JPH0260262U - - Google Patents
Info
- Publication number
- JPH0260262U JPH0260262U JP1988138863U JP13886388U JPH0260262U JP H0260262 U JPH0260262 U JP H0260262U JP 1988138863 U JP1988138863 U JP 1988138863U JP 13886388 U JP13886388 U JP 13886388U JP H0260262 U JPH0260262 U JP H0260262U
- Authority
- JP
- Japan
- Prior art keywords
- light
- container
- lead
- emitting element
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図乃至第３図は、本考案の実施例を示す断
面図、第４図は、その製造工程の一部を示す上面
図、第５図及び第６図は従来の半導体光結合装置
の要部を示す断面図である。
１……容器、２……窓部、３……透明キヤツプ
、４……光フアイバー、５……透明樹脂、６……
リード、７……発光素子、８……受光素子、１０
……凹部、１１……足部、１２……横部、１３…
…蓋部、１４……液状エポキシ。
1 to 3 are cross-sectional views showing an embodiment of the present invention, FIG. 4 is a top view showing a part of the manufacturing process, and FIGS. 5 and 6 are views of a conventional semiconductor optical coupling device. FIG. 3 is a cross-sectional view showing main parts. 1... Container, 2... Window, 3... Transparent cap, 4... Optical fiber, 5... Transparent resin, 6...
Lead, 7... Light emitting element, 8... Light receiving element, 10
... recessed part, 11 ... foot part, 12 ... side part, 13 ...
...Lid part, 14...Liquid epoxy.
補正 平１．２．１７ 図面の簡単な説明を次のように補正する。Correction: Heisei 1.2.17 The brief description of the drawing has been amended as follows.
【図面の簡単な説明】
第１図乃至第３図は、本考案の実施例を示す断
面図、第４図は、その製造工程の一部を示す上面
図、第５図、第６図及び第７図は、従来の半導体
光結合装置の要部を示す断面図である。
１……容器、２……窓部、３……透明キヤツプ
、４……光フアイバー、５……透明樹脂、６……
リード、７……発光素子、８……受光樹脂、１０
……凹部素子、１１……足部、１２……横部、１
３……蓋部、１４……液状エポキシ。[Brief Description of the Drawings] Figures 1 to 3 are cross-sectional views showing embodiments of the present invention, Figure 4 is a top view showing a part of the manufacturing process, and Figures 5, 6, and FIG. 7 is a sectional view showing the main parts of a conventional semiconductor optical coupling device. 1... Container, 2... Window, 3... Transparent cap, 4... Optical fiber, 5... Transparent resin, 6...
Lead, 7... Light emitting element, 8... Light receiving resin, 10
...Recessed element, 11... Foot part, 12... Lateral part, 1
3...Lid part, 14...Liquid epoxy.
Claims (1)
、相対向して配置する両素子を夫々固着する透明
樹脂層と、この両樹脂層間を結んで配置し光軸を
形成する光フアイバーと、この両素子と光フアイ
バーを収容し、リードを導出する開孔部を備えた
容器と、発光素子に対応するこの容器に形成して
可視光波長をモニタリングする窓部と、この開孔
部を覆う蓋部と、前記容器、蓋部及びリード間を
塞ぐ封止樹脂層とを具備することを特徴とする半
導体光結合素子。 A light-receiving element and a light-emitting element mounted on a lead, a transparent resin layer that fixes both elements arranged facing each other, an optical fiber that connects these two resin layers and forms an optical axis, and these two elements. A container containing an optical fiber and having an opening for leading out a lead, a window formed in the container corresponding to a light emitting element to monitor visible light wavelengths, and a lid covering the opening. A semiconductor optical coupling device comprising the container, a lid, and a sealing resin layer that closes between the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988138863U JPH0260262U (en) | 1988-10-25 | 1988-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988138863U JPH0260262U (en) | 1988-10-25 | 1988-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260262U true JPH0260262U (en) | 1990-05-02 |
Family
ID=31401595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988138863U Pending JPH0260262U (en) | 1988-10-25 | 1988-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260262U (en) |
-
1988
- 1988-10-25 JP JP1988138863U patent/JPH0260262U/ja active Pending