JPH0258365U - - Google Patents
Info
- Publication number
- JPH0258365U JPH0258365U JP13668088U JP13668088U JPH0258365U JP H0258365 U JPH0258365 U JP H0258365U JP 13668088 U JP13668088 U JP 13668088U JP 13668088 U JP13668088 U JP 13668088U JP H0258365 U JPH0258365 U JP H0258365U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- positioning
- circuit board
- printed circuit
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係る位置決めパツ
ドを配置したプリント基板の平面図、第２図は第
１図のＡ―Ａ断面図、第３図は従来のパツドを搭
載したプリント基板の断面図である。
１：プリント基板、２：パツド、３：ソルダー
レジスト、４：位置決めパツド。
Fig. 1 is a plan view of a printed circuit board on which positioning pads according to an embodiment of the present invention are arranged, Fig. 2 is a sectional view taken along line AA in Fig. 1, and Fig. 3 is a plan view of a printed circuit board on which a conventional pad is mounted. FIG. 1: Printed circuit board, 2: Pad, 3: Solder resist, 4: Positioning pad.
Claims (1)
配置したプリント基板において、前記パツドの高
さよりも高い複数個の位置決めパツドを配置した
ことを特徴とする位置決めパツド付プリント基板
。 1. A printed circuit board with positioning pads on which pads for mounting leaded surface mount components are arranged, characterized in that a plurality of positioning pads higher than the height of the pads are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13668088U JPH0258365U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13668088U JPH0258365U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258365U true JPH0258365U (en) | 1990-04-26 |
Family
ID=31397414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13668088U Pending JPH0258365U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258365U (en) |
-
1988
- 1988-10-21 JP JP13668088U patent/JPH0258365U/ja active Pending