JPH0258515A - Phenolic resin composition for laminated board - Google Patents
Phenolic resin composition for laminated boardInfo
- Publication number
- JPH0258515A JPH0258515A JP21145088A JP21145088A JPH0258515A JP H0258515 A JPH0258515 A JP H0258515A JP 21145088 A JP21145088 A JP 21145088A JP 21145088 A JP21145088 A JP 21145088A JP H0258515 A JPH0258515 A JP H0258515A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- brominated epoxy
- aminophenol
- resin
- phenols
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title abstract description 17
- 239000000203 mixture Substances 0.000 title abstract description 16
- 229920001568 phenolic resin Polymers 0.000 title abstract description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 19
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 16
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 150000002989 phenols Chemical class 0.000 claims abstract description 14
- 150000002118 epoxides Chemical group 0.000 claims abstract description 5
- 125000003277 amino group Chemical group 0.000 claims abstract description 4
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 2
- 150000001299 aldehydes Chemical class 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- 229920003987 resole Polymers 0.000 abstract description 6
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 abstract 2
- -1 formalin Chemical class 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical group NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 7
- 229920000877 Melamine resin Polymers 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- VIHUMJGEWQPWOT-UHFFFAOYSA-N 1,2,3-tribromo-4-(3-bromophenoxy)benzene Chemical compound BrC1=CC=CC(OC=2C(=C(Br)C(Br)=CC=2)Br)=C1 VIHUMJGEWQPWOT-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- DBMWNANFZQEHDV-UHFFFAOYSA-N 1-aminocyclohexa-2,4-dien-1-ol Chemical compound NC1(O)CC=CC=C1 DBMWNANFZQEHDV-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐熱性、寸法安定性、打抜加工性に優れると
ともに、反りの少ない積層板を製造するためのフェノー
ル樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a phenolic resin composition for producing a laminate that has excellent heat resistance, dimensional stability, and punching workability, and is less warped.
（従来の技術）
近年、プリント配線板に関する技術動向は、軽薄短小化
の一途をたどり、部品の実装方式においても急速な変化
が見られる。 すなわち、従来は、プリント配線板に穴
明は加工を行い、そこにリード付部品を挿入後、リード
とプリント基板を半田付けして固定する方法が大半であ
ったが、現在は小型化のために、プリント配線板にリー
ドレスの部品を装着し、リフロー半田を行う表面実装方
式へと変わりつつある。 この表面実装に使用されるプ
リント基板は一部に紙（基板）・フェノール（樹脂）プ
リント基板が用いられているものの、はとんどにガラス
・エポキシプリント基板が使用されている。 紙・フェ
ノールプリント基板が使用されない理由は、ガラス・エ
ポキシプリント基板に比べて耐熱性が低く、反り、寸法
安定性が悪いという欠点を持っているなめである。(Prior Art) In recent years, technological trends regarding printed wiring boards have continued to make them lighter, thinner, shorter, and smaller, and rapid changes have also been seen in component mounting methods. In other words, in the past, most of the methods involved drilling holes in the printed wiring board, inserting components with leads into them, and then soldering the leads and the printed circuit board to fix them, but now due to miniaturization, In recent years, there has been a shift towards surface mount methods, in which leadless components are attached to printed wiring boards and reflow soldering is performed. Some of the printed circuit boards used for surface mounting are paper (substrate) and phenol (resin) printed circuit boards, but most are glass and epoxy printed circuit boards. The reason paper/phenol printed circuit boards are not used is that they have the disadvantages of lower heat resistance, warpage, and poor dimensional stability than glass/epoxy printed circuit boards.
一方、紙・フェノールプリント基板はリン酸エステル類
、臭素化合物等の難燃剤を添加した樹脂、あるいは油変
性樹脂等の打抜加工性のよい樹脂を用いているために、
耐熱性が低いという欠点があった。 これら龍燃性・打
抜加工性と耐熱性の特性は互いに相反するものがあり、
これらの緒特性を満たす紙・フェノールプリント基板を
得ることは大変困難であった。On the other hand, paper/phenol printed circuit boards use resins containing flame retardants such as phosphate esters and bromine compounds, or resins with good die-cutting properties such as oil-modified resins.
It had the disadvantage of low heat resistance. These characteristics of retardancy, punching workability, and heat resistance are contradictory to each other.
It has been extremely difficult to obtain paper/phenol printed circuit boards that satisfy these characteristics.
（発明が解決しようとする課題）
本発明は、上記の欠点を解消するためになされたもので
、耐熱性、寸法安定性、打抜加工性に優れた、反りの少
ない紙・フェノールプリント基板が得られる積層板用フ
ェノール樹脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention was made to solve the above-mentioned drawbacks, and provides a paper/phenol printed circuit board with excellent heat resistance, dimensional stability, punching workability, and less warping. The object of the present invention is to provide a phenolic resin composition for laminates.
［発明の構成］
（課題を解決するための手段）
本発明者等は、上記の目的を達成しようと鋭意研究を重
ねた結果、臭素化エポキシ樹脂とアミノフェノールとの
反応生成物をレゾール骨格に導入すれば上記の目的を達
成することができることを見いだし、本発明を完成した
ものである。 すなわち、本発明は、
フェノール類とアルデヒドとの縮合により得られる重合
体を主体とする積層板用のレゾール型フェノール樹脂に
おいて、上記フェノール類の一部又は全部が、（ａ ）
臭素化エポキシ樹脂と、（ｂ ）アミノフェノールとを
反応させて、（ａ）成分のエポキシドに（ｂ ）成分の
アミノ基を付加した反応生成物であることを特徴とする
積層板用フェノール樹脂組成物である。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive research aimed at achieving the above object, the present inventors have developed a resol skeleton using a reaction product of a brominated epoxy resin and an aminophenol. The present invention has been completed based on the discovery that the above object can be achieved by introducing the above-mentioned method. That is, the present invention provides a resol type phenolic resin for laminates that is mainly composed of a polymer obtained by condensation of phenols and aldehydes, in which some or all of the phenols are (a)
A phenol resin composition for a laminate, characterized in that it is a reaction product obtained by reacting a brominated epoxy resin with (b) an aminophenol to add an amino group (b) to the epoxide (a). It is a thing.
本発明で用いる（ａ ）臭素化エポキシ樹脂と（ｂ ）
アミノフェノールとの反応生成物と、それをフェノール
樹脂の骨格に導入したレゾール型フェノール樹脂は次の
ようにして得られる。(a) Brominated epoxy resin used in the present invention and (b)
A reaction product with aminophenol and a resol type phenol resin in which the reaction product is introduced into the skeleton of a phenol resin can be obtained as follows.
（ａ）
（ｂ）
まず（ａ ）臭素化エポキシ樹脂（両末端のエポキシド
部分のみを示す）と（ｂ ）アミノフェノールとを反応
させて、臭素化エポキシ樹脂の両末端エポキシドにアミ
ノフェノールを導入し反応生成物（１）をつくる、 次
いで、この反応生成物（Ｉ）には、単独に又は池のフェ
ノール類とともに、ホルマリンなどのアルデヒドおよび
トリメチルアミノなどのレゾール触媒を加え反応させて
、レゾール型フェノール樹脂（ｎ）をつくる、 この反
応生成物〈１）を導入したフェノール樹脂（ＩＩ）には
、それが導入されないフェノール樹脂を、混合若しくは
共縮合させて、共用することができる。 またフェノー
ル樹脂（ｆｆ）にはメラミンなどによる変性をすること
ができる。(a) (b) First, (a) brominated epoxy resin (only the epoxide portions at both ends are shown) and (b) aminophenol are reacted to introduce aminophenol into the epoxides at both ends of the brominated epoxy resin. A reaction product (1) is produced.Next, an aldehyde such as formalin and a resol catalyst such as trimethylamino are added to the reaction product (I) alone or together with phenols to react to produce a resol type phenol. The phenol resin (II) into which the reaction product <1) has been introduced to produce the resin (n) can be mixed or co-condensed with a phenol resin into which the reaction product <1) has not been introduced. Furthermore, the phenol resin (ff) can be modified with melamine or the like.
ここで用いる（ａ ）臭素化エポキシ樹脂は、次の構造
式で例示されるものである。The brominated epoxy resin (a) used here is exemplified by the following structural formula.
市販されている具体的なものとしては、例えばＹＤＢ−
４００ＥＫ−６０＜東部１ヒ成社製、商品名）、アラル
ダイトＸＡＣ−５０１９Ｎ−７５（チバガイギー社製、
商品名）等が挙げられ、これらは単独又は２種以上混合
して使用する。 臭素化エポキシ樹脂の配合割合は、組
成物全体の固脂フェノール成分に対して２０〜４０重量
％含有することが望ましい、 この割合が２０重量％未
満では十分な耐熱性、難燃性が得られず、また４０重量
％を超えると電気特性が低下し好ましくない。Specific commercially available products include, for example, YDB-
400EK-60<manufactured by Tobu 1 Hiusei Co., Ltd., trade name), Araldite
(trade name), and these may be used alone or in combination of two or more. The blending ratio of the brominated epoxy resin is preferably 20 to 40% by weight based on the solid phenol component of the entire composition. If this ratio is less than 20% by weight, sufficient heat resistance and flame retardance cannot be obtained. On the other hand, if it exceeds 40% by weight, the electrical properties will deteriorate, which is not preferable.
また、（ｂ ）アミノフェノールとしては、０−アミノ
フェノール、１−アミノフェノール、ｐ−アミノフェノ
ール等が挙げられ、これらは単独又は２種以上混合して
使用する。 アミノフェノールの配き割合は、臭素化エ
ポキシ樹脂のエポキシ当量に対して １．１モル〜１．
５モルであることが望ましい。Further, (b) aminophenol includes 0-aminophenol, 1-aminophenol, p-aminophenol, etc., and these may be used alone or in combination of two or more. The distribution ratio of aminophenol is 1.1 mol to 1.1 mol to the epoxy equivalent of the brominated epoxy resin.
It is desirable that the amount is 5 moles.
配合割合か１４１モル未満では臭素化エポキシ樹脂と十
分反応することができず一耐熱性が低下し好ましくない
、 また、１．５モルを超えるとアミノフェノールが過
剰となり、未反応成分が池の特性に悪影響をおよぼし好
ましくない。If the blending ratio is less than 141 moles, it will not be able to react sufficiently with the brominated epoxy resin, resulting in a decrease in heat resistance, which is undesirable.If it exceeds 1.5 moles, the aminophenol will be excessive, and the unreacted components will deteriorate the properties of the pond. It is undesirable because it has a negative effect on
本発明に共用されるフェノール樹脂としては、フェノー
ル類とホルムアルデヒド類とを反応させてなるもので、
また、これらの変性樹脂、例えばメラミン変性のフェノ
ール樹脂等が挙げられる。The phenolic resin commonly used in the present invention is one made by reacting phenols and formaldehydes,
Further, examples of modified resins include melamine-modified phenol resins and the like.
これらは単独又は２種以上混合して１！！！用すること
ができる。 フェノール類としては５フエノール２クレ
ゾール、キシレノール、ブチルフェノール、ノニルフェ
ノール等が挙げられ、通常積層板用として使用されるす
べてのフェノールが包含される。These can be used alone or in combination of two or more! ! ! can be used. Examples of phenols include 5-phenol, 2-cresol, xylenol, butylphenol, nonylphenol, and all phenols commonly used for laminated boards.
これらのフェノール類は単独又は２種以上混合して使用
する。 アルデヒド類としては、ホルマリン、バラホル
ムアルデヒド、アセトアルデヒド等が挙げられ、これら
は単独もしくは２種以上混合して使用する。 またフェ
ノール樹脂の変性用として例えばメラミン等が使用され
、このメラミンとしては、メラミン、ベンゾグアナミン
、アセトグアナミン、ホルムグアナミン等が挙げられ、
これらは単独又は２種以上混合して使用する。These phenols may be used alone or in a mixture of two or more. Examples of aldehydes include formalin, formaldehyde, acetaldehyde, etc., and these may be used alone or in combination of two or more. In addition, for example, melamine is used for modifying phenolic resins, and examples of the melamine include melamine, benzoguanamine, acetoguanamine, and formguanamine.
These may be used alone or in combination of two or more.
本発明の積層板用フェノール樹脂組成物には、本発明の
目的に反しない限度において、例えば難燃剤、充填剤等
、曲の成分を添加前きすることができる。The phenolic resin composition for laminates of the present invention may be pre-added with composition components, such as flame retardants and fillers, within limits that do not contradict the purpose of the present invention.
（作用）
フェノールのレゾール骨格中に、リニアでがっ■（熱性
のよい臭素化エポキシ樹脂とアミノフェノールとの反応
生成物を導入したことによって、耐熱性、寸法安定性を
向上させ、フェノール樹脂が有する優れた打抜加工性を
損なうことなく、反りの少ない樹脂組成物を得ることが
できる。(Function) By introducing a reaction product of a brominated epoxy resin with good heat resistance and aminophenol into the resol skeleton of phenol, the heat resistance and dimensional stability are improved, and the phenol resin A resin composition with less warpage can be obtained without impairing the excellent punching workability.
（実施例） 次に本発明を実施例によって具体的に説明する。(Example) Next, the present invention will be specifically explained using examples.
実施例 １
コンデンサー付き四つロフラスコに、臭素化エポキシ樹
脂ＹＤＢ−＝１００ＥＫ−６０（東部化成社製、商品名
） １３０（］、アミノフェノール３０ｇおよび１〜リ
工チルアミノ２ｇを加え、２時間還流反応させて反応生
成物を得た。 次に、この反応生成物に、フェノール１
００ｇ、３７％ホルマリン１３０９およびジメチルアミ
ノ５ｇを加えて、２時間還流反応させた後、減圧脱水し
てトルエン：メタノール−１：１の混合溶剤で希釈し、
これにトリフェニルホスフェ ）８Ｈを加えて、樹脂固
形分６０重量％、粘度２，３ポアズ（２５℃）、ゲル化
時間５分２０秒（１５０℃）のフェス（Ａ）を調製した
。Example 1 Brominated epoxy resin YDB-=100EK-60 (manufactured by Tobu Kasei Co., Ltd., trade name) 130 (], 30 g of aminophenol, and 2 g of 1-reproduced tylamino were added to a four-bottle flask equipped with a condenser, and the mixture was refluxed for 2 hours. A reaction product was obtained.Next, phenol 1 was added to this reaction product.
00g, 37% formalin 1309 and dimethylamino 5g were added and reacted under reflux for 2 hours, then dehydrated under reduced pressure and diluted with a mixed solvent of toluene:methanol-1:1.
To this, triphenylphosphene) 8H was added to prepare a face (A) having a resin solid content of 60% by weight, a viscosity of 2.3 poise (25°C), and a gelation time of 5 minutes and 20 seconds (150°C).
実施例 ２
コンデンサー付き四つロフラス：Ｉに臭素化エポキシ樹
脂ＹＤＢ−４００ＥＫ−６０（前出） １３０ｇ、アミ
ノフェノール３０すおよびトリエチルアミノ２ｇを加え
、２時間還流反応させて反応生成物を得た。Example 2 130 g of brominated epoxy resin YDB-400EK-60 (mentioned above), 30 g of aminophenol and 2 g of triethylamino were added to a four-loaf flask with a condenser, and the mixture was refluxed for 2 hours to obtain a reaction product.
次に、この反応生成物に、メラミン７０ｇ、フェノール
９０にｌ 、３７％ホルマリン１３０ｇおよびジメチル
アミノ５りを加えて、２時間還流反応させた後、減圧脱
水してトルエン：メタノール−１，１の混合溶剤で希釈
し、これに１〜リフエニルホスフエート４０りを加えて
、樹脂固形分６０重量％、粘度２．５ポアズ（２５°Ｃ
）、ゲル化時間４分４（１（＋５０°Ｃ）のフェス（Ｂ
）を調製した。Next, to this reaction product were added 70 g of melamine, 90 l of phenol, 130 g of 37% formalin and 5 l of dimethylamino, and after refluxing for 2 hours, dehydration was carried out under reduced pressure and a mixture of toluene:methanol-1,1 was added. Dilute with a mixed solvent and add 1 to 40 g of rifenyl phosphate to give a resin solid content of 60% by weight and a viscosity of 2.5 poise (at 25°C).
), gelation time 4 minutes 4 (1 (+50 °C) festival (B
) was prepared.
比較例 １
コンデンサー１すき四つ目フラスコに、フェノール２０
０ｇ、桐油１００ｇおよびパラトルエンスルホン酸０．
３ｇを仕込み、 １００°Ｃで１時１ｍ反応すせりｔｉ
ｔ、４０％アンモニア水で中和した。 次に、ベンゾグ
アナミン２５０ｇ、フェノール１２０ｇ、３７％ホルマ
リン４６０ｇおよびジメチルアミノ５ｇを加え、 ２時
間還流反応させた後、減圧脱水してトルエン：メタノー
ル＝１＝１の混合溶剤で希釈し、これにトリフェニルホ
スフェート３４１ｇおよびテトラブロモジフェニルエー
テル１００ｇを加えて、樹脂固形分５５重量％、粘度１
８ポアズ（２５°Ｃｍゲル化時間６分３０秒（１５０″
Ｃ）のワニス（Ｃ）を調製した。Comparative Example 1 Phenol 20 in the fourth flask with 1 condenser
0 g, 100 g of tung oil and 0.0 g of para-toluenesulfonic acid.
Prepare 3 g and react at 100°C for 1 hour and 1 m.
t, neutralized with 40% aqueous ammonia. Next, 250 g of benzoguanamine, 120 g of phenol, 460 g of 37% formalin, and 5 g of dimethylamino were added, and the mixture was refluxed for 2 hours, dehydrated under reduced pressure, diluted with a mixed solvent of toluene:methanol=1=1, and triphenyl Add 341 g of phosphate and 100 g of tetrabromodiphenyl ether to give a resin solids content of 55% by weight and a viscosity of 1.
8 poise (25°Cm) Gelation time 6 minutes 30 seconds (150″
Varnish (C) of C) was prepared.
比較例 ２
コンデンサー付き四つロフラスコに、メラミン１００ｇ
、フェノール２５０９．３７９・≦ボルフ９フ３５０ｇ
およびジメチルアミノ４９を加えて、２時間還流反応さ
せた後、減圧脱水してトルエン：メタノール＝１：１の
混合溶剤で希釈し、これにトリフェニルホスフェート３
４１すおよび臭素化エポキシ樹脂ＹＤ８４００ＥＫ−６
０１３０ｇを加えて、樹脂固形分５５重藍０６、粘度２
．０ポアズ（２５°Ｃ）、ゲル化時間５分４０秒（１５
０’Ｃ）のワニス（Ｄ ）を調製した。Comparative example 2 100g of melamine in a four-bottle flask with a condenser
, Phenol 2509.379・≦Bolf 9f 350g
After adding dimethylamino 49 and refluxing for 2 hours, it was dehydrated under reduced pressure and diluted with a mixed solvent of toluene:methanol=1:1.
41su and brominated epoxy resin YD8400EK-6
Add 0130g, resin solid content 55 heavy indigo 06, viscosity 2
．． 0 poise (25°C), gelation time 5 minutes 40 seconds (15
0'C) varnish (D) was prepared.
実施例１〜２および比較例１〜２で調製したワニス（Ａ
）〜（Ｄ）を、１０ミルスのクラフト紙に塗布含浸し
、樹脂固形分５０重量０≦、レンジフロー８２６のプリ
プレグを作った。 このプリプレグ８枚の両側に接着剤
付５Ａ箔を重ね合わせ、１７０°Ｃ１１００ｋＱ／ｃｎ
’の条件で７５分間加熱加圧一体に成形して、厚さ １
．６１１のプリント基板を製造した。Varnishes prepared in Examples 1-2 and Comparative Examples 1-2 (A
) to (D) were coated and impregnated on 10 mils kraft paper to produce a prepreg with a resin solid content of 50 weight 0≦ and a microwave flow of 826. Layer 5A foil with adhesive on both sides of these 8 sheets of prepreg, 170°C 1100kQ/cn
It was molded into one piece under heat and pressure for 75 minutes under the conditions of ', and the thickness was 1.
．． 611 printed circuit boards were manufactured.
この基板について諸試験を行って結果を得たので第１表
に示したが、本発明はいずれの特性においても優れてお
り、その効果を確認することができ［発明の効果１
以上の説明および第１表から明らかなように、本発明の
積層板用フェノール樹脂組成物は、耐熱性、寸法安定性
、打抜加工性に優れ、反りの少ない、難撚性のものであ
り、表面実装等に十分耐え得るものである。Various tests were conducted on this board and the results are shown in Table 1. The present invention is excellent in all characteristics, and its effects can be confirmed [Effects of the Invention 1 The above explanation and As is clear from Table 1, the phenolic resin composition for laminates of the present invention has excellent heat resistance, dimensional stability, and punching workability, has little warpage, is difficult to twist, and is suitable for surface mounting, etc. It is sufficiently durable.
Claims (1)
重合体を主体とする積層板用のレゾール型フェノール樹
脂において、上記フェノール類の一部又は全部が、 （ａ）臭素化エポキシ樹脂と、 （ｂ）アミノフェノールとを反応させて、 （ａ）成分のエポキシドに（ｂ）成分のアミノ基を付加
した反応生成物であることを特徴とする積層板用フェノ
ール樹脂組成物。[Scope of Claims] 1. A resol-type phenolic resin for laminates that is mainly composed of a polymer obtained by condensation of phenols and aldehydes, in which some or all of the phenols are (a) a brominated epoxy resin; and (b) aminophenol, and is a reaction product obtained by adding an amino group (b) to an epoxide (a) and an amino group (b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21145088A JPH0258515A (en) | 1988-08-25 | 1988-08-25 | Phenolic resin composition for laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21145088A JPH0258515A (en) | 1988-08-25 | 1988-08-25 | Phenolic resin composition for laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258515A true JPH0258515A (en) | 1990-02-27 |
Family
ID=16606152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21145088A Pending JPH0258515A (en) | 1988-08-25 | 1988-08-25 | Phenolic resin composition for laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258515A (en) |
-
1988
- 1988-08-25 JP JP21145088A patent/JPH0258515A/en active Pending
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