JPH0258370U - - Google Patents
Info
- Publication number
- JPH0258370U JPH0258370U JP13760188U JP13760188U JPH0258370U JP H0258370 U JPH0258370 U JP H0258370U JP 13760188 U JP13760188 U JP 13760188U JP 13760188 U JP13760188 U JP 13760188U JP H0258370 U JPH0258370 U JP H0258370U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pad portion
- solder
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000006071 cream Substances 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案の構成を示す断面図、第２図
及び第３図は、本考案の実施例を示す断面図であ
る。
１……プリント基板、２……半田パツド部、３
……クリーム半田部、４……保護シート、５……
面実装部品。
FIG. 1 is a cross-sectional view showing the structure of the present invention, and FIGS. 2 and 3 are cross-sectional views showing an embodiment of the present invention. 1...Printed circuit board, 2...Solder pad part, 3
...Cream solder part, 4...Protection sheet, 5...
Surface mount parts.
Claims (1)
予めクリーム半田を塗布したプリント基板におけ
る面実装半田パツド部と該半田パツド部に塗布し
たクリーム半田の成分蒸発を防止する着脱自在の
保護用シートを貼布して成ることを特徴とするプ
リント基板。 In printed circuit boards on which surface-mounted components are mounted,
A printed circuit board comprising a surface mount solder pad portion of the printed circuit board to which cream solder has been applied in advance, and a removable protective sheet for preventing component evaporation of the cream solder applied to the solder pad portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13760188U JPH0258370U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13760188U JPH0258370U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258370U true JPH0258370U (en) | 1990-04-26 |
Family
ID=31399170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13760188U Pending JPH0258370U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258370U (en) |
-
1988
- 1988-10-21 JP JP13760188U patent/JPH0258370U/ja active Pending