JPH0261104B2 - - Google Patents
Info
- Publication number
- JPH0261104B2 JPH0261104B2 JP1503683A JP1503683A JPH0261104B2 JP H0261104 B2 JPH0261104 B2 JP H0261104B2 JP 1503683 A JP1503683 A JP 1503683A JP 1503683 A JP1503683 A JP 1503683A JP H0261104 B2 JPH0261104 B2 JP H0261104B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- airtight terminal
- uneven surface
- sealing
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000005394 sealing glass Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000010935 stainless steel Substances 0.000 claims description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- 238000002161 passivation Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 9
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 7
- 229910000423 chromium oxide Inorganic materials 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【発明の詳細な説明】
技術分野
この発明は気密端子に関し、特に金属外環およ
びリード線をステンレスで形成した高耐圧型の気
密端子に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an airtight terminal, and more particularly to a high voltage hermetic terminal in which a metal outer ring and lead wires are made of stainless steel.
背景技術
気密端子は各種電気機器の密閉容器等からの端
子の導出にひろく用いられている。この種の気密
端子は、一般にその金属外環が鉄、低炭素鋼、コ
バール（Fe・Ni・Co合金）等で、またリード線
がFe・Ni合金、コバール等で形成されるが、人
工衛星や海底ケーブル用等の長期にわたつて錆が
発生しないことが要求される分野では、金属外環
およびリード線をステンレスで形成する場合があ
る。BACKGROUND ART Airtight terminals are widely used to lead out terminals from sealed containers of various electrical devices. In general, the metal outer ring of this type of airtight terminal is made of iron, low carbon steel, Kovar (Fe/Ni/Co alloy), etc., and the lead wire is made of Fe/Ni alloy, Kovar, etc. In fields where long-term rust resistance is required, such as for submarine cables and submarine cables, the metal outer ring and lead wires are sometimes made of stainless steel.
第１図はステンレス製気密端子の一例の平面図
を示し、第２図は第１図の−線に沿う断面図
を示す。図において、１はSUS304等のステンレ
スよりなる金属外環で、一部縮径した外面に雄ネ
ジ２が刻設されている。３はソーダバリウムガラ
ス等よりなる封着ガラス、４は封着ガラス３によ
つて金属外環１と絶縁して気密に封着されたステ
ンレス製のリード線である。このような気密端子
は、第３図に示すように、リード線４に水素処理
を施すことによつて、ステンレス中のクロムの選
択酸化を行なうと、約400Kg／cm2の圧力に耐える
高耐圧気密端子が得られるが、それ以上の圧力に
耐えるものはなかつた。しかるに、最近ますます
高耐圧型のものが要求されるようになつてきてい
る。 FIG. 1 shows a plan view of an example of a stainless steel airtight terminal, and FIG. 2 shows a sectional view taken along the line - in FIG. In the figure, reference numeral 1 denotes a metal outer ring made of stainless steel such as SUS304, and a male thread 2 is carved on the partially reduced diameter outer surface. 3 is a sealing glass made of soda barium glass or the like, and 4 is a stainless steel lead wire that is insulated and hermetically sealed to the metal outer ring 1 by the sealing glass 3. As shown in Figure 3, if the lead wire 4 is hydrogen treated to selectively oxidize the chromium in the stainless steel, this type of airtight terminal can withstand a pressure of approximately 400 kg/ cm2 . Although an airtight terminal was obtained, there was nothing that could withstand more pressure. However, recently there has been an increasing demand for high-voltage type devices.
発明の開示
それゆえ、この発明の主たる目的は、ステンレ
ス製のより高耐圧の気密端子を提供することであ
る。DISCLOSURE OF THE INVENTION Therefore, the main object of the present invention is to provide a higher voltage resistant airtight terminal made of stainless steel.
この発明は要約すると、リード線の全面が微細
な凹凸面を有し、かつ封着ガラスから露出した凹
凸面上に不動態化膜を形成したことを特徴とす
る。 To summarize, the present invention is characterized in that the entire surface of the lead wire has a finely uneven surface, and a passivation film is formed on the uneven surface exposed from the sealing glass.
すなわち、金属外環と封着ガラスとの封着界面
の面積は比較的大きいので、封着強度、換言すれ
ば耐圧的に有利であるが、リード線の表面積は小
さいので、当然にリード線と封着ガラスとの封着
界面の面積も小さく、耐圧的に不利である。そこ
で、リード線の全面にエツチング処理によつて微
細な凹凸面を形成して、その表面積の増大を図
り、もつて封着ガラスとの封着界面の面積増大を
図るとともに、凹凸面によつてリード線と封着ガ
ラスが機械的に出入りの多い複雑な封着界面にな
ることによつて、封着強度の増大を図つて耐圧力
を高くしたものである。また、リード線の全面に
微細な凹凸面を形成してクロムの酸化膜を介して
封着ガラスと封着したのち、リード線の露出表面
のクロムの酸化膜を単に除去しただけでは、凹凸
面から発錆しやすいので、この凹凸面上に不働態
化膜を形成して発錆を防止するようにしたもので
ある。この結果、発錆のない高耐圧の気密端子が
得られるのである。 In other words, since the area of the sealing interface between the metal outer ring and the sealing glass is relatively large, it is advantageous in terms of sealing strength, in other words, pressure resistance, but since the surface area of the lead wire is small, it naturally The area of the sealing interface with the sealing glass is also small, which is disadvantageous in terms of pressure resistance. Therefore, we tried to increase the surface area by forming a finely uneven surface on the entire surface of the lead wire by etching, thereby increasing the area of the sealing interface with the sealing glass. By forming a complex sealing interface where the lead wire and the sealing glass are mechanically moved in and out, the sealing strength is increased and the pressure resistance is increased. In addition, if a finely uneven surface is formed on the entire surface of the lead wire and it is sealed with the sealing glass via a chromium oxide film, then simply removing the chromium oxide film on the exposed surface of the lead wire will not work. Since rust is likely to occur from the surface, a passivation film is formed on this uneven surface to prevent rust from forming. As a result, a high-voltage, airtight terminal that does not cause rust can be obtained.
発明を実施するための最良の形態
以下、この発明の一実施例の気密端子について
第４図ないし第７図を参照して説明する。第４図
は気密端子の平面図で、第５図は第４図の−
線に沿う断面図であり、第６図はリード線と封着
ガラスの要部拡大断面図である。また、第７図は
気密端子の製造方法例について説明するためのブ
ロツクダイヤグラムである。図において、次の点
を除いては第１図および第２図と同様であり、同
一部分には同一参照符号を付している。第４図お
よび第５図が第１図および第２図と相違している
のは、金属外環１の内面に段部５を設けて、この
段部５で封着ガラス３の一端面を規制しているこ
とである。このようにすれば、第５図の矢印方向
からの圧力に対して、前記段部５が封着ガラス３
を介して加わる圧力を受け止めるので高耐圧化に
有利である。また、リード線４の表面は、第６図
から明らかなように、微細な凹凸面６を有し、封
着ガラス３との封着界面にはクロムの酸化膜７を
有し、封着ガラス３から露出する凹凸面６上には
不働態化膜８を有する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a hermetic terminal according to an embodiment of the present invention will be described with reference to FIGS. 4 to 7. Figure 4 is a plan view of the airtight terminal, and Figure 5 is the - of Figure 4.
6 is a sectional view along the line, and FIG. 6 is an enlarged sectional view of the main parts of the lead wire and the sealing glass. Further, FIG. 7 is a block diagram for explaining an example of a method for manufacturing an airtight terminal. The figure is similar to FIGS. 1 and 2 except for the following points, and the same parts are given the same reference numerals. The difference between FIGS. 4 and 5 from FIGS. 1 and 2 is that a step 5 is provided on the inner surface of the metal outer ring 1, and this step 5 covers one end surface of the sealing glass 3. It is regulated. In this way, the step portion 5 can be protected against the pressure from the direction of the arrow in FIG.
It is advantageous for high pressure resistance because it absorbs the pressure applied through it. Further, as is clear from FIG. 6, the surface of the lead wire 4 has a finely uneven surface 6, and has a chromium oxide film 7 at the sealing interface with the sealing glass 3. A passivation film 8 is provided on the uneven surface 6 exposed from the surface 3 .
上記気密端子は例えば次のようにして製造され
る。まず、金属外環１を製作し、トリクレン等で
脱脂を行ない、必要に応じて、塩酸で軽く酸洗い
を施す。また、リード線４を製作し、上記と同様
に脱脂したのち、硝酸によりエツチングしてその
全面に微細な凹凸面６を形成し、次いで水素気流
中で高温加熱して凹凸面６の全面にクロムの酸化
膜７を形成する。一方、ガラス微粉末を有機バイ
ンダと共に混練し、プレス成型後焼結して有機バ
インダを焼き飛ばして、ガラスタブレツトを製作
する。上記金属外環１、ガラスタブレツトおよび
リード線４を、グラフアイト製の封着治具を用い
て所定の関係位置に組み立て、中性または弱還元
性雰囲気中で約1000℃程度に加熱する。すると、
前記ガラスタブレツトが溶融した封着ガラス３を
介して金属外環１内にリード線４が気密絶縁的に
封着された気密端子が得られる。こののち、二酸
化マンガン溶液に浸漬して安定なクロムの酸化膜
７をマンガン酸化物に変換して、封着ガラス３か
ら露出したリード線４の表面のクロムの酸化膜７
を除去する。最後に、例えば濃硝酸：水＝４：１
（容積比）の硝酸水溶液を50℃に保ち、この中に
上記気密端子を約20分間浸漬して、前記リード線
４の露出部分の凹凸面６上に不働態化処理を施し
て不働態化膜８を形成する。 The above-mentioned airtight terminal is manufactured, for example, as follows. First, the metal outer ring 1 is manufactured, degreased with trichloride, etc., and if necessary, lightly pickled with hydrochloric acid. Further, a lead wire 4 is manufactured, degreased in the same manner as above, etched with nitric acid to form a finely uneven surface 6 on its entire surface, and then heated at high temperature in a hydrogen stream to chrome the entire surface of the uneven surface 6. oxide film 7 is formed. On the other hand, a glass tablet is manufactured by kneading fine glass powder with an organic binder, press-molding and sintering to burn off the organic binder. The metal outer ring 1, glass tablet, and lead wire 4 are assembled in predetermined relative positions using a graphite sealing jig, and heated to about 1000° C. in a neutral or weakly reducing atmosphere. Then,
An airtight terminal is obtained in which the lead wire 4 is hermetically and insulatively sealed inside the metal outer ring 1 via the sealing glass 3 in which the glass tablet is melted. Thereafter, the stable chromium oxide film 7 is converted into manganese oxide by immersion in a manganese dioxide solution, and the chromium oxide film 7 on the surface of the lead wire 4 exposed from the sealing glass 3 is
remove. Finally, for example, concentrated nitric acid:water = 4:1
(volume ratio) of nitric acid aqueous solution is maintained at 50°C, and the airtight terminal is immersed in this solution for about 20 minutes to perform a passivation treatment on the uneven surface 6 of the exposed portion of the lead wire 4 to passivate it. A film 8 is formed.
上記の気密端子は約700Kg／cm2以上の圧力に耐
え、しかも発錆が認められなかつた。これに対し
て、リード線４に凹凸面を形成して封着後、リー
ド線４の露出部分のクロムの酸化膜７を除去した
のみで、不働態化膜を形成しなかつた場合は、耐
圧的にはほぼ同様の値が得られたが、常温、常湿
下で数日間放置すると、赤褐色の錆が発生した。 The airtight terminal described above withstood a pressure of approximately 700 kg/cm 2 or more, and no rust was observed. On the other hand, if the chromium oxide film 7 on the exposed portion of the lead wire 4 is only removed after forming an uneven surface on the lead wire 4 and sealing it, but no passivation film is formed, the withstand voltage Almost the same values were obtained, but reddish-brown rust developed when left at room temperature and humidity for several days.
第１図は従来のステンレス製気密端子の一例の
平面図である。第２図は第１図の気密端子の−
線に沿う矢印方向の断面図である。第３図は従
来の気密端子の製造方法について説明するための
ブロツクダイヤグラムである。第４図はこの発明
の気密端子の一実施例の平面図である。第５図は
第４図の気密端子の−線に沿う矢印方向の断
面図である。第６図は第５の要部の拡大断面図で
ある。第７図はこの発明の気密端子の製造方法例
について説明するためのブロツクダイヤグラムで
ある。
１……金属外環、３……封着ガラス、４……リ
ード線、５……段部、６……凹凸面、７……クロ
ムの酸化膜、８……不働態化膜。
FIG. 1 is a plan view of an example of a conventional stainless steel airtight terminal. Figure 2 shows the hermetic terminal shown in Figure 1.
FIG. 3 is a cross-sectional view along the line in the direction of the arrow. FIG. 3 is a block diagram for explaining a conventional method of manufacturing an airtight terminal. FIG. 4 is a plan view of an embodiment of the airtight terminal of the present invention. FIG. 5 is a sectional view of the airtight terminal in FIG. 4 taken along the - line in the direction of the arrow. FIG. 6 is an enlarged sectional view of the fifth main part. FIG. 7 is a block diagram for explaining an example of a method for manufacturing an airtight terminal according to the present invention. DESCRIPTION OF SYMBOLS 1... Metal outer ring, 3... Sealing glass, 4... Lead wire, 5... Step portion, 6... Uneven surface, 7... Chromium oxide film, 8... Passivation film.
Claims (1)
ステンレス製のリード線を気密絶縁的に封着して
なる気密端子において、 前記リード線は全面に微細な凹凸面を有し、か
つ封着ガラスから露出した凹凸面上に不働態化膜
を有することを特徴とする気密端子。[Scope of Claims] 1. An airtight terminal in which a stainless steel lead wire is hermetically and insulatively sealed inside a stainless steel metal outer ring through glass, the lead wire having a finely uneven surface on its entire surface. and a passivation film on the uneven surface exposed from the sealing glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1503683A JPS59141179A (en) | 1983-01-31 | 1983-01-31 | Airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1503683A JPS59141179A (en) | 1983-01-31 | 1983-01-31 | Airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59141179A JPS59141179A (en) | 1984-08-13 |
| JPH0261104B2 true JPH0261104B2 (en) | 1990-12-19 |
Family
ID=11877605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1503683A Granted JPS59141179A (en) | 1983-01-31 | 1983-01-31 | Airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59141179A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353291A (en) * | 2004-06-08 | 2005-12-22 | Fuji Denka:Kk | Airtight terminal and manufacturing method of the same |
| JP2010135615A (en) * | 2008-12-05 | 2010-06-17 | Nec Schott Components Corp | Airtight terminal for outdoor electronic apparatus, and method of manufacturing the same |
| JP5278956B2 (en) | 2009-04-08 | 2013-09-04 | エヌイーシー ショット コンポーネンツ株式会社 | High pressure-resistant and airtight terminal and manufacturing method thereof |
| JP7566154B2 (en) * | 2021-06-28 | 2024-10-11 | 京セラ株式会社 | Airtight Terminal |
-
1983
- 1983-01-31 JP JP1503683A patent/JPS59141179A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59141179A (en) | 1984-08-13 |
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