JPH0260186A - Printed board - Google Patents

Printed board

Info

Publication number
JPH0260186A
JPH0260186A JP21050388A JP21050388A JPH0260186A JP H0260186 A JPH0260186 A JP H0260186A JP 21050388 A JP21050388 A JP 21050388A JP 21050388 A JP21050388 A JP 21050388A JP H0260186 A JPH0260186 A JP H0260186A
Authority
JP
Japan
Prior art keywords
component
wiring pattern
component mounting
mounting surface
silk screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21050388A
Other languages
Japanese (ja)
Inventor
Tetsuo Ukawa
徹雄 宇川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21050388A priority Critical patent/JPH0260186A/en
Publication of JPH0260186A publication Critical patent/JPH0260186A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To facilitate the confirmation of the connection between the wiring pattern of a component mounting face and the wiring pattern formed on the rear side of the component mounting face by a method wherein a silk screen, which indicates the outer shape of a component or the like and the wiring pattern of the rear side or the component mounting face, is provided to the component mounting face and the rear side respectively. CONSTITUTION:A silk screen 3', which indicates the outer shape, the mark, and the number of a component, and a silk screen 6', which indicates a wiring pattern 6 of the rear side, are provided to a component mounting face, and a silk screen 3'', which indicates the outer shape of the component or the like, and a silk screen 4', which shows a wiring pattern 4 of the component mounting face, are provided to the rear side of the component mounting face. By this setup, not only the mounting position of the component can be seen but also the connection path of the component with a plug 2 of a printed substrate 1 and a connection state between the wiring pattern 4 of the component mounting face and the wiring pattern 6 of the rear side of the component mounting face can be easily confirmed.

Description

【発明の詳細な説明】 （発明の目的） （産業上の利用分野） 本発明は、電気産業分野で広く使用されているプリント
基板のパターンチエツク及びメンテナンス性の改善に関
する。DETAILED DESCRIPTION OF THE INVENTION (Objectives of the Invention) (Industrial Application Field) The present invention relates to improvements in pattern checking and maintainability of printed circuit boards widely used in the electrical industry field.

（従来の技術） 従来技術によるプリント基板の構成例を第７図〜第９図
に示す。第７図は、両面配線パターンのプリント基板に
部品を実装した状態を示す図である。第８図は、部品取
付面において部品の外形を示すシルクスクリーンと部品
取付面の配線パターンを示す図であり、第９図は部品取
付面の裏側の配線パターンを示す図である。(Prior Art) Examples of configurations of printed circuit boards according to the prior art are shown in FIGS. 7 to 9. FIG. 7 is a diagram showing a state in which components are mounted on a printed circuit board with a double-sided wiring pattern. FIG. 8 is a diagram showing a silk screen showing the outline of the component on the component mounting surface and the wiring pattern on the component mounting surface, and FIG. 9 is a diagram showing the wiring pattern on the back side of the component mounting surface.

第７図において部品３をプリント板１に実装すると第８
図に示される部品３の下に位置する部品取付穴５ｂと５
Ｃとを結ぶ配線パターンの有無及び配線パターンの経路
として５ａと５ｂとが接続されているのか、または５ａ
と５０が接続されているのか、それとも５ａと５ｄが接
続されているのかの確認が困難となる場合が生じてくる
。また、部品取付面の状態を示す第８図を見ただけでは
、部品取付面の裏側に位置する部品取付穴５ａと５ｂと
を結ぶ第９図に示される配線パターン６の有無及び確認
が困難となる場合が生じてくる。特に部品数が多く配線
パターンが複管で多い紙エポ〜１ニジ樹脂等を素材とす
る不透明なプリント板では非常に困難であった。In Fig. 7, when component 3 is mounted on printed board 1,
Component mounting holes 5b and 5 located below component 3 shown in the figure
Whether there is a wiring pattern connecting C and whether 5a and 5b are connected as a route of the wiring pattern, or 5a
It may become difficult to confirm whether 50 and 50 are connected, or whether 5a and 5d are connected. Moreover, it is difficult to confirm the presence or absence of the wiring pattern 6 shown in FIG. 9, which connects the component mounting holes 5a and 5b located on the back side of the component mounting surface, just by looking at FIG. 8, which shows the condition of the component mounting surface. There will be cases where this happens. This is particularly difficult for opaque printed boards made of paper epoxy resin, polyurethane resin, etc., which have a large number of parts and many wiring patterns with multiple tubes.

また、プリント基板の素材かがラスエポキシ樹脂等を素
材とする透明に近い状態のプリント基板であっても、最
近使用されている耐ノズル性向上の為に部品取付面と部
品取付面の裏側との間にシー／レド層を設けた３層＋Ｍ
　３青のフ′リント基（反やソルダーレジストやベタア
ースを実施したプリント基板においては、部品取付面と
部品取付面の裏側の配線パターンの接続の確認か困難で
あった。In addition, even if the printed circuit board is made of lath epoxy resin or the like and is nearly transparent, the parts mounting surface and the back side of the component mounting surface are 3 layers + M with sea/redo layer in between
3 For printed circuit boards with blue flint base (reverse, solder resist, or solid ground), it was difficult to confirm the connection between the component mounting surface and the wiring pattern on the back side of the component mounting surface.

（発明が解決しようとする課題） 前述した様に、従来技術によるプリント基板では困難で
あった （１）部品の下を通っている配線パターンの有無及び配
線パターンの確認 ■　部品数イ」面の配線パターンと部品取付面の裏側の
配線パターンの接続の確認 を解決しようとするものである。(Problems to be Solved by the Invention) As mentioned above, it is difficult to confirm the presence or absence of a wiring pattern passing under the component and the wiring pattern with the printed circuit board using the conventional technology. This is an attempt to solve the problem of checking the connection between the wiring pattern and the wiring pattern on the back side of the component mounting surface.

〔発明の構成〕[Structure of the invention]

（課題を解決するだめの手段及び作用）本発明では、従
来より実施されているプリント基板のシルクスクリーン
の技術を応用し、部品取付面には、部品外形等を示ずシ
ルクスクリーンと部品取付面の裏側の配線パターンのシ
ルクスクリーンを設け、また部品取付面の裏側にも部品
外形等を示すシルクスクリーンと部品取付面の配線パタ
ーンを示すシルクスクリーンを設【ノる一ｂのである。(Means and effects for solving the problem) In the present invention, the technology of silk screening of printed circuit boards that has been practiced in the past is applied, and the component mounting surface does not show the external shape of the component. A silk screen showing the wiring pattern on the back side of the component mounting surface is provided, and a silk screen showing the external shape of the component, etc. and a silk screen showing the wiring pattern on the component mounting surface are also provided on the back side of the component mounting surface.

（実施例） 第１図〜第３図に本発明の一実施例を示す。第１図〜第
３図は同じプリント基板であり、また、前述の第７図〜
第９図と同一番号のものは、同一機能を示すものである
。(Example) An example of the present invention is shown in FIGS. 1 to 3. Figures 1 to 3 are the same printed circuit board, and Figures 7 to 3 shown above are the same.
Components with the same numbers as in FIG. 9 indicate the same functions.

第１図はプリント基板１に部品３を取付けた状態を示す
図である。第２図は部品取付面に部品外形を示すシルク
スクリーン３−と部品取付面の裏側の配線パターン６を
示すシルクスクリーン６′を設けた状態を示す図である
。第２図より、部品３の取付位置がわかると同時に部品
取付面の配線パターン４と部品取付面の裏側の配線パタ
ーンを示すシルクスクリーン６−から部品３の取付位置
だけでなく部品３とプリント基板接栓２との接続経路や
部品取付面の配線パターン４と部品取付面の裏側の配線
パターン６の接続状態が容易にわがる。FIG. 1 is a diagram showing a state in which a component 3 is attached to a printed circuit board 1. FIG. 2 is a diagram showing a state in which a silk screen 3- showing the external shape of the component and a silk screen 6' showing the wiring pattern 6 on the back side of the component mounting surface are provided on the component mounting surface. From Figure 2, the mounting position of the component 3 can be determined, and at the same time, the silk screen 6-, which shows the wiring pattern 4 on the component mounting surface and the wiring pattern on the back side of the component mounting surface, shows not only the mounting position of the component 3, but also the mounting position of the component 3 and the printed circuit board. The connection path with the plug 2 and the connection state between the wiring pattern 4 on the component mounting surface and the wiring pattern 6 on the back side of the component mounting surface can be easily changed.

第３図は、部品取付面の裏側に部品外形を示すシルクス
クリーン３″と部品取付面の配線パターン４を示すシル
クスクリーン４−を設けた状態を示す図である。第３図
より、部品３の取付位置がわかると同時に部品取付面の
裏側の配線パターン６と部品取付面の配線パターン４を
示すシルクスクリーン４′から部品３の取付位置だけで
なく、部品３とプリント基板接栓２との接続経路や部品
取付面の配線パターン４と部品取付面の裏側の配線パタ
ーン６の接続状態が容易にわかる。FIG. 3 is a diagram showing a state in which a silk screen 3'' showing the external shape of the component and a silk screen 4- showing the wiring pattern 4 on the component mounting surface are provided on the back side of the component mounting surface.From FIG. At the same time, the silk screen 4' showing the wiring pattern 6 on the back side of the component mounting surface and the wiring pattern 4 on the component mounting surface shows not only the mounting location of the component 3 but also the connection between the component 3 and the printed circuit board connector 2. The connection path and the connection state between the wiring pattern 4 on the component mounting surface and the wiring pattern 6 on the back side of the component mounting surface can be easily seen.

第４図〜第６図に本発明の他の実施例を示す。Other embodiments of the present invention are shown in FIGS. 4 to 6.

第４図〜第６図は同じプリント基板であり、また、前述
の第１図〜第３図と同一番号のものは、同一機能を示す
ものである。4 to 6 are the same printed circuit boards, and the same numbers as in FIGS. 1 to 3 described above indicate the same functions.

第４図は前述の第１図と同様にプリント基板１に部品３
を取付けた状態を示す図である。第５図は部品数イ」面
に部品外形を示すシルクスクリーン３−のみを設けた状
態を示す図である。Figure 4 shows parts 3 on printed circuit board 1, similar to Figure 1 above.
It is a figure showing the state where is attached. FIG. 5 is a diagram showing a state in which only a silk screen 3- showing the outer shape of the parts is provided on the part number A side.

第６図は前述の第３図と同様に部品取付面の裏側に部品
外形を示すシルクスクリーン３″と部品取付面の配線パ
ターン４を示ずシルクスクリーン４−を設けた状態を示
す図である。FIG. 6 is a diagram showing a state in which a silk screen 3'' indicating the external shape of the component is provided on the back side of the component mounting surface and a silk screen 4- is provided on the back side of the component mounting surface without showing the wiring pattern 4 of the component mounting surface, similar to the above-mentioned FIG. 3. .

また、第５図において部品取付面の裏側の部品外形を示
すシルクスクリーンを実線以外とすることも他の実施例
としてあげられる。In addition, as another example, the silk screen showing the outline of the component on the back side of the component mounting surface in FIG. 5 may be made other than the solid line.

〔発明の効果〕〔Effect of the invention〕

以上述べた様に、プリント基板の部品数（＝Ｊ而に部品
外形等を示すシルクスクリーンと部品取付面の裏側の配
線パターンを示すシルクスクリーンを持たせたり、プリ
ント基板の部品取付面の裏側に部品の外形を示すシルク
スクリーンと部品取付面の配線パターンを持たせること
によって次に述べる効果が得られる。As mentioned above, the number of parts (=J) on a printed circuit board is also provided with a silk screen that shows the external shape of the parts and a silk screen that shows the wiring pattern on the back side of the component mounting surface. By providing a silk screen showing the external shape of the component and a wiring pattern on the component mounting surface, the following effects can be obtained.

（１）部品の下を通っている配線パターンの有無及び配
線パターンの確認が容易になる。(1) It becomes easy to check whether there is a wiring pattern passing under the component and the wiring pattern.

■　部品取付面の配線パターンと部品取付面の裏側の配
線パターンの接続の確認が容易になる。■ It becomes easier to check the connection between the wiring pattern on the component mounting surface and the wiring pattern on the back side of the component mounting surface.

Ｃ３）　　プリント板の片面を見ただけで両面の配線パ
ターンの経路部品の取イ４位置が容易にわかるので、配
線パターンのチエツクやパターン変更して追加部品等の
位ｉξや穴明は位置の堪認が容易になる。C3) Just by looking at one side of the printed circuit board, you can easily see the positions of the route components on both sides of the wiring pattern, so you can check the wiring pattern, change the pattern, and adjust the position of additional parts and holes. It becomes easier to understand.

６）配線パターンのシルクスクリーンの色を変えたり、
点線や一点鎖線を用いることによってパターンの種別（
電源線、信号線、グランド線等）を容易に識別すること
も可能となる。6) Change the color of the wiring pattern silk screen,
The type of pattern (
It also becomes possible to easily identify power lines, signal lines, ground lines, etc.

■　部品取付面の裏側の部品外形を示すシルクスクリー
ンを実線以外とすることで、部品数イ」面と部品を取付
けない而とを容易に識別できる様にすることで部品を取
付けない面に誤って部品を取付けることも防げる。■ By using a silk screen that shows the component outline on the back side of the component mounting surface other than a solid line, it is possible to easily distinguish between the surface with the number of components and the surface on which no components are to be mounted. This also prevents parts from being installed by hand.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の方法によるプリント基板を用いて組立
られたプリント板組立状態図、第２図は本発明の方法に
よるプリント基板の部品取付側の図、第３図は本発明の
方法によるプリント基板の部品取付側の裏側の図、第４
図は他の実施例のプリント板組立状態図、第５図は他の
実施例の部品取付側の図、第６図は他の実７Ｉ！例の部
品取付側の裏側の図、第７図は従来の方法によるプリン
ト基板を用いて組立られたプリント板組立状態図、第８
図は従来の方法によるプリント基板の部品取付側の図、
第９図は従来の方法によるプリント塞板の裏側の図であ
る。 １・・・プリント基板 ２・・・プリント基板の接栓 ３・・・プリント基板への取付部品 ３”、３”・・・プリント基板への取付部品の外形を示
すシルクスクリーン ４・・・部品取付面の配線パターン ４′・・・部品取付側の配線パターンを示すシルクスク
リーン ５ａ、　５ｂ、　５ｃ、　５ｄ・・・部品取付穴６・・
・部品取付側の裏側の配線パターン６′・・・部品取付
側の裏側の配線パターンを示すシルクスクリーン 第１図 代理人　弁理士　則　近　憲　佑 同　　　　第子丸　　　叶 第２図 第３図 第 図 第 図 第 図 第 図 第 図 第 図FIG. 1 is a diagram of a printed circuit board assembled using a printed circuit board according to the method of the present invention, FIG. 2 is a diagram of the parts mounting side of the printed circuit board according to the method of the present invention, and FIG. 3 is a diagram of the printed circuit board assembled using the method of the present invention. Diagram of the back side of the printed circuit board on which parts are installed, No. 4
The figure is a printed board assembly state diagram of another embodiment, FIG. 5 is a diagram of the parts installation side of another embodiment, and FIG. 6 is a diagram of another embodiment 7I! Figure 7 is a diagram of the back side of the parts mounting side of the example, and Figure 8 is a diagram of the printed board assembled using the conventional method.
The figure shows the part mounting side of the printed circuit board using the conventional method.
FIG. 9 is a view of the back side of a printed closure plate according to the conventional method. 1... Printed circuit board 2... Printed circuit board connector 3... Parts to be attached to the printed circuit board 3'', 3''... Silk screen showing the external shape of the parts to be attached to the printed circuit board 4... Parts Wiring pattern 4' on the mounting surface...Silk screens 5a, 5b, 5c, 5d showing the wiring pattern on the component mounting side...Component mounting holes 6...
・Wiring pattern on the back side of the parts mounting side 6'... Silk screen diagram 1 showing the wiring pattern on the back side of the parts mounting side Figure Figure Figure Figure Figure

Claims (3)

【特許請求の範囲】[Claims] （１）部品の取付けと部品間の配線を兼ねたプリント基
板において、部品取付面には部品の外形や部品の記号及
び部品番号等を示すシルクスクリーンと部品取付面の裏
側の配線パターンのシルクスクリーンを、また部品取付
面の裏側には部品の外形や部品の記号及び部品番号等を
示すシルクスクリーンと部品取付面の配線パターンのシ
ルクスクリーンを持つことを特徴とするプリント基板。(1) In a printed circuit board that serves both for mounting components and for wiring between components, there is a silk screen on the component mounting surface that shows the external shape of the component, component symbol, part number, etc., and a silk screen that shows the wiring pattern on the back side of the component mounting surface. Also, a printed circuit board characterized by having a silk screen on the back side of the component mounting surface showing the outline of the component, a component symbol, a part number, etc., and a silk screen showing the wiring pattern on the component mounting surface. （２）部品取付面には部品の外形や部品の記号及び部品
番号等を示すシルクスクリーンを、また部品取付面の裏
には部品の外形や部品の記号及び部品番号等を示すシル
クスクリーンと部品取付面の配線パターンのシルクスク
リーンを持つことを特徴とするプリント基板。(2) On the part mounting surface, there is a silk screen that shows the part outline, part symbol, part number, etc. On the back of the part mounting surface, there is a silk screen that shows the part outline, part symbol, part number, etc. A printed circuit board characterized by having a silk screen of the wiring pattern on the mounting surface. （３）部品取付面の部品の外形を示すシルクスクリーン
は実線で、また、部品取付面の裏側の部品の外形を示す
シルクスクリーンは実線以外で実施したことを特徴とす
る特許請求の範囲（１）項及び（２）項のプリント基板
。(3) The silk screen showing the external shape of the component on the component mounting surface is a solid line, and the silk screen showing the external shape of the component on the back side of the component mounting surface is implemented using a line other than solid lines (1) ) and (2) printed circuit boards.
JP21050388A 1988-08-26 1988-08-26 Printed board Pending JPH0260186A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21050388A JPH0260186A (en) 1988-08-26 1988-08-26 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21050388A JPH0260186A (en) 1988-08-26 1988-08-26 Printed board

Publications (1)

Publication Number Publication Date
JPH0260186A true JPH0260186A (en) 1990-02-28

Family

ID=16590445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21050388A Pending JPH0260186A (en) 1988-08-26 1988-08-26 Printed board

Country Status (1)

Country Link
JP (1) JPH0260186A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1220597A1 (en) * 2000-12-27 2002-07-03 Alps Electric Co., Ltd. Structure for inspecting electrical component alignment
US7279641B2 (en) * 2005-10-21 2007-10-09 Canon Kabushiki Kaisha Wiring board and wiring apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1220597A1 (en) * 2000-12-27 2002-07-03 Alps Electric Co., Ltd. Structure for inspecting electrical component alignment
US7279641B2 (en) * 2005-10-21 2007-10-09 Canon Kabushiki Kaisha Wiring board and wiring apparatus

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