JPH0259169U - - Google Patents
Info
- Publication number
- JPH0259169U JPH0259169U JP13788288U JP13788288U JPH0259169U JP H0259169 U JPH0259169 U JP H0259169U JP 13788288 U JP13788288 U JP 13788288U JP 13788288 U JP13788288 U JP 13788288U JP H0259169 U JPH0259169 U JP H0259169U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- recess
- semiconductor device
- housed
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａは本考案の一実施例の鳥かん図、第１
図ｂは第１図ａのＡ―Ａ′面断面図、第１図ｃは
第１図ａのＢ―Ｂ′面断面図、第２図は本考案の
他の実施例の鳥かん図、第３図は従来のテーピン
グ形半導体装置の鳥かん図である。
１……半導体素子、２……キヤリアテープ、３
……カバーテープ、４……素子落下防止用ひさし
、５……素子取り出し用吸着マウント、６……カ
バーテープのミシン穴。
Figure 1a is a bird's eye diagram of an embodiment of the present invention;
Figure b is a sectional view taken along line A-A' in Figure 1a, Figure 1c is a sectional view taken along line B-B' in Figure 1a, and Figure 2 is a bird's eye view of another embodiment of the present invention. FIG. 3 is a bird's eye view of a conventional taping type semiconductor device. 1...Semiconductor element, 2...Carrier tape, 3
...Cover tape, 4...Eaves for preventing the element from falling, 5...Suction mount for taking out the element, 6...Perforated holes in the cover tape.
Claims (1)
子を収納する形のテープ梱包形半導体装置におい
て、該凹部をおおい閉じるカバー部に窓を設けた
ことを特徴とするテープ梱包形半導体装置。 1. A tape-packaged semiconductor device in which a tape has a recess in a part thereof and a semiconductor element is housed in the recess, the tape-packed semiconductor device having a window in a cover portion that covers the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13788288U JPH0259169U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13788288U JPH0259169U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259169U true JPH0259169U (en) | 1990-04-27 |
Family
ID=31399714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13788288U Pending JPH0259169U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259169U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016150784A (en) * | 2015-02-19 | 2016-08-22 | エスアイアイ・セミコンダクタ株式会社 | Conveyance packaging tape |
-
1988
- 1988-10-21 JP JP13788288U patent/JPH0259169U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016150784A (en) * | 2015-02-19 | 2016-08-22 | エスアイアイ・セミコンダクタ株式会社 | Conveyance packaging tape |
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