JPH0258529A - Active energy ray-curable composition and bonding of optical disc substrate to hub using said composition - Google Patents

Abstract

PURPOSE:To provide the title composition curable in a short time by active energy ray irradiation, giving excellent initial adhesivity and moisture-resistant adhesivity, comprising an epoxy resin, sulfonium salt, (meth)acrylate, organic peroxide and rubber component. CONSTITUTION:The objective composition comprising (A) an epoxy resin (pref. bisphenol A glycidyl ether-based epoxy resin), (B) a compound selected from sulfonium salts (pref. triphenyl sulfonium salts) and cyclopentadienyl iron compound (pref. a compound of the formula) (C) a compound selected from (meth) acrylates and their oligomers, (D) an organic peroxide (e.g., benzoyl peroxide), and (E) a rubber component (pref. styrene-isoprene copolymer). Using this composition, an optical disc substrate (pref. consisting of a copolymer from ethylene and a cyclic olefin) is bonded to a hub (pref. metallic).

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an active energy beam-curable composition and a method of bonding an optical disk substrate to a hub using this composition. The present invention relates to an active energy beam-curable composition that can be used as an adhesive between a disk substrate and a hub during manufacturing, and a method of bonding a disk substrate and a hub using this composition.

Technical Background and Problems Various active energy beam-curable epoxy resin compositions have been known. These active energy beam-curable epoxy fat compositions exhibit adhesive properties to pond members, and have the property of curing when irradiated with active energy beams.

Attempts have been made to take advantage of these properties and use these active energy beam-curable epoxy resin compositions as adhesives. However, many of these resin compositions have problems in that they have poor adhesion to other members in the initial stage of curing even when irradiated with activated A.L. rays, and that the curing time is relatively long. Therefore, when these active energy beam-curable epoxy resin compositions are used as an adhesive between the disk substrate and the hub that constitute the optical disk, for example, when manufacturing an optical disk, it takes a long time for the resin composition to harden. If the optical disc is
The problem is that it cannot be created. Furthermore, many of these active energy ray-curable compositions have a problem in that they are also inferior in moisture-resistant adhesive properties.

Purpose of the Invention The present invention is intended to solve the problems associated with the prior art as described above, and is capable of being cured extremely quickly by irradiation with active energy rays, and having excellent moisture-resistant adhesive properties and adhesive properties in the initial stage of curing. An object of the present invention is to provide an active energy beam-curable composition with excellent properties and a method of bonding an optical disk substrate and a hub using this composition.

The active energy light curable composition according to the present invention comprises (A) an epoxy resin, (B) a compound carried from the group consisting of a sulfonium salt and a cyclopentadienyl iron compound, (C) an acrylate, a methane It is characterized by containing a compound selected from the group consisting of acrylates and oligomers thereof, (DJ organic peroxide), and (E) a rubber component.

Since the active energy beam-curable composition according to the present invention has the above-mentioned characteristics, it can be cured extremely rapidly by irradiation with active energy beams, and
Excellent wet adhesion and early curing adhesion.

The present invention also provides a method for bonding an optical disk substrate and a hub using the active energy beam-curable composition as described above.

Hereinafter, the active energy light-curable composition according to the present invention (
Hereinafter, the "composition J" will be specifically explained.

The epoxy resin (A) contained in the active energy light-curable composition of the present invention may contain, for example, 2@
Of course, compounds containing the above epoxy groups are preferred, and aliphatic or alicyclic epoxy compounds containing 2 or more epoxy groups in one molecule are particularly preferred.

Specifically, such epoxy resin (A) includes:
Bisphenol A, bisphenol F, 1, i, 2.
Glycidyl ether-based epoxy resins of polyphenol neck compounds such as 2-detrakis(4′-hydroxyphenyl)ethane; catechol, resorcinol, hydroquinone,
Glycidyl ether-based epoxy resins containing polyhydric phenols such as phloroglucin; Glycidyl ether-based epoxy resins containing polyhydric alcohols such as ethylene glycol, butanediol, chrycerol, erythritol, and polyoxyalkylene glycol; Novolac-type epoxy resins; Vinyl cyclohexene dioxide , cycloaliphatic epoxy resins such as limonene dioxide and dicyclopentadiene dioxide: phthalic acid, cyclohexane-1,2-
Examples include polyglycidyl ester-based epoxy resins of ester condensates of polycarboxylic acids such as dicarboxylic acids: voricricidylamine-based epoxy resins. Among these epoxy resins, glycidyl ether-based epoxy resins of polyphenol compounds or novolak-type epoxy resins are preferred, and glycidyl ether-based epoxy resins of bisphenol A or bisphenol F are more preferred, and among these, glycidyl ether-based epoxy resins of bisphenol A are particularly preferred. is particularly preferred.

In addition, the active energy ray-curable composition of the present invention includes:
Sulfonium salts or cyclopentadienyl iron compounds (
B) is contained.

Such sulfonium salts are preferably triarylsulfonium salts, particularly triphenylsulfonium salts. As the anion of this sulfonium salt, for example, AsF3- or BF4 is preferable.

Specifically, such sulfonium salts include triphenylsulfonium salt tri(4-methylphenyl)sulfonium salt tri(
4-methoxyphenyl)sulfonium salt is used.

In addition, cyclopentadienyl iron compounds include compounds containing two cyclopentagenyl groups in the molecule, or one cyclopentagenyl group and one phenyl-like compound such as isopropylphenyl. A compound containing an aromatic group is used. Among these, the latter compound is more preferred, and furthermore, a cyclopentadienyl iron compound as shown below having a cyclopentadienyl group and an inglobylphenyl group is particularly preferred.

Such sulfonium salts and cyclopentadienyl iron compounds can be used alone, or both can be used in combination.

Component (C) contained in the active energy light-curable composition of the present invention is selected from the group consisting of acrylates, methacrylates, and oligomers thereof.

As such acrylates and methacrylates, esters of hydroxy compounds or di or more polyhydroxy compounds and acrylic acid or methacrylic acid are used. Such esters include, for example, aliphatic alcohols having 1 to 20 carbon atoms;
~3o alicyclic alcohol, C1-20 divalent aliphatic alcohol, C1-20 divalent alicyclic alcohol, C1-20 trivalent aliphatic alcohol, hydroxyl terminal Examples include esters of hydroxy compounds such as polyesters, and acrylic acid or methacrylic acid.

Specifically, the following compounds are used as such esters.

Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butylene methacrylate, cyclohexyl acrylate, norbornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, inbornyl acrylate, cyclohexyl methacrylate , 3; 6 10.13 Hexacyclo[6,6,1,1,12,79,
14 0,0]heptadecyl-4-acrylate, 11.18
13.16 o3.8 , o12.17 ] tocosyl-5- 3,610,13 12-methylhexacyclo[6,6,1,1,102,
7,9°14]heptadecyl-4-acrylate, 3,
f3 10.13 11-methylhexacyclo[6,6,1,1,1o2.
7, o9.14] heptadecyl-4-acrylate 3
．． 6 10.13 12-ethylhexacyclo[6,6,1,1,102,
7,9°14]heptadecyl-4-acrylate, 3.
6 10.13 11-ethyl hexacyclo[6,6,1,1,102°
709°14] heptadecyl-4-naacrylate, 2.
9 4.7 Octacyclo [8, 8, 0, 1, 1, 11,
1813, 163, 812, 17 Kodoyoshi, 15-i,
Q, 0 acrylate, 2.5 7.10 2.7-dimethyltetracyclo[4,4,0,1,,1
]]Dodecyl-3-acrylate 210-dimethyltetracyclo[4,4,0,1”17
, 101 dodecyl-3-acrylate, 1112-dimethyltetracyclo[4,4,0,12゛5.17.10
] Dodecyl-3-acrylate, 2.5 7.10 Tetracyclo[4,4,0,1,1]]dodecyl-3-acrylate acrylate shown below 2.5 7.10 9-substituted tetracycloC4,4,0 , 1, 1]] dodecyl-3-acrylate The substituent at position 9 in the formula is methyl, ethyl, propyl, isobutyl, hexyl, cyclohexyl, stearyl, bromo, full 2.5 7.10), 8-substituted tetracyclo[ 4,4,0,1j
[ 4,4,0,1,1] ] dodecyl-3-acrylate The substituents at the 8th and 9th positions are methyl, ethyl, propyl, isobutyl, hexyl, cyclohexyl, stearyl, bromo or fluoro), 3.6 10.13
2.7 Hexacyclo[6,6,1,1,1,0,09°14cohebutadecyl-4-methacrylate, 3.6 10.
13 12-methylhexacyclo[6,6,1,1,102°
709°14] heptadecyl-4-methacrylate, 3
．． 6 10.13 11-methylhexacyclo[6,6,1,1,1102
°7.9.14. heptadecyl-4-methacrylate,
3.6 10.13 12-ethylhexacyclo[6,6,1,1,1,02
°7,09°14]hegetadecyl-4-methacrylate, 3.6 10.13 11-ethylhexacyclo[6,6,1,1,102,
7,9,14]heptadecyl-4-methacrylate, 2
．． 9 4.7 11.18 Octacyclo [8, 8, 0, 1, 1, 113, 163,
812°17] tocosyl-5-methacrylate, i
,0. 0 rate, 2.9 4.7 15-methyloctacyclo[8,8,0,1,1111
・18. 13"16.3.8.012°17] tocosyl-5-methacrylate, 2.5 7.10°2.7-dimethyltetracyclo[4,4,0,1,I
.

Dodecyl-3-methacryle-1., 2.5 7.10 210-dimethyltetracyclo[, l, 4,0,1
．． 1]] Dodecyl-3-methacrylate 2.5 7.10 1112-dimethyltetracyclo[4,4,0,1,1
]]Dodecyl-3-methacrylate 2.5 7.10 Tetracyclo(4,4,0,1,1]]Dodecyl-3-
Methacrylate 1. 2.57.10 9-substituted tetracyclo[4,4,0,1,1]]dodecyl-3-acrylate The substituent at position 9 in the formula is methyl, ethyl, propyl, isobutyl, hexyl, cyclohexyl, stearyl, bromo or fluoro 2.5 7.10 8-substituted tetracyclo[4,4,0,1,1]]dodecyl-3-methacrylate The substituent at position 8 is methyl, ethyl, propyl, isobutyl, hexyl, cyclohexyl, stearyl, bromo or fluoro) and 8,9-disubstituted tetracyclo, 0.12.5.7°
101 dodecyl-3-methacrylate (in the formula, the substituents at the 8th and 9th positions are methyl, ethyl, proyl, isobutyl, hexyl, cyclohexyl, stearyl, bromo or fluoro), the following formula (I) A-+M-N← -M-A ... (I) (wherein A is an acrylic acid residue, M is a divalent aliphatic or alicyclic alcohol residue, N is a dibasic acid residue, , and the day is the number of pressure. Polyester whose both ends are blocked with acrylic acid, the following formula (U)
In the formula, the definition of A is the same as above, X is a trivalent or higher polyvalent aliphatic or alicyclic alcohol residue, N is a divalent or higher polybasic acid, and m is a positive number)
A polyester whose hydroxyl groups at both ends and in the chain are blocked with acrylic acid.

Some of these acrylate or methacrylate compounds are disclosed in JP-A-61-136529.

Furthermore, these acrylates or methacrylates can also be used as oligomers produced by prepolymerization according to methods known per se.

Among the above-mentioned components (C), the components (C) contained in the active energy beam-curable composition of the present invention include:
Acrylic B or alkyl ester of methacrylic acid,
A mixture of the compound represented by the above formula (I>) and the compound represented by the above formula (ff) is preferred.

Specifically, the organic peroxide (D) contained in the active energy light-curable composition of the present invention includes benzoyl peroxide, dichlorobenzoyl peroxide, cumene hydroperoxide, dicumyl peroxide, di-tert-butyl peroxide. , 2,5-dimethyl-2
,5-di(peroxidebenzoate)hexyne-3,
1,4-bis(tert-butylperoxyisopropyl)benzene, lauroyl peroxide, tert-butylberacetate, 2,5-dimethyl-2,5-di(
tert-butylperoxy)hexyne-3,2,5-
Dimethyl-2,5-di(tert-butylperoxy)
Hexane, tert-butylberbenzoate-1, te
rt-butylberphenylacetate, tert-butylberisobutyrate, tert-butylberu 5eC
-octoate, tert-butylberbivalate, cumylberbivalate, tert-butylberdiethyl acetate, etc. are used.

The active energy ray-curable composition of the present invention further contains a rubber component (E). Examples of rubber components include diblock or triblock copolymers of styrene and (di)olefin, or hydrogenated products thereof.Specifically, styrene-isoprene copolymers, styrene-butene copolymers, etc. Polymer, styrene-ethylene copolymer, styrene-butadiene copolymer, styrene-butene-
Styrene copolymers, styrene-isoprene-styrene copolymers, styrene-ethylene-butene-styrene copolymers, styrene-ethylene-propylene copolymers, styrene-ethylene-propylene-styrene copolymers, etc. are used. In addition, rubber components such as polyisobutylene, butyl rubber, talolobrene, nitrile rubber, and silicone rubber
) is used as Among these, styrene-containing materials are preferred.

In the active energy photocurable composition of the present invention, the above-mentioned components (A), (B), (C), (D), and (E) are each (A>based on 100 parts by weight of the component). (B
) component is usually 1 to 10 parts by weight, preferably 2 to 5 parts by weight, and component (C) is usually 15 to 35 parts by weight, preferably 20 to 30 parts by weight per 100 parts by weight of component A>. Component (D) is usually 1 to 10 parts by weight, preferably 2 to 7 parts by weight per 100 parts by weight of component A, and (E ) component is used in an amount of usually 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight.

The active energy ray-curable composition of the present invention does not necessarily need to contain a photopolymerization initiation aid, but when using relatively low-energy active energy rays such as ultraviolet rays when curing this composition, It is preferable that the composition contains a photopolymerization initiation aid. Such a photopolymerization initiation aid may be a decomposition type compound that decomposes to generate radicals when irradiated with ultraviolet light or the like, or a hydrogen atom. Various known copolymerization initiation aids may be mentioned, such as hydrogen abstraction type compounds that generate radicals by abstraction. Specifically, such photopolymerization initiation aids include benzoin or its ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, penzoin isopropyl ether, and benzoin butyl ether; benzophenone p-chlorobenzophenone, p- Benzophenone compounds such as methoxybenzophenone; Benzyl compounds such as benzyl and benzyl dimethyl ketal; 1-(4-isopropylphenyl)-2-hydroxy-2-methyl-1-propanone, 1-phenyl-2-hydroxy-2- Methyl-1-propanone, 1-(4-t
Hydroxyalkylphenylketone compounds such as ert-butylphenyl)-2-hydroxy-2-methyl-1-propanone are used.

Furthermore, the active energy ray-curable composition of the present invention may contain a sensitizer, if necessary.

Specific examples of such sensitizers include hydrocarbon compounds such as anthracene, naphthalene, chrysene, and phenanthrene; p-dinitrobenzene, p-nitroaniline, 1,3.5-trinitrobenzene, and ρ- Nitro compounds such as nitrodiphenyl; n-butylamine, di-n
- Amine compounds such as butylamine, triethylamine, diethylaminoethyl methacrylate, p-nitroaniline, N-acetyl-4-nitro-1-naphthylamine; phenol, p-nitrophenol, 2,4-dinitrophenol, 246-dolinitrophenol, etc. Phenol compounds such as benzaldehyde, 9-anthraaldehyde, acetophenone, benzophenone, dibenzalua heptaton, benzyl, I), 0'-diaminobenzophenone, p,p'-tetramethyldiaminobenzophenone; getones such as anthraquinone, 1.2- Benzoanthraquinone, benzoquinone, 1,2-naphthoquinone,
1.4-Quinone compounds such as naphthoquinone; anthrone, 1
．． 9-benzaanthrone, 6-phenyl-1,9-benzaanthrone, 3-phenyl-1,9-benzaanthrone, 2-keto-3-aza-1,9-benzaanthrone,
Anthrones such as 3-methyl-1,3-diaza-1,9-benzaanthrone are used.

The active energy light-curable composition of the present invention is mainly used without adding a solvent, but may be used with the addition of a solvent, and may also be used with a reactive diluent, thickener, anti-sagging agent, and storage stabilizer. , a plasticizer, and other components may be blended.

When the active energy light-curable composition of the present invention is used as an adhesive, the material of the target substrate may be any material and is not particularly limited. However, when this composition is used as an adhesive, In particular, for base materials made of polycarbonate polymers, (meth)acrylate polymers, ethylene/cyclic olefin copolymers, or olefin copolymers containing 4-methyl-1-pentene as a main component. Even if it shows strong adhesion,
As an example, an ethylene/cyclic olefin copolymer is a copolymer of ethylene and a monomer component represented by the following formula (1), and this monomer component is represented by the formula (2) in the polymer. Can you name a compound that has the structure shown?

(In the formula, R1 to R12 may be hydrogen, an alkyl group, or a halogen, and each may be the same or different, and R or R and R or R12 may mutually form a ring.n
is a positive integer of 0 or 1 or more, and when R5-R8 are repeated multiple times, they may be the same or different.) Such an ethylene/cyclic olefin copolymer is It is preferable that it is composed of 40 to 90 mol% of units and 60 to 10 mol% of repeating units represented by the above formula (2).

The active energy light-curable composition of the present invention is particularly preferably used as an adhesive between a hub and a disk substrate that constitute an optical disk, for example, when manufacturing an optical disk.

More specifically, in an optical disk drive device for recording and reproducing information, a magnetic clamp method is used to fix an optical disk on a turntable of the device and rotate the optical disk at high speed together with the turntable. FIG. 1 is a schematic cross-sectional view of a turntable and an optical disc, showing a state in which an optical disc 3 is attached to a turntable 1 using a magnetic clamp method.

In this method, an optical disk 3 is mounted on a turntable that has a magnetic circuit 2 housed in a recessed portion of the turntable 1, and the optical disk is rotated together with the turntable. When mounting an optical disk on the turntable in this way, the optical disk is magnetically attracted onto the turntable while aligning the rotation center axis of the turntable with the rotation center axis of the optical disk. For this purpose, the optical disc mounted on the turntable has a magnetic attracted part 5, that is, a hub, which has a center hole 4 that is to be the center of rotation.

When bonding this hub to the disk substrate 6 constituting the optical disk, the active energy beam-curable composition of the present invention is preferably used as an adhesive.

The hub may be made of glass such as polycarbonate, or may be made of metal or ceramic. In such a hub, at least the tip of the insertion portion into the optical disk is formed from a magnetic material. Here, the magnetic material/family may be a magnetic material itself or a composite of a magnetic material and another material. Specifically,
Magnetic materials include, for example, ■magnetic metals, ■plastics blended with magnetic materials, and ■plastics with magnetic metals attached to the tip of the insertion tube. Preferably.

The active energy light-curable composition of the present invention can be used as an adhesive for various base materials as described above, and can be irradiated with ultraviolet rays, electron beams, radiation, γ-rays, preferably ultraviolet rays, electron beams, and radiation. By doing so, it cures in a short time, exhibits high adhesive strength and high impact strength, does not impair the optical properties of the base material, and is non-polluting because it is solvent-free.

Le friend! The active energy beam-curable composition of the present invention is cured particularly in a short time by irradiation with active energy beams, and has excellent initial curing adhesiveness and moisture-resistant adhesiveness.

Further, when an optical disk substrate and a hub are bonded together using this active energy beam-curable composition, an optical disk having excellent adhesive strength can be obtained.

[Examples] The present invention will be explained below using Examples, but the present invention is not limited to these Examples.

First, the method for evaluating the adhesive strength of the active energy beam curable composition according to the present invention is shown below.

1111 Test piece A made from various resins by injection molding (30
The surfaces of test piece B (25 x 12 x 6.3 areas) and test piece B (25 x 12 x 6.3 areas) were gently wiped with gauze impregnated with Improper tool. After that, the composition of the present invention is applied to test piece A,
Next, the applied composition was spread on test piece B so that the composition was evenly spread over the adhesive surface (adhesion area -0.8cj) between test piece A and test piece B. Both test pieces A and B were sandwiched and fixed with quartz glass so that A was on top, and then the adhesive surface of test pieces A and B was irradiated with active energy rays to cure the composition of the present invention. . Fig. 2 shows the appearance of test piece A7 and test piece B8 after adhesion. In Fig. 2, d to i each indicate the length, d = 30 + m, e = 12.7 cities, f = 3.
+u+, g = 251III, h” L 2
city, j=6.3m+.

Test pieces A and B bonded in this way were subjected to a tensile test a!
(manufactured by Instron, model 1123) using 50 n
Pull at a speed of +n,,+ minutes, measure the tensile force,
The tensile strength was determined by dividing the obtained value by the adhesive area.

In addition, as test piece B, stainless steel (SUS 430)
The tensile strength was determined in the same manner as above.

Example 1 Synthesis of ethylene-cyclic olefin copolymer as adhered material> Using a glass polymerization vessel with a capacity of 211 mm equipped with a stirring blade,
Continuously, ethylene and polycyclic olefins 1.4, 5.8
-dimethano-1,2,3,4,4a,5,8,8a-octahydronaphthalene (structural formula: cop, hereinafter DMON)
A copolymerization reaction was carried out with (abbreviated as ). That is, from the top of the polymerization vessel, a cyclohexane solution of D M ON, Vo
(QCH) cyclohexane solution of Cj 2 (catalyst),
and ethylaluminum sesquichloride (AJ(CH
)) (J) Cyclo 2 5 1.5 1
．． 5 Hexane PJ liquid (catalyst) was continuously supplied into the polymerization vessel. The amount of each added is DMONJ degree 6 in the polymerization vessel.
0t/j, the vanadium concentration in the polymerization vessel was 0.9 mmol/j, and the aluminum concentration in the polymerization vessel was 7.2 mmol/j. On the other hand, the polymerization liquid was continuously drawn out from the lower part of the polymerization vessel so that the polymerization liquid in the polymerization vessel was always 1J. Further, from the upper part of the polymerization vessel, ethylene was supplied at a rate of 85J/hour, hydrogen at 611J/hour, and nitrogen at a rate of 451J/hour. The copolymerization reaction is carried out at 10°C by circulating a refrigerant through a jacket attached to the outside of the polymerization vessel.
I did it.

When the copolymerization reaction was carried out under the above conditions, a polymerization reaction mixture containing an ethylene/polycyclic olefin (ethylene/DMON) copolymer was obtained. A small amount of isopropyl alcohol was added to the polymerization liquid extracted from the bottom of the polymerization vessel. was added to stop the polymerization reaction. Thereafter, the polymerization solution was poured into a household mixer containing about three times as much acetone as the polymerization solution while rotating the mixer to precipitate the produced copolymer. The precipitated copolymer was collected by filtration, dispersed in acetone so that the copolymer (corrosivity was about 50 g/j), and the copolymer was treated at the boiling point of acetone for about 2 hours. After that, the copolymer was collected by filtration, and 1
It was dried under reduced pressure at a temperature of 20'C overnight.

The ethylene/DMON random copolymer (ethylene/polycyclic olefin copolymer) obtained as above is 1
The ethylene composition of this copolymer measured by 3C-NMR analysis was 59 mol%, the intrinsic viscosity [η] measured in 135'C decalin was 0.42 dJ/, and the glass transition temperature was 136 °C. Ta.

Preparation of adhesive> Styrene-ethylene-propylene copolymer (Kuraray IL)
0.5g of L-1001, molecular weight 100000, styrene content 35% by weight, manufactured by I.I., toluene/THF = 1/1
After adding and dissolving 120 ft of the solution, 100 g of bisphenol A type epoxy resin (manufactured by Mikata Petrochemical Industries, Ltd., EPO former K R-1,40) was added and dissolved.

Next, the solvent was evaporated using an evaporator for 3 to 5 hours, and then dried at 40H (1,100°C) in a vacuum dryer.
It was dried for 12 hours under these conditions. To 80 parts by weight of the composition thus obtained, 7, 5, 3, and 5 parts of 4 types of acrylic monomers and oligomers (manufactured by Toagosei Kagaku Kogyo ■, Aronixst 5700.H-6100H-6300M-8030) were added. They were blended at a ratio of gg, t: parts. To 100 parts by weight of the obtained formulation, 2 parts by weight of cyclopentadienyl isopropylphenyl iron (II) salt (manufactured by Ciba Geigy), 0.25 parts by weight of anthracene (manufactured by Wako Pure Chemical Industries), and cumene hydroper. Oxide (cumene hydroperoxide) (manufactured by Kayaku Nouri Co., Ltd., 70% product) 3.1
By adding parts by weight, an active energy light curable composition was obtained.

Using the above composition, polycarbonate (Teijin Kasei ■
A test piece A manufactured by AD-5503) and a test piece B made of an ethylene-cyclic olefin copolymer manufactured as described above were laminated together as shown in FIG.
Ultraviolet rays were irradiated for 15 seconds at an illuminance of J. The contact f1 water obtained by UV irradiation in this manner was used as test t4, and the tensile adhesive strength of the adhesive was measured.

The results are shown in Table 1.

In addition, this sample was placed in a constant temperature and humidity chamber at 70°C and 85% for 2 hours.
After 00 hours, the strength was measured.

The results are shown in Table 1.

Using the adhesive prepared in Oito ■ Yu implementation PA1, stainless steel (S
IIS 430) test piece and an ethylene-cyclic olefin copolymer test piece were bonded together. Using the obtained adhesive as a sample, measure the tensile adhesive strength of the adhesive in the same manner as in Example.

The results are shown in Table 1.

Example 3, except that a styrene-isoprene-styrene copolymer (manufactured by Shell Chemical, molecular weight 115,000, styrene content 14% by weight) was used instead of the styrene-ethylene-propylene copolymer in Example 3. An adhesive was prepared in the same manner as in Example 1. The same test pieces as in Example 1 were bonded together using the obtained adhesive, and the tensile adhesive strength of the adhesive was measured in the same manner as in Example 1 using the obtained bonded body as a sample.

The results are shown in Table 1.

Example 4 Using the adhesive prepared in Example 3, test pieces similar to those in Example 2 were bonded together. Using the obtained adhesive as a sample,
The tensile adhesive strength of the adhesive was measured in the same manner as in Example 1.

The results are shown in Table 1.

Hinomi ■5 In Example 1, instead of the styrene-ethylene-propylene copolymer, a styrene-butene-styrene copolymer was used, manufactured by Shell Chemical Co., Ltd., molecular weight 72,000, styrene content 28.
An adhesive was prepared in the same manner as in Example 1 except that triphenylsulfonium salt was used instead of cyclopentadienyl iron salt. Test pieces similar to those in Example 2 were glued together. Using the obtained adhesive as a sample, the tensile adhesive strength of the adhesive was measured in the same manner as in Example 1.

The results are shown in Table 1.

Comparative Example 1 An adhesive was prepared in the same manner as in Example 1, except that the styrene-ethylene-propylene copolymer was not added.

Test pieces similar to those in Example 2 were bonded together using this adhesive. Using the obtained adhesive as a sample, the tensile adhesive strength was measured in the same manner as in Example 1.

The results are shown in Table 1.

Comparative Example 2 An adhesive was prepared in the same manner as in Example 1, except that cumene hydroperoxide was not added. Using this adhesive, the same test pieces as in Example 2 were adhered to each other. Using the obtained adhesive as a sample, the tensile adhesive strength was measured in the same manner as in Example 1.

The results are shown in Table 1.

To 100 parts by weight of the adhesive prepared in Example 1, 1 part by weight of toluene was added to prepare an adhesive, and using this adhesive, a test piece similar to Example 2 was prepared. Glued them together. Using the obtained adhesive as a sample, the tensile adhesive strength of the adhesive was measured in the same manner as in Example 1.

The results are shown in Table 1.

History ξ-112 Next, an optical disk substrate and a hub were manufactured as described below, and the adhesion between the optical disk substrate and the hub and the tensile adhesive strength were measured as follows.

Production of optical disk substrate> An optical disk substrate with a thickness of 1.2 cm and a diameter of 86 cm was produced using an ethylene-cyclic olefin copolymer synthesized according to the pH of the experiment, and a magneto-optical recording layer was formed on it. has been established.

Manufacture of hub> A hub was manufactured by press working using stainless steel <SO5430>.

Adhesion of hub〉 Dispenser 5IIOTHAT IC with rotary table
After applying the composition of the present invention onto an optical disk substrate using an O3 type (manufactured by Engineering Corporation, lower right), a hub was placed on the optical disk substrate and a load of f200 g was applied. Thereafter, the adhesive was cured by irradiating with ultraviolet light at the same illuminance as in Example 1.

<Tensile Adhesive Strength> FIG. 3 is a schematic cross-sectional view of the jig 9 and the sample, showing a state in which the sample 10 is attached.

The optical disk substrate 11 and the hub 12 are attached to a tensile adhesive strength measuring jig 9 as shown in FIG. The tensile strength of the adhesive was measured by pulling the sample in the two directions of arrow A and the mouth in the figure, and the tensile adhesive strength of the adhesive was determined by dividing this value by the adhesive area.

Example 7 Using the same adhesive as in Example 1, the above-described disk substrate 11 and hub 12 were bonded together. The obtained adhesive body was designated as Sample 10, and the adhesive strength of the adhesive was measured by the method described above.

The results are shown in Table 2.

Using the same adhesive as in Example 3, use the same adhesive as in Example 7.
The optical disk substrate and hub were glued together. The obtained adhesive body was used as a sample, and the adhesive strength of the adhesive was measured by the method described above.

The results are shown in Table 2.

Using the same adhesive as in Example 6, the optical disk substrate and hub were adhered in the same manner as in Example 7. The obtained adhesive body was used as a sample, and the adhesive strength of the adhesive was measured by the method described above.

The results are shown in Table 2.

fζ−m−≦≧

[Brief explanation of the drawing]

Figure 1 is a schematic cross-sectional view showing an optical disc attached to a turntable using the magnetic clamp method, Figure 2 is a diagram showing the appearance after two specimens are glued together, and Figure 3 is a diagram showing the specimen attached. FIG. 3 is a schematic cross-sectional view of the jig and the sample in a state where the 1... Turntable 3... Optical disc 5...
・Magnetic attracted part (hub) 6... Disk board 7... Test piece A8...
Test piece B 9... Jig 10... Sample
°１１・・・Optical disk board・Hub

Claims (1)

[Scope of Claims] 1) (A) an epoxy resin, (B) a compound selected from the group consisting of sulfonium salts and cyclopentadienyl iron compounds, (C) selected from the group consisting of acrylates, methacrylates, and oligomers thereof. (D) an organic peroxide; and (E) a rubber component. 2) (A) an epoxy resin; (B) a compound selected from the group consisting of sulfonium salts and cyclopentadienyl iron compounds; (C) a compound selected from the group consisting of acrylates, methacrylates and oligomers thereof; (D) Using an active energy light-curable composition containing an organic peroxide and (E) a rubber component,
A method for bonding an optical disk substrate and a hub, the method comprising bonding the optical disk substrate and the hub. 3) The method according to claim 2, wherein the optical disc substrate is made of a copolymer of ethylene and cyclic olefin. 4) A method according to claim 2, wherein the hub is made of metal.