JPH026271U - - Google Patents
Info
- Publication number
- JPH026271U JPH026271U JP8549088U JP8549088U JPH026271U JP H026271 U JPH026271 U JP H026271U JP 8549088 U JP8549088 U JP 8549088U JP 8549088 U JP8549088 U JP 8549088U JP H026271 U JPH026271 U JP H026271U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- probe
- semiconductor device
- support member
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
Description
第１図は本考案装置の一具体例の一部分を断面
にした正面図、第２図および第３図はターミナル
の整列パターンを例示するベースプレートの上面
図、第４図および第５図はプローブの形状を例示
する正面図である。また第６図は半導体装置の一
般的な形状と構造を例示する斜視図、第７図は半
導体装置を特性検査する装置の一具体例を示す部
分断面図である。
１……フラツトパツケージ型半導体装置、１０
……プローブ、１１……ターミナル、１２……コ
イルスプリング、１３……ベースプレート、１４
……吸着支持部材、１５……プリント基板。
FIG. 1 is a partially sectional front view of a specific example of the device of the present invention, FIGS. 2 and 3 are top views of a base plate illustrating the alignment pattern of the terminals, and FIGS. 4 and 5 are views of the probe. It is a front view which illustrates a shape. Further, FIG. 6 is a perspective view illustrating the general shape and structure of a semiconductor device, and FIG. 7 is a partial sectional view illustrating a specific example of an apparatus for testing characteristics of a semiconductor device. 1...Flat package type semiconductor device, 10
... Probe, 11 ... Terminal, 12 ... Coil spring, 13 ... Base plate, 14
...Adsorption support member, 15...Printed circuit board.
Claims (1)
ージ型半導体装置の各リードと対応して接触する
複数本のプローブを下方に向けて突設し、各プロ
ーブを測定装置に電気的に接続する複数本のター
ミナルを、上記ベースプレート上面周縁に整列さ
せて突設すると共に、前記プローブならびにター
ミナルを前記半導体装置のリードに対して位置決
め固定するための吸着支持部材を、前記ベースプ
レートの下面に設けたことを特徴とするフラツト
パツケージ型半導体装置の特性検査装置。 A plurality of probes are provided protruding downward from the periphery of the lower surface of the base plate to correspond to and contact each lead of the flat package type semiconductor device, and a plurality of terminals are provided to electrically connect each probe to the measurement device. , the base plate is characterized in that a suction support member is provided on the lower surface of the base plate, the suction support member being aligned and protruding from the periphery of the upper surface of the base plate, and for positioning and fixing the probe and the terminal to the leads of the semiconductor device. Characteristic inspection equipment for package-type semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8549088U JPH026271U (en) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8549088U JPH026271U (en) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH026271U true JPH026271U (en) | 1990-01-16 |
Family
ID=31310158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8549088U Pending JPH026271U (en) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH026271U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54181005U (en) * | 1978-06-12 | 1979-12-21 |
-
1988
- 1988-06-27 JP JP8549088U patent/JPH026271U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54181005U (en) * | 1978-06-12 | 1979-12-21 |
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