JPH0262967A - センサ - Google Patents

センサ

Info

Publication number
JPH0262967A
JPH0262967A JP1104824A JP10482489A JPH0262967A JP H0262967 A JPH0262967 A JP H0262967A JP 1104824 A JP1104824 A JP 1104824A JP 10482489 A JP10482489 A JP 10482489A JP H0262967 A JPH0262967 A JP H0262967A
Authority
JP
Japan
Prior art keywords
pendulum
sensor
bonding wire
vehicle
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1104824A
Other languages
English (en)
Japanese (ja)
Inventor
Jiri Marek
ジリ・マレク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH0262967A publication Critical patent/JPH0262967A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Air Bags (AREA)
  • Pressure Sensors (AREA)
  • Automotive Seat Belt Assembly (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
JP1104824A 1988-05-03 1989-04-26 センサ Pending JPH0262967A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8805846U DE8805846U1 (de) 1988-05-03 1988-05-03 Sensor
DE8805846.8 1988-05-03

Publications (1)

Publication Number Publication Date
JPH0262967A true JPH0262967A (ja) 1990-03-02

Family

ID=6823646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1104824A Pending JPH0262967A (ja) 1988-05-03 1989-04-26 センサ

Country Status (2)

Country Link
JP (1) JPH0262967A (de)
DE (1) DE8805846U1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629937U (ja) * 1992-04-27 1994-04-19 株式会社村上開明堂 インナーミラー脱落機構
JPH0829446A (ja) * 1994-07-15 1996-02-02 Honda Motor Co Ltd 半導体加速度センサ
CN100335905C (zh) * 2001-09-04 2007-09-05 东京毅力科创株式会社 具有可动质量块的微结构
US11987494B2 (en) 2020-11-24 2024-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wire-bond damper for shock absorption

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023117638A1 (de) 2023-07-04 2025-01-09 Valeo Schalter Und Sensoren Gmbh Fahrzeugvorrichtung zur Detektion einer externen Krafteinwirkung auf ein Fahrzeug, Informationssystem, sowie Fahrzeug

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629937U (ja) * 1992-04-27 1994-04-19 株式会社村上開明堂 インナーミラー脱落機構
JPH0829446A (ja) * 1994-07-15 1996-02-02 Honda Motor Co Ltd 半導体加速度センサ
CN100335905C (zh) * 2001-09-04 2007-09-05 东京毅力科创株式会社 具有可动质量块的微结构
US11987494B2 (en) 2020-11-24 2024-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wire-bond damper for shock absorption
KR20240112795A (ko) * 2020-11-24 2024-07-19 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 충격 흡수를 위한 와이어-본드 댐퍼
US12358783B2 (en) 2020-11-24 2025-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Wire-bond damper for shock absorption

Also Published As

Publication number Publication date
DE8805846U1 (de) 1989-09-07

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