JPH0258926U - - Google Patents
Info
- Publication number
- JPH0258926U JPH0258926U JP1988135731U JP13573188U JPH0258926U JP H0258926 U JPH0258926 U JP H0258926U JP 1988135731 U JP1988135731 U JP 1988135731U JP 13573188 U JP13573188 U JP 13573188U JP H0258926 U JPH0258926 U JP H0258926U
- Authority
- JP
- Japan
- Prior art keywords
- manifold
- die
- planar passage
- molten resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Extrusion Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案のＴダイの側面図で、シールプ
レートを取外したもの、第２図は同じく縦断面図
、第３図はフオーミングプレートの斜視図、第４
図は従来のＴダイの横断面図、第５図は従来のフ
オーミングプレート部分の説明図である。
２１：ダイ本体、２３：マニホールド、２４：
面状通路、２５：供給管、２９：フオーミングプ
レート、２９′：フオーミングプレートのマニホ
ールド部分、３０：らせん溝。
Fig. 1 is a side view of the T-die of the present invention with the seal plate removed, Fig. 2 is a vertical sectional view, Fig. 3 is a perspective view of the forming plate, and Fig. 4 is a side view of the T-die of the present invention with the seal plate removed.
The figure is a cross-sectional view of a conventional T-die, and FIG. 5 is an explanatory diagram of a conventional forming plate portion. 21: Die body, 23: Manifold, 24:
Planar passage, 25: Supply pipe, 29: Forming plate, 29': Manifold portion of forming plate, 30: Spiral groove.
Claims (1)
送された溶融樹脂を受け入れるためにダイ本体の
中央部に設けられた供給管の先端側で一方向に延
びるマニホールドと、このマニホールドの下側の
全幅に連設している面状通路と、この面状通路の
下端に設けられたリツプランド部よりなるＴダイ
において、前記マニホールド及び面状通路の両端
部に嵌挿され、成形される樹脂幅を規制するフオ
ーミングプレートの上端部分で、前記マニホール
ドにほぼ内接しているシールロツド部分の外周の
前記マニホールドに対向する周面の全幅にわたつ
てらせん溝が周設されていることを特徴とするＴ
ダイ。 In synthetic resin molding equipment, there is a manifold that extends in one direction at the tip of the supply pipe provided in the center of the die body to receive the molten resin pumped from the molten resin pumping device, and a In a T-die consisting of a continuous planar passage and a lipped portion provided at the lower end of the planar passage, the T-die is fitted into both ends of the manifold and the planar passage to regulate the width of the resin to be molded. A spiral groove is provided at the upper end of the forming plate over the entire width of the outer periphery of the seal rod portion that is substantially inscribed in the manifold and faces the manifold.
Thailand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135731U JPH065147Y2 (en) | 1988-10-17 | 1988-10-17 | T-die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135731U JPH065147Y2 (en) | 1988-10-17 | 1988-10-17 | T-die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258926U true JPH0258926U (en) | 1990-04-27 |
| JPH065147Y2 JPH065147Y2 (en) | 1994-02-09 |
Family
ID=31395606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988135731U Expired - Lifetime JPH065147Y2 (en) | 1988-10-17 | 1988-10-17 | T-die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065147Y2 (en) |
-
1988
- 1988-10-17 JP JP1988135731U patent/JPH065147Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH065147Y2 (en) | 1994-02-09 |