JPH0260274U - - Google Patents

Info

Publication number
JPH0260274U
JPH0260274U JP13892088U JP13892088U JPH0260274U JP H0260274 U JPH0260274 U JP H0260274U JP 13892088 U JP13892088 U JP 13892088U JP 13892088 U JP13892088 U JP 13892088U JP H0260274 U JPH0260274 U JP H0260274U
Authority
JP
Japan
Prior art keywords
thermal expansion
expansion coefficient
mounting seat
circuit board
outsert molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13892088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0610716Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13892088U priority Critical patent/JPH0610716Y2/ja
Publication of JPH0260274U publication Critical patent/JPH0260274U/ja
Application granted granted Critical
Publication of JPH0610716Y2 publication Critical patent/JPH0610716Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP13892088U 1988-10-25 1988-10-25 回路基板 Expired - Lifetime JPH0610716Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13892088U JPH0610716Y2 (ja) 1988-10-25 1988-10-25 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13892088U JPH0610716Y2 (ja) 1988-10-25 1988-10-25 回路基板

Publications (2)

Publication Number Publication Date
JPH0260274U true JPH0260274U (2) 1990-05-02
JPH0610716Y2 JPH0610716Y2 (ja) 1994-03-16

Family

ID=31401700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13892088U Expired - Lifetime JPH0610716Y2 (ja) 1988-10-25 1988-10-25 回路基板

Country Status (1)

Country Link
JP (1) JPH0610716Y2 (2)

Also Published As

Publication number Publication date
JPH0610716Y2 (ja) 1994-03-16

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