JPH0260254U - - Google Patents
Info
- Publication number
- JPH0260254U JPH0260254U JP13925288U JP13925288U JPH0260254U JP H0260254 U JPH0260254 U JP H0260254U JP 13925288 U JP13925288 U JP 13925288U JP 13925288 U JP13925288 U JP 13925288U JP H0260254 U JPH0260254 U JP H0260254U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- thin
- ceramic
- copper
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
Description
第１図は本考案実施例における構成要素の一部
を示す斜視図、第２図ａ〜ｃそれぞれは第１図に
示す構成要素の組立状態を示す平面図、正面図お
よび側面図、第３図は本考案実施例完成状態の平
面図、第４図ａおよびｂは従来例の正面図および
側面断面図、第５図は他の従来例の正面断面図で
ある。
１……電極、１１……ねじ孔、２……セラミツ
クス薄板、３……銅プレート、４……電気絶縁性
モールド剤、５……ヒートシンク本体、Ａ，Ａ′
……銅メタライズ加工範囲、Ｂ……凹部、Ｓ……
小型スタツド形半導体。
FIG. 1 is a perspective view showing some of the components in the embodiment of the present invention, FIGS. 4A and 4B are front views and side sectional views of a conventional example, and FIG. 5 is a front sectional view of another conventional example. 1... Electrode, 11... Screw hole, 2... Ceramic thin plate, 3... Copper plate, 4... Electrical insulating molding agent, 5... Heat sink body, A, A'
...Copper metallization processing range, B...concavity, S...
Small stud type semiconductor.
Claims (1)
央部所定範囲と裏面全体とに薄い銅メタライズ加
工されているセラミツクス薄板、表面に小型スタ
ツド形半導体のねじ部を螺着可能なねじ孔が孔設
され、裏面をセラミツクス薄板表面の上記所定範
囲に当接する銅材製電極、表面にセラミツクス薄
板の裏面が当接する銅プレート、および内部に冷
却水通路が設けられているヒートシンク本体を構
成要素とし、上記電極・セラミツクス薄板間およ
びセラミツクス薄板・銅プレート間の接触面は半
田付けされるとともに、セラミツクス薄板の接触
面外にある裸出部を含む接合部周を電気絶縁性モ
ールド剤で被覆、固化して一体化し、上記銅プレ
ートの裏面を前記ヒートシンク本体に当接、固定
してなる小型スタツド形半導体用絶縁ヒートシン
ク。 (2) セラミツクス薄板の裏面が当接する銅プレ
ートの表面所定範囲が極めて浅い凹部とされてい
る請求項１記載の小型スタツド形半導体用絶縁ヒ
ートシンク。[Scope of Claim for Utility Model Registration] (1) A ceramic thin plate with high electrical insulation and high thermal conductivity, which is coated with thin copper metallization on a predetermined area in the center of the front surface and on the entire back surface, and a small stud-shaped semiconductor screw on the surface. A copper plate is provided with a screw hole into which the part can be screwed, a copper electrode is provided on the back surface of the plate that contacts the above-mentioned predetermined area on the surface of the thin ceramic plate, a copper plate is provided with the back surface of the thin ceramic plate that is in contact with the surface of the thin ceramic plate, and a cooling water passage is provided inside. The contact surfaces between the electrode and the ceramic thin plate and between the ceramic thin plate and the copper plate are soldered, and the periphery of the joint including the exposed part outside the contact surface of the ceramic thin plate is soldered. A small stud-shaped insulating heat sink for a semiconductor, which is formed by covering the copper plate with an electrically insulating molding agent, solidifying it, and then fixing the copper plate in contact with the heat sink body. (2) The small stud-type insulating heat sink for semiconductors according to claim 1, wherein a predetermined area on the surface of the copper plate that the back surface of the thin ceramic plate comes into contact with is formed into an extremely shallow recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13925288U JPH06827Y2 (en) | 1988-10-27 | 1988-10-27 | Small stud type insulated heat sink for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13925288U JPH06827Y2 (en) | 1988-10-27 | 1988-10-27 | Small stud type insulated heat sink for semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260254U true JPH0260254U (en) | 1990-05-02 |
| JPH06827Y2 JPH06827Y2 (en) | 1994-01-05 |
Family
ID=31402338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13925288U Expired - Lifetime JPH06827Y2 (en) | 1988-10-27 | 1988-10-27 | Small stud type insulated heat sink for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06827Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114008771A (en) * | 2019-07-02 | 2022-02-01 | 三菱电机株式会社 | Power module and method for manufacturing the same |
-
1988
- 1988-10-27 JP JP13925288U patent/JPH06827Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114008771A (en) * | 2019-07-02 | 2022-02-01 | 三菱电机株式会社 | Power module and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06827Y2 (en) | 1994-01-05 |
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