead 10,
Cut 12 to an appropriate length.

Finally, a plurality of solid electrolytic capacitors B1, B2, . connected to (see Figure 2),
Inject an appropriate amount of resin from the open side 1b at the top, and simultaneously charge a plurality of solid electrolytic capacitors B1, B.
2,..., Bn filling and bonding are performed. In this way, solid electrolytic capacitor block B is completed.

In the solid electrolytic capacitor block B having such a configuration, each solid electrolytic capacitor B is formed by connecting and molding a plurality of individual solid electrolytic capacitors B1, B2, ..., Bn.
There is no need to separately fill 1, B2, . . . , Bn, and productivity is improved. Furthermore, since individual solid electrolytic capacitors B1, B2, ..., Bn can be joined at the same time, it is not necessary to cover the surrounding area of each solid electrolytic capacitor B1, B2, ..., Bn with synthetic resin. Therefore, it is possible to reduce the size.

In this embodiment, the surface 1b is open in addition to the surface 1a on which adjacent individual capacitors come into contact, but this surface may be closed.

FIG. 15 is a plan view of a solid electrolytic capacitor block B according to another embodiment of the present invention. This embodiment is similar to the previous embodiment, and corresponding parts are provided with the same reference numerals. In this embodiment, leads 28, 30 are provided on both sides of the container 2, and a notch 8a is provided in the center of the edge 6a. An anode lead wire 18a is led out from the center of the side edge of the capacitor element 14. In this embodiment, as shown in FIG. 16, the leads 28 and 30 are formed on a strip support 20a of a lead frame 20a. Solid electrolytic capacitor block B of this example
It can also be used as a mold having leads 28, 30 while being cut off from the band-shaped support 20a, or it can be used as a chip mold by bending the separated leads. lead 2
8 and 30 are formed in different planes of the container 2a, it becomes easy to mount it on a flexible printed wiring board, for example.

FIG. 17 is a sectional view of another embodiment of the invention. In the above-mentioned embodiment, as shown in FIG. 9, the lead 12 passes in a straight line almost to the center of the edge 6b, so the depth h of the portion where the capacitor element 14 is accommodated in the container 2 is equal to the depth of the edge 6b. However, in this embodiment, by bending the tip end 12a of the lead 12 within the edge 6b, the depth H of the housing portion of the capacitor element 14 can be made deeper than h. . The same applies to the lead 10.

FIG. 18 is a perspective view of another embodiment of the solid electrolytic capacitor block B of the present invention. In the above-described embodiment, the connecting portion 5 was formed by cutting out only one portion, but depending on the arrangement in which a plurality of solid electrolytic capacitor blocks B are installed on the substrate 9, the connecting portion 5 is formed by cutting out only one portion.
As shown in the figure, a large number of leads 10 and 12 may be formed by cutting out the entire circumference of the exposed surface.
Alternatively, the number of connecting portions 5 formed by cutting may be two or three. Alternatively, as still another embodiment, a solid material is formed by cutting out a portion of the surface opposite to the surface where a large number of leads 10 and 12 are exposed, which is connected to either the lead 10 side or the lead 12 side. The polarity display of the electrolytic capacitor block B may be omitted.

FIG. 19 is a perspective view of another embodiment of the invention. In the above embodiment, after cutting the leads 10 and 12 to an appropriate length, the solid electrolytic capacitor B is
Although the solid electrolytic capacitor block B was manufactured by connecting a plurality of leads 1, B2, ..., Bn and injecting synthetic resin, in this embodiment, before cutting the leads 10, 12, individual solid electrolytic capacitors were It is also possible to connect a plurality of capacitors B1, B2, . This allows production efficiency to be further improved.

FIG. 20 is a front view of another embodiment of the leads 10, 12. When solid electrolytic capacitor block B is mounted on circuit board 9, circuit board 9 has a plurality of holes, and leads 10 and 12 are inserted into the holes to connect solid electrolytic capacitor block B and circuit board 9. 20, the tips 34 of the leads 10, 12 to be cut are cut at an angle other than 90 degrees with respect to the direction in which the leads 10, 12 extend. be done. This makes it easier to insert the leads 10, 12 into the holes of the circuit board, especially when many of the leads 10, 12 are exposed. Furthermore, the shape is the second
0 The cutting surfaces 36a, 36b are cut so that the tips 36 of the leads 10, 12 are tapered as shown in FIG.
It is easier to manufacture and maintain the shape than the shape formed by this method and the shape formed by the tip 38 being curved.

In the above embodiment, the capacitor element 14 includes:
Although a plate-shaped one was used, a disk-shaped one can also be used.

As described above, according to the present invention, a plurality of individual solid electrolytic capacitors are connected together and synthetic resin is injected from the top. Bonding of electrolytic capacitors can be carried out at the same time, and production efficiency can be increased and miniaturization can be achieved. Since a molded container was used, it was possible to freely form blocks into as many blocks as desired, and the shape was also compact. No additional molding and coating is required, making manufacturing easier. Furthermore, since inspection can be performed before forming blocks, defective products in individual units are eliminated, and deterioration during assembly is also eliminated, so the yield as blocks is improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of solid electrolytic capacitors B1 and B2, FIG. 3 is a perspective view of solid electrolytic capacitor block B, and FIG.
5 and 5 are enlarged perspective views of the vicinity of the leads 10, FIG. 6 is a diagram showing a state in which a plurality of solid electrolytic capacitor blocks B are mounted on the board 9, FIG. 7 is a front view of the container 2, and FIG. 9 is a side view of the container 2, FIG. 9 1 is a sectional view taken from the cutting plane line - in FIG.
11 is a front view of the lead frame 21, and FIG. 12 shows the state in which the container 2 is formed on the leads 10 and 12 of the lead frame 21. 13 is a front view showing the capacitor element 14 supported on the strip support 22, and FIG. 14 is the strip support 20 of the lead frame 21 in FIG. 12.
FIG. 15 is a front view of another embodiment of the present invention, and FIG. 16 is a front view of a lead used in another embodiment of the present invention. A front view of the frame 21a, FIG. 17 is a sectional view of another embodiment, FIG. 18 is a perspective view of another embodiment of the present invention, FIG. 19 is a perspective view of another embodiment of the present invention, and FIG. The figure is a perspective view of another embodiment of the leads 10, 12. 2, 2a... Container, 10, 12, 28, 30...
...Lead wire, 14...Capacitor element, B, B
1, B2,..., Bn...Solid electrolytic capacitor.

Claims (1)

[Claims] 1. A capacitor element is housed in a rectangular container with one side open, and a plurality of containers are arranged such that one side of the open side corresponds to the opposite side of the one side of the adjacent container. fixing the element by filling a synthetic resin into a container that is in contact with the container and is open on the one side of each container;
A method for manufacturing a solid electrolytic capacitor block, characterized in that coating and bonding between adjacent containers are performed together. 2. The container has an edge protruding from the upper surface around the bottom, and a notch is provided at one location in the edge of the container, and the tip of the first lead is inserted into the edge. A portion of the tip of the first lead is exposed in the notch, and the tip passes through a portion of the edge different from the buried portion of the first lead to the bottom surface. a second lead having an exposed portion; the capacitor element is housed in the container and has an anode portion and a cathode portion; the anode portion is connected to the exposed portion of the first lead; 2. The method of manufacturing a solid electrolytic capacitor block according to claim 1, wherein the cathode portion is connected to an exposed tip portion of the second lead.