JPH0260322U - - Google Patents
Info
- Publication number
- JPH0260322U JPH0260322U JP13908988U JP13908988U JPH0260322U JP H0260322 U JPH0260322 U JP H0260322U JP 13908988 U JP13908988 U JP 13908988U JP 13908988 U JP13908988 U JP 13908988U JP H0260322 U JPH0260322 U JP H0260322U
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- case
- opening
- electronic component
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案の一実施例を用いた圧電共振子
の正面断面図。第２図は、本考案の別の実施例を
用いた圧電共振子の正面断面図。第３図は本考案
の一実施例の斜視図。第４図は、従来の圧電共振
子の正面断面図。第５図は従来の電子部品の封止
構造を表す部分断面図。
１……圧電共振子、２……端子、２ａ……突起
部、２ｂ……クランク部、３……ケース、３ａ…
…凸部、４……圧電共振素子、５……スプリング
材、６……シール止めシート、７……シール樹脂
。
FIG. 1 is a front sectional view of a piezoelectric resonator using an embodiment of the present invention. FIG. 2 is a front sectional view of a piezoelectric resonator using another embodiment of the present invention. FIG. 3 is a perspective view of an embodiment of the present invention. FIG. 4 is a front sectional view of a conventional piezoelectric resonator. FIG. 5 is a partial cross-sectional view showing a conventional sealing structure of an electronic component. DESCRIPTION OF SYMBOLS 1...Piezoelectric resonator, 2...Terminal, 2a...Protrusion, 2b...Crank part, 3...Case, 3a...
...Convex portion, 4...Piezoelectric resonant element, 5...Spring material, 6...Sealing sheet, 7...Sealing resin.
Claims (1)
にシール止めシートを配置し、更にシール樹脂を
充填することにより該ケースの開口部を封止した
電子部品の封止構造において、 上記シール止めシートと上記ケースの内壁と上
記ケースの開口部に設けられた凸部によつて形成
された空間にシール樹脂を充填した電子部品の封
止構造。[Scope of Claim for Utility Model Registration] Sealing of an electronic component in which a sealing sheet is placed in the opening of a case of an electronic component that houses component elements, and the opening of the case is further sealed by filling with sealing resin. In the structure, a sealing structure for an electronic component, wherein a space formed by the sealing sheet, an inner wall of the case, and a convex portion provided at an opening of the case is filled with a sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13908988U JPH0260322U (en) | 1988-10-25 | 1988-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13908988U JPH0260322U (en) | 1988-10-25 | 1988-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260322U true JPH0260322U (en) | 1990-05-02 |
Family
ID=31402024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13908988U Pending JPH0260322U (en) | 1988-10-25 | 1988-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260322U (en) |
-
1988
- 1988-10-25 JP JP13908988U patent/JPH0260322U/ja active Pending