JPH0459964U - - Google Patents
Info
- Publication number
- JPH0459964U JPH0459964U JP1990102184U JP10218490U JPH0459964U JP H0459964 U JPH0459964 U JP H0459964U JP 1990102184 U JP1990102184 U JP 1990102184U JP 10218490 U JP10218490 U JP 10218490U JP H0459964 U JPH0459964 U JP H0459964U
- Authority
- JP
- Japan
- Prior art keywords
- light
- unevenness
- transmitting part
- package structure
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案による半導体素子のパツケージ
構造の一実施例を示す斜視図、第２図は第１図記
載の実施例の平面図、第３図は第１図記載の実施
例の断面図、第４図は従来の半導体素子のパツケ
ージ構造の一例を示す正面図である。
１……ピン、２……セラミツクステム、３……
チツプ、４……ワイヤ、５……レンズ、６……リ
ード、１１……樹脂、１１ａ……透明窓、１１ｂ
……梨地部分。
1 is a perspective view showing an embodiment of the package structure of a semiconductor device according to the present invention, FIG. 2 is a plan view of the embodiment shown in FIG. 1, and FIG. 3 is a sectional view of the embodiment shown in FIG. 1. , FIG. 4 is a front view showing an example of a conventional package structure of a semiconductor device. 1...Pin, 2...Ceramic stem, 3...
Chip, 4...Wire, 5...Lens, 6...Lead, 11...Resin, 11a...Transparent window, 11b
...Nashiji part.
Claims (1)
一部に凹凸のない鏡面状の透光部が形成され、そ
の他の部分には微細な凹凸を有する非透光部が形
成されていることを特徴とする半導体素子のパツ
ケージ構造。 A transparent resin covering the light emitting or light receiving semiconductor element is characterized in that a mirror-like light-transmitting part with no unevenness is formed in a part, and a non-light-transmitting part with fine unevenness is formed in the other part. The package structure of semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102184U JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102184U JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459964U true JPH0459964U (en) | 1992-05-22 |
Family
ID=31846215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990102184U Pending JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |
-
1990
- 1990-10-01 JP JP1990102184U patent/JPH0459964U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |