JPH0258340U - - Google Patents
Info
- Publication number
- JPH0258340U JPH0258340U JP13740488U JP13740488U JPH0258340U JP H0258340 U JPH0258340 U JP H0258340U JP 13740488 U JP13740488 U JP 13740488U JP 13740488 U JP13740488 U JP 13740488U JP H0258340 U JPH0258340 U JP H0258340U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- sealing resin
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来の樹脂封止半導体集積回路の縦断面図であ
る。
１……エポキシ樹脂、２……高密着性・軟質性
樹脂、３……リードフレーム端子部、４……リー
ドフレームアイランド部、５……チツプ、６……
ボンデイングワイヤ。
FIG. 1 is a vertical cross-sectional view of an embodiment of the present invention, and FIG. 2 is a vertical cross-sectional view of a conventional resin-sealed semiconductor integrated circuit. 1... Epoxy resin, 2... Highly adhesive/soft resin, 3... Lead frame terminal section, 4... Lead frame island section, 5... Chip, 6...
bonding wire.
Claims (1)
おいて、封止樹脂内に封止されるリードフレーム
、チツプ、ボンデイングワイヤを封止樹脂よりも
硬度が低く密着性の高い樹脂で覆うように形成し
たことを特徴とする樹脂封止半導体集積回路。 In a semiconductor integrated circuit sealed with a sealing resin, the lead frame, chip, and bonding wire sealed in the sealing resin are formed so as to be covered with a resin that is less hard and highly adhesive than the sealing resin. A resin-sealed semiconductor integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740488U JPH0258340U (en) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740488U JPH0258340U (en) | 1988-10-20 | 1988-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258340U true JPH0258340U (en) | 1990-04-26 |
Family
ID=31398796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13740488U Pending JPH0258340U (en) | 1988-10-20 | 1988-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258340U (en) |
-
1988
- 1988-10-20 JP JP13740488U patent/JPH0258340U/ja active Pending
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