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Fujitsu Ltd
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Fujitsu Ltd
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Application filed by Fujitsu LtdfiledCriticalFujitsu Ltd
Priority to JP13852688UpriorityCriticalpatent/JPH0644133Y2/ja
Publication of JPH0260279UpublicationCriticalpatent/JPH0260279U/ja
Application grantedgrantedCritical
Publication of JPH0644133Y2publicationCriticalpatent/JPH0644133Y2/ja
Method for producing electronic circuit device, jig for making solder residue uniform, jig for transferring solder paste, and apparatus for producing electronic circuit device
Solder Pastes for SM Technology Heraeus of Hanau, W. Germany, have introduced a new solder paste (Series SC 3300), designed for SM technology. Heraprint and Cermalloy solder paste formulations eliminate the formulation of solder balls during reflow, thus assuring very high yields. The organic system in these materials