JPH0260223U - - Google Patents
Info
- Publication number
- JPH0260223U JPH0260223U JP14058688U JP14058688U JPH0260223U JP H0260223 U JPH0260223 U JP H0260223U JP 14058688 U JP14058688 U JP 14058688U JP 14058688 U JP14058688 U JP 14058688U JP H0260223 U JPH0260223 U JP H0260223U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- capacitor element
- chip
- type solid
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ａ〜ｄは本考案の一実施例の説明図でチ
ツプ形固体コンデンサにおける焼結体の斜視図、
陰極端子の斜視図、コンデンサ素子の縦断面図お
よび全体の縦断面図、第２図ａ〜ｄは本考案の他
の実施例の説明図でチツプ形固体電解コンデンサ
における焼結体の斜視図、陰極端子の斜視図、コ
ンデンサ素子の縦断面図および全体の縦断面図、
第３図ａ〜ｄは従来のチツプ形固体電解コンデン
サの一例の説明図で焼結体の斜視図、陰極端子の
斜視図、コンデンサ素子の縦断面図および全体の
縦断面図である。
１，１１，１２……焼結体、１１ａ……焼結体
の凹部、１２ａ……焼結体の貫通穴、２……誘電
体、３……陰極層、４，４１，４２……コンデン
サ素子、４１ａ……コンデンサ素子の凹部、４２
ａ……コンデンサ素子の貫通穴、５……陽極端子
、６，６１，６２……陰極端子、６１ａ，６１ｂ
……陰極端子の先端部、７……樹脂、８……導電
性接着剤。
1A to 1D are explanatory diagrams of one embodiment of the present invention, and are perspective views of a sintered body in a chip-type solid capacitor;
A perspective view of a cathode terminal, a vertical cross-sectional view of a capacitor element, and a vertical cross-sectional view of the entire capacitor element; FIGS. 2a to 2d are explanatory views of other embodiments of the present invention; A perspective view of a cathode terminal, a vertical cross-sectional view of a capacitor element, and a vertical cross-sectional view of the entire capacitor element,
3A to 3D are explanatory diagrams of an example of a conventional chip-type solid electrolytic capacitor, showing a perspective view of a sintered body, a perspective view of a cathode terminal, a longitudinal sectional view of a capacitor element, and a longitudinal sectional view of the entire capacitor. DESCRIPTION OF SYMBOLS 1, 11, 12... Sintered compact, 11a... Recessed part of sintered compact, 12a... Through hole of sintered compact, 2... Dielectric, 3... Cathode layer, 4, 41, 42... Capacitor Element, 41a... Concavity of capacitor element, 42
a... Capacitor element through hole, 5... Anode terminal, 6, 61, 62... Cathode terminal, 61a, 61b
...Tip of cathode terminal, 7...Resin, 8...Conductive adhesive.
Claims (1)
温焼結してなる焼結体に誘電体層、陰極層を順次
形成してコンデンサ素子を形成し、陽・陰極端子
を接続し、樹脂外装してなるチツプ形固体電解コ
ンデンサにおいて、前記成型体の一部に凹部また
は貫通穴を設けて成型・焼結することにより前記
コンデンサ素子に凹部または貫通穴を形成し、前
記コンデンサ素子の凹部または貫通穴と陰極端子
とをはめ合せて接続したことを特徴とするチツプ
形固体電解コンデンサ。 Valve metal powder is pressure-molded to form a molded body, and a dielectric layer and a cathode layer are sequentially formed on the sintered body by high-temperature sintering to form a capacitor element, positive and negative terminals are connected, and resin In a chip-type solid electrolytic capacitor that is externally packaged, a recess or a through hole is formed in a part of the molded body, and the recess or through hole is formed in the capacitor element by molding and sintering. A chip-type solid electrolytic capacitor characterized by a through hole and a cathode terminal that are fitted and connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058688U JPH0260223U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058688U JPH0260223U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260223U true JPH0260223U (en) | 1990-05-02 |
Family
ID=31404894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14058688U Pending JPH0260223U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260223U (en) |
-
1988
- 1988-10-27 JP JP14058688U patent/JPH0260223U/ja active Pending
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