JPH0260006A - Manufacturing method of conductive sheet - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates primarily to the manufacture of conductive sheets used for mounting electronic components.

Conventional technology Conductive sheets are used as a connection method when making electrical connections with film leads, wiring on printed circuit boards, etc., or when making electrical connections between electrodes of electronic components and wiring on printed circuit boards, etc. There is a method to use.

Among the conductive sheets, there are low-resistance conductive sheets that are used when a relatively high current is passed, when a low resistance is required, or when a contact area is small.

Conventionally, as shown in Fig. 4, this conductive sheet is made by inserting metal wires 1 such as MU shown in (&) in the same direction into an insulating material 2 such as silicone rubber. Sheet manufacturing method 2, Claims (1) A step of forming an insulator pattern having openings on a conductive layer on an insulating substrate, 3. Coating a photosensitive resin on the insulator; forming an aperture in the aperture region of the insulating substrate; then forming a multimetallic conductor in the aperture on the conductive layer by plating using the conductive layer as an electrode; A method for producing a conductive sheet, comprising the step of peeling off both the resin and the metal conductor.

(2) A step of forming an insulator pattern having openings on a conductive layer on an insulating substrate, applying a photosensitive resin on the insulator and forming an opening in the opening area of the insulator. a step of using the conductive layer as an electrode to form a multimetallic conductor in the opening on the conductive layer by plating; a step of removing the photosensitive resin formed on the insulating substrate; and a step of removing the photosensitive resin formed on the insulating substrate. The manufacturing method involved curing the insulating material 2 by heat or the like, and then cutting it in the cross-sectional direction of the metal wire 1 as shown in (b).

Problems to be Solved by the Invention In the conventional technology, since the metal conductor is a metal wire, the processing of the metal wire into a thin wire is done by drawing.

Therefore, the processing limit of metal wire is the limit of stretching. In the case of MuU used as a metal wire, the limit for drawing is about 20 μm in diameter, so in the method of using wire as a metal conductor, the limit for the pitch of the metal conductors is about 60 μm. Nowadays, there is a need to respond to fine pitches and fine pads in the mounting of electronic components, especially semiconductors. This problem cannot be handled by conventional technology. Furthermore, since metal wires are used as metal conductors, there is also a problem with distortion of the metal wires. The tolerance of the distortion and pitch of the metal wire is about half the distance between the pitches, and this is a method of manufacturing conductive sheets that lacks reliability in the case of minute pitches and minute pads.

Means for Solving the Problems In the present invention, in order to solve the above problems, a metal conductor is formed by a plating method, a metal conductor with a minute diameter is manufactured, and a resist used for plating or a resist is used. This method involves peeling off the resin together with the applied resin after removal.

The method for manufacturing a conductive sheet of the present invention includes a step of forming an insulator pattern having openings on a conductive layer on an insulating substrate, coating a photosensitive resin on the insulator, and forming an insulator pattern with openings in the insulator. a step of forming an opening in the area, a step of using the conductive layer as an electrode and forming a υ metal conductor in the opening on the conductive layer by a plating method, and a step of forming a metal conductor on the insulating substrate with the photosensitive resin formed on the insulating substrate. A process of peeling off the metal conductor together, or a process of forming an insulator pattern with openings on a conductive layer on an insulating substrate, coating a photosensitive resin on the insulator, and forming an insulator. a step of forming an aperture in the aperture region of the body, a step of using the conductive layer as an electrode and forming a metal conductor in the aperture on the conductive layer by a plating method, and a photosensitive resin formed on the insulating substrate. a step of forming an insulating material on the insulating substrate so that a part of the metal conductor is exposed; a step of peeling off the insulating material formed on the insulating substrate and the metal conductor. It is equipped with the following.

The pitch of the metal conductors can be reduced to several microns by using a plating method to form a conductive sheet of metal conductors that can be inserted between working electronic components and lead wires to easily establish an electrical connection. I can do it. Moreover, it becomes possible to handle even minute electrodes of electronic parts. In addition, the shape of the metal conductor can be not only circular but also various shapes.

Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2. First, as shown in FIG. 1 (IL), on a substrate 14 such as glass,
Plating electrode for forming thin metal wires 12. An insulator 13 serving as a mask is formed. A resist 15 is applied onto this substrate 14 using a spinner or the like. At this time, it is preferable that the insulator 13 is made of a material such as Teflon that allows easy peeling of the resin, and the plating electrode 12 is made of Or-U, Mul, Cu,
iTo, tungsten, λg/Pd, etc. Further, the thickness of the resist 16 is approximately 7 .mu.m to 12 .mu.m.

Next, as shown in FIG. 1(b), a mask (not shown) having a pattern that matches the insulator 13 is placed on the resist 15.
by placing the pattern on the insulator 13, irradiating it with ultraviolet rays, and developing the resist 16.
Sixteen holes are made in the resist 16 in the area where the plating electrode 12 is exposed. At this time, the size of the hole is, for example, 3 in diameter.
It is μm.

Next, as shown in FIG. 1(C), the plating substrate 14 is immersed in a plating solution, and a thin metal wire 1 such as a shim U is coated by applying an electric current.
form 1. At this time, care is taken not to grow the thin metal wire 11 too much, and the thin metal wire 11 is grown to be about 1 μm higher than the resist 15.

Next, as shown in FIG. 1(d), the resist 16 and the metal wires 11 are separated from the plating substrate 14 to produce a conductive sheet having the metal wires 11. At this time, since the thin metal wire 11 protrudes above and below the resist 16, good conduction can be obtained.

FIG. 3 shows a completed diagram after semiconductor elements are mounted using the sheet formed in FIG. 1. FIG. 3(b) is an enlarged view of section A in FIG. 3(a). As shown in FIG. 3, the substrate wiring 36 of the substrate 37 and the element electrode 32 of the semiconductor element 31 are aligned,
The structure is such that a conductive sheet 30 is placed between a substrate 37 and a semiconductor element 31. The protrusions of the thin metal wires 11 of the conductive sheet 30 are connected to the element electrodes 32 and the board wiring 3 by applying pressure.
6 to establish electrical connection.

Next, another embodiment of the present invention will be described with reference to FIG. First, as shown in FIG. 2 (&), a resist 25 is applied using a spinner or the like onto a substrate 24 made of glass or the like, on which an insulator 23 is placed on a plating electrode 22 for forming a thin metal wire 21. do. At this time, the insulator 23 is made of a resin such as Teflon that can be easily peeled off. The plating electrode 12 is made of Or-mu, Mu, Cu.

iTo, tungsten, 5g/Pd, etc. Further, the thickness of the resist 26 is approximately 7 μm to 12 μm.

Next, as shown in FIG.
A hole 26 is formed in the resist 26 at a portion where the plating electrode 22 is exposed by placing the resist 26 on the resist 26 and irradiating it with ultraviolet rays to develop the resist 26. The diameter of the 26 holes is 3 μm.

Next, as shown in FIG. 2(C), the plating substrate 24 is immersed in a plating solution, and a current is applied to coat the thin metal wires 2 such as the mu U.
form 1. At this time, care must be taken not to allow the thin metal wires 21 to grow too much.

Next, as shown in FIG. 2 (+1), the resist 25 is removed.

Next, as shown in FIG. 2(e), an insulating material 26 is applied using a spinner, dispenser, or the like.

If the insulating material 26 is an ultraviolet curing type, it is exposed to ultraviolet light.

If it is a thermosetting type, it is cured by applying heat. The insulating material 26 uses resin such as acrylic or epoxy, rubber such as silicone, and resist 25.

Finally, as shown in FIG. It can be used for implementation as shown in FIG.

Effects of the Invention As described above, since the present invention is a method of forming fine metal wires of a conductive sheet by plating, it is very advantageous in adapting to electrodes with minute pitches and minute pads. and,
Compared to manufacturing methods that use wires for thin metal wires, the thin metal wires can be made thinner to accommodate electrodes with minute pitches and minute pads, so it is possible to handle even smaller items. Furthermore, by plating the thin metal wire, the shape and size of the cross section of the thin metal wire can be changed freely.

[Brief explanation of the drawing]

FIGS. 1 and 2 are cross-sectional views of each embodiment of the present invention by process, FIG. 3 is a cross-sectional view of a semiconductor package using the present invention, and FIG. 4 is a conventional manufacturing process of a conductive sheet. It is a diagram. 11.21・Pa...metal thin wire, 12.22・old...plated electrode, 13.23...insulator, 14.24
・Mountain: Plating substrate, 15.25: Mountain: Resist, 2
6. River: Insulating material. Name of agent: Patent attorney Shigetaka Awano and 1 other person11
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Claims (2)

[Claims] (1) A step of forming an insulator pattern with openings on a conductive layer on an insulating substrate, applying a photosensitive resin on the insulator and forming an opening in the opening area of the insulator. a step of using the conductive layer as an electrode to form a metal conductor in the opening on the conductive layer by a plating method; and a step of peeling off both the photosensitive resin formed on the insulating substrate and the metal conductor. A method for producing a conductive sheet, characterized in that: (2) A step of forming an insulator pattern having openings on a conductive layer on an insulating substrate, applying a photosensitive resin on the insulator and forming an opening in the opening area of the insulator. a step of using the conductive layer as an electrode to form a metal conductor in the opening on the conductive layer by plating, a step of removing the photosensitive resin formed on the insulating substrate, a step of removing the photosensitive resin formed on the insulating substrate, A conductive sheet comprising the steps of forming an insulating material so that a part of the metal conductor is exposed, and peeling off the insulating material formed on the insulating substrate and the metal conductor. Production method.