JPH0260279U - - Google Patents
Info
- Publication number
- JPH0260279U JPH0260279U JP13852688U JP13852688U JPH0260279U JP H0260279 U JPH0260279 U JP H0260279U JP 13852688 U JP13852688 U JP 13852688U JP 13852688 U JP13852688 U JP 13852688U JP H0260279 U JPH0260279 U JP H0260279U
- Authority
- JP
- Japan
- Prior art keywords
- heating furnace
- furnace
- mount type
- surface mount
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13852688U JPH0644133Y2 (ja) | 1988-10-24 | 1988-10-24 | 表面実装型部品の実装ライン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13852688U JPH0644133Y2 (ja) | 1988-10-24 | 1988-10-24 | 表面実装型部品の実装ライン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260279U true JPH0260279U (2) | 1990-05-02 |
| JPH0644133Y2 JPH0644133Y2 (ja) | 1994-11-14 |
Family
ID=31400944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13852688U Expired - Lifetime JPH0644133Y2 (ja) | 1988-10-24 | 1988-10-24 | 表面実装型部品の実装ライン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644133Y2 (2) |
-
1988
- 1988-10-24 JP JP13852688U patent/JPH0644133Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644133Y2 (ja) | 1994-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0376055A3 (en) | Method of soldering a wireless component and circuit board with a soldered wireless component | |
| JPH02192792A (ja) | 低耐熱性電子部品の半田付け方法 | |
| JPH0423160U (2) | ||
| JPS5822763U (ja) | チツプ状部品の取付装置 | |
| JPS63136352U (2) | ||
| JPS62109481U (2) | ||
| JPS6235695A (ja) | 両面実装部品の半田付け方法 | |
| JPH04121781U (ja) | プリント基板のパツド構造 | |
| JPS6477991A (en) | Printed circuit board | |
| JPH04121778U (ja) | プリント基板のパツド | |
| JPH01163368U (2) | ||
| JPH0397969U (2) | ||
| JPH02110374U (2) | ||
| JPS63114074U (2) | ||
| JPH0397970U (2) | ||
| JPS60116263U (ja) | 印刷配線板 | |
| JPH04299890A (ja) | 電子部品の実装方法 | |
| JPS6085864U (ja) | プリント基板のチツプ部品搭載構造 | |
| JPS58129674U (ja) | 複合基板へのチツプ型部品はんだ付け方法 | |
| JPS58171890A (ja) | プリント基板のはんだ付方法 | |
| JPS59161092A (ja) | はんだ付け方法 | |
| JPH0459182U (2) | ||
| JPS58150862U (ja) | チツプ部品取付装置 | |
| JPH0215767U (2) | ||
| JPH0369269U (2) |