JPH0257344B2 - - Google Patents

Description

Detailed Description of the Invention [Summary] The present invention provides a method for manufacturing a semiconductor wafer mounting device using an ultraviolet curable tape, in which the tape adhered to a frame is cut in a closed loop while applying ultraviolet rays to a portion to be peeled. This makes it easier to remove the remaining tape.

[Industrial application field]

The present invention relates to a method for manufacturing a semiconductor wafer mounter.

[Conventional technology]

Semiconductor devices are manufactured by scribing a semiconductor wafer, dividing it into a plurality of chips, picking up each chip, assembling it into a package, wire bonding it, and sealing it with resin.

A semiconductor wafer is scribed while being mounted on a semiconductor wafer mounter.

As one of the semiconductor wafer mounting devices, in order to make it easier to pick up chips, as shown in FIGS. It has a structure that has an adhesive layer 2b that hardens when exposed to UV tape (hereinafter referred to as UV tape).

The semiconductor wafer 3 is attached to the adhesive layer 2 of the UV tape 2.
b, and in this state is scribed with a full cut as shown in FIGS. 6 and 7, and is divided into a large number of chips 4. 5 is the depth of cut, UV
We've reached tape 2. After scribing, the base 2a side of the UV tape 2 is irradiated with ultraviolet rays to make it easy to peel off the chips 4.

The above semiconductor wafer mounting device adheres a band-shaped UV tape to the frame 1, cuts the UV tape in a circular shape on the frame 1 (6 is the cut line at this time), and leaves the remaining tape outside the cut line 6. It is manufactured by peeling off the (ineffective part) from the frame 1.

[Problem that the invention seeks to solve]

Here, in order to prevent the divided chips from scattering during the above-mentioned scribing, a UV tape with high adhesive strength is required. As the adhesive strength of the UV tape increases, it becomes more difficult to peel off the remaining tape, and a mechanism for clamping the frame on the table becomes necessary. Providing this mechanism would require significant modification of the current equipment for manufacturing semiconductor wafer mounters, which is undesirable and still leaves the problem of difficulty in peeling unresolved.

[Means for solving problems]

The present invention provides a method for manufacturing a semiconductor wafer mounter in which a substantially circular ultraviolet curable tape is stretched over a frame, and a semiconductor wafer to be scribed is mounted on the tape. The stretched belt-shaped ultraviolet curable tape was cut along the upper surface of the frame to form a closed loop cut line, and while cutting, the part to be peeled outside the cut line was irradiated with ultraviolet rays. It is something.

[Effect]

By irradiating ultraviolet rays, the portion to be peeled off becomes easier to peel off, making it easier to manufacture a semiconductor wafer mounter, and making it possible to use an ultraviolet curable tape that has a correspondingly high adhesive strength. Furthermore, since the ultraviolet irradiation is carried out in parallel with the cutting, there is no need to provide a separate ultraviolet irradiation process, and no additional process is required.

〔Example〕

1 and 2 are an elevational view and a schematic plan view, respectively, of a manufacturing apparatus to which an embodiment of the method for manufacturing a semiconductor wafer mounter according to the present invention is applied.

10 is an arm with a circular cutter 1 on one end.
A rubber roller 13 is supported on a shaft 14 at the other end, and an ultraviolet irradiation device 15, which is a main part of the present invention, is fixed to a holder 17 facing downward. be.

The arm 10 is rotatable about a line 17 (midpoint 18 in FIG. 2). Katsuta 1 from this center of rotation
1, distance L ₁ to rubber roller 13, distance L ₂ to rubber roller 13,
The distance L ₃ to the ultraviolet irradiation device 15 is determined to be approximately equal, and the relationship L ₂ <L ₁ <L ₃ holds.

Reference numeral 19 denotes an ultraviolet light source, which is fixed to the rotating table 20. This light source 19 and the irradiator 15 are connected through an optical fiber 21.

The rotary table 20 is rotated by a motor 22, and the arm 10 rotates integrally with the rotary table 20.

The above-mentioned arm 10, rotary table 20, etc. are indicated by arrow Z ₁ ,
Z It can be raised and lowered in _two directions, and is normally in the raised position.

The ultraviolet curable tape 23 is pulled out from the roll 24, and the release paper 25 is wound around the roll 26 midway through, exposing the adhesive layer 23b. is oriented so that the top side is the top surface.

In this state, the UV tape 23 is temporarily adhered to the surface 28a of the substantially annular frame 28 and stretched, and the frame 28 is placed at a predetermined position on the table 29.

Subsequently, the arm 10 etc. descends in the direction of arrow _Z1 ,
The cutter 11 and rubber roller 13 are connected to the frame surface 28
It comes into contact with the base 23a of the UV tape 23 on top a. The motor 22 starts and the arm 10 rotates more than 360 degrees in the direction of arrow A. Also, the light source 19 turns on, and the ultraviolet rays pass through the optical fiber 21 to the irradiator 1.
The UV tape 23 is irradiated with ultraviolet light in the form of an ultraviolet spot 31.

Due to the rotation of the arm 10, the rubber roller 13 first rolls while pressing the UV tape 23 against the frame surface 28a, drawing a circle in FIG. It is bonded even more firmly.

Second, the cutter 11 rolls on the frame surface 28a while cutting the UV tape 23, and draws a circular trajectory, which is a closed loop, as shown by the reference numeral 32 in FIG. Thereby, on the frame surface 28a, the UV tape 23 is cut at the outer part where it is firmly adhered by the rubber roller 13.
A score line 33 that coincides with the locus 32 is formed.

Thirdly, the ultraviolet spot 31 is located at the cut line 33.
The outer portion 34 of is scanned in a circular manner. this part 3
Reference numeral 4 indicates a portion to be peeled off, which is indicated by hatching in FIG. By scanning the ultraviolet spot 31,
The portion to be peeled 34 is irradiated with ultraviolet rays, the adhesive layer of this portion 34 is hardened, the adhesive force to the frame 28 is reduced, and the portion to be peeled is easily peeled off.

That is, the above-mentioned rotation of the arm 10 simultaneously forms the score line 33, strengthens the adhesion on the inner peripheral side of the score line 33, and reduces the adhesive force of the portion 34 scheduled to be peeled outside the score line 33. The semiconductor wafer mounting device can be manufactured more efficiently than in the case where each operation is performed in separate steps.

Incidentally, the force of the cutter 11 and the rubber roller 13 in the direction of arrow _Z1 in FIG. 1 is appropriately determined by the cylinder devices 35 and 36 that urge the arm 10 in the same direction, so that cutting and adhesion are performed satisfactorily.

After that, when the remaining tape 37 is wound up by the roll 36, the above-mentioned portion 34 to be peeled off is easily peeled off, leaving behind a circular UV tape 40, which will be described later. A wafer mounting device 39 is obtained. remaining tape 3
Since the tape 8 has an opening, it is easily cut, and if the remaining tape 38 is pulled too strongly when being wound up by the roll 35, it will break. No tensile force was applied to the extent that the remaining tape 38
is not cut.

The semiconductor wafer mounting device 39 has a frame 2
8 has a circular tape 40 stretched over it.
The circular UV tape 40 is firmly stretched by uniformly and firmly adhering the outer peripheral portion indicated by hatching over the entire circumference. 41 is this strongly adhesive part.

This semiconductor wafer mounter 39 is used in the same manner as shown in FIGS. 4 to 7.

〔Effect of the invention〕

According to the present invention, since ultraviolet rays are irradiated to the area scheduled for peeling outside the closed loop cut line formed on the band-shaped ultraviolet curable tape adhered to the frame, the adhesive strength of the area scheduled for peeling is reduced. The remaining tape can be peeled off from the frame without being pulled too hard, making it easy to manufacture semiconductor wafer mounting equipment, and using ultraviolet curing tape with high adhesive strength. Furthermore, since the ultraviolet irradiation is performed simultaneously with the formation of the score line, the semiconductor wafer mounting device can be manufactured without providing a separate ultraviolet irradiation step or increasing the number of steps.

[Brief explanation of drawings]

FIG. 1 is an elevational view of a manufacturing device to which a method for manufacturing a semiconductor wafer mounter device according to an embodiment of the present invention is applied, FIG. 2 is a plan view of the main parts in FIG. 1, and FIG. A diagram showing an example of a semiconductor wafer mounter manufactured by the manufacturing method of the invention, FIG. 4 is a plan view of a general semiconductor wafer mounter to which a semiconductor wafer is bonded, and FIG. 6 is a view showing the semiconductor wafer of FIG. 4 in a scribed state, and FIG. 7 is a sectional view taken along the line ``--'' in FIG. 6. In the figure, 10 is an arm, 11 is a cutter, 1
3 is a rubber roller, 15 is an ultraviolet irradiator, 19 is an ultraviolet light source, 20 is a rotary table, 21 is an optical fiber, 2
2 is the motor, 23 is the UV tape, 30 is the ultraviolet light,
31 is the UV spot, 33 is the cut line, 34 is the part to be peeled, 38 is the remaining tape, 40 is the circular UV
The tape 41 is a strongly adhesive part.

Claims (1)

[Scope of Claims] 1. A semiconductor wafer mounter 39 comprising a frame 1, 28 and a substantially circular ultraviolet curable tape 2, 40 stretched thereon, on which a semiconductor wafer 3 to be scribed is mounted. In the manufacturing method, the strip-shaped ultraviolet curable tape 23 that is glued and stretched over the frame 28 is cut along the upper surface of the frame to form a closed loop cut line 33.
At the same time, ultraviolet rays 3 are applied to the part to be peeled outside the cut line 33 while cutting.
1. A method for manufacturing a semiconductor wafer mounter, characterized in that irradiation is performed at 0.0,31.