JPH0259169U - - Google Patents

Info

Publication number
JPH0259169U
JPH0259169U JP13788288U JP13788288U JPH0259169U JP H0259169 U JPH0259169 U JP H0259169U JP 13788288 U JP13788288 U JP 13788288U JP 13788288 U JP13788288 U JP 13788288U JP H0259169 U JPH0259169 U JP H0259169U
Authority
JP
Japan
Prior art keywords
tape
recess
semiconductor device
housed
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13788288U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13788288U priority Critical patent/JPH0259169U/ja
Publication of JPH0259169U publication Critical patent/JPH0259169U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例の鳥かん図、第１
図ｂは第１図ａのＡ―Ａ′面断面図、第１図ｃは
第１図ａのＢ―Ｂ′面断面図、第２図は本考案の
他の実施例の鳥かん図、第３図は従来のテーピン
グ形半導体装置の鳥かん図である。 １……半導体素子、２……キヤリアテープ、３
……カバーテープ、４……素子落下防止用ひさし
、５……素子取り出し用吸着マウント、６……カ
バーテープのミシン穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. テープの一部に凹部を有し、該凹部に半導体素
    子を収納する形のテープ梱包形半導体装置におい
    て、該凹部をおおい閉じるカバー部に窓を設けた
    ことを特徴とするテープ梱包形半導体装置。
JP13788288U 1988-10-21 1988-10-21 Pending JPH0259169U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13788288U JPH0259169U (ja) 1988-10-21 1988-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13788288U JPH0259169U (ja) 1988-10-21 1988-10-21

Publications (1)

Publication Number Publication Date
JPH0259169U true JPH0259169U (ja) 1990-04-27

Family

ID=31399714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13788288U Pending JPH0259169U (ja) 1988-10-21 1988-10-21

Country Status (1)

Country Link
JP (1) JPH0259169U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016150784A (ja) * 2015-02-19 2016-08-22 エスアイアイ・セミコンダクタ株式会社 搬送包装テープ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016150784A (ja) * 2015-02-19 2016-08-22 エスアイアイ・セミコンダクタ株式会社 搬送包装テープ

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