JPH0263197A - Electronic component mounting equipment - Google Patents

Abstract

PURPOSE:To improve a component mounting efficiency by locating a substage upward of a supply unit and by getting the supply unit in and out from below the substage freely by the use of X and Y direction transfer units and by establishing an adjustment unit of an up-and-down stroke of a nozzle of a subtransfer head. CONSTITUTION:When an electronic component P is picked up from a wafer 15 by a nozzle 1 of a subtransfer head A, it is moved right below the nozzle 1 by X and Y direction transfer units 18 and 19. Thus, the wafer 15 is moved in the X and Y direction. However, since the wafer 15 can by moved in and out from below a substage 11 freely, rapid mounting is available. An up-and- down stroke of the nozzle 1 of the subtransfer head A should be large when picking up the electronic component P and small when getting it down. The up-and-down stroke is adjusted by an up-and-down stroke adjusting unit 56.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, in which a supply unit for electronic components such as wafers and trays can be freely moved in and out from below the substage. This shortens the lateral stroke and increases the mounting speed.

(Prior Art) FIG. 6 shows a conventional electronic component mounting apparatus, which is equipped with a sub-transfer head 101 and a mount head 102, and mounts electronic components onto the sub-transfer rad 101. By reciprocating between the supply section 103 and the substage 104 and between the substage 104 and the substrate 6 disposed on the positioning section 105, the electronic component P is mounted on the substrate 106. Correction of the positional shift and mounting of the electronic component P onto the board 106 are performed as a series of operations. 101a is a nozzle that sucks the electronic component P; 107 and 108 are XY direction moving devices for moving the wafer 109 in the XY force directions so that the nozzle 101a can pick up the desired electronic component P; 110 is a nozzle on the wafer 109; This is a die ejector that pushes up the electronic component P. Also substage 104
is a stage for correcting the positional deviation of the electronic component P in the XYθ directions and for recognizing the appearance.

(Problem to be Solved by the Invention) As described above, the wafer 109 is
7, 108 in the XY force direction to move the electronic component P to be pinked up directly below the nozzle l01a. Therefore, when the wafer 109 approaches the sub-stage 104, the wafer 109 104.1 to avoid collision with the stage 104.
09 interval T must be set.

However, in recent years, supply units for electronic components such as wafers and trays have tended to become larger.
04, 109 is also larger, and therefore the lateral stroke D of the sub-transfer head 101 is also longer,
The time required for the heads 101 and 102 to move in the lateral direction increases accordingly, and the mounting speed tends to gradually decrease.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a means for increasing mounting efficiency by shortening the lateral stroke of the sub-transfer and mounting heads.

(Means for Solving the Problems) For this purpose, the present invention reciprocates a sub-transfer head and a mount head, which are equipped with nozzles for mounting electronic components, in the lateral direction by a lateral movement device, and then XY
By reciprocating between the electronic component supply unit disposed on the directional movement device and the substage, and between the substage and the substrate disposed on the XY direction movement device, the substrate In an electronic component mounting apparatus that performs misalignment correction of electronic components mounted on a board and mounting of electronic components on a board as a series of operations, the substage is disposed above the supply unit, and the supply unit is It is conveyed by the xY direction moving device so that it can move in and out below the sub-stage, and is also provided with an adjustment device for the vertical stroke of the nozzle of the sub-transfer head.

(Function) According to the above configuration, since the supply unit can freely enter below the sub-stage, the lateral stroke of the sub-transfer head is shortened, and therefore the lateral stroke of the mount head is also shortened, and the sub-transfer head is shortened. Mounting work is carried out efficiently as the mounting head moves back and forth between the supply unit and the substage and between the substage and the substrate.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus, which has three heads: a sub-transfer head A, a mounting head B, and a transfer head C. These three heads A, B, and C basically have the same structure, but while the sub-transfer head A and the mount head B are equipped with a nozzle 1 that sucks electronic components, the transfer head C is It has a structural difference in that it is equipped with a transfer bottle 2 for applying bond. Note that the nozzle may be a guicolet type nozzle equipped with a box-shaped suction part. Also, as will be explained in detail later, these three heads A, B, and C are
A series of tasks such as correcting the misalignment of electronic components, mounting electronic components on the board, and applying bond to the board are performed simultaneously while reciprocating in the horizontal direction.

Reference numeral 3 denotes a support portion, 4 a guide portion provided on the support portion 3, and a fitting portion 22 provided on the back surface of the head AC is slidably fitted into the guide portion 4. Reference numeral 40 denotes a lateral movement device provided on the side of the support section 3, which includes a drive box 41, a drive motor 42, a lifting shaft 43, a swing arm 44; 45, and a loft 46 connected to the head C. When the motor 42 is driven, the three heads A, B, and C integrally slide back and forth in the lateral direction along the guide portion 4.

10.11 and 12.13 are each head A and B.

This is a bond supply section in which an electronic component supply section, a substage, a positioning section for the substrate 14, and a bond plate 9 are placed below C. The substrate may be a lead frame as well as a normal substrate. A wafer 15 serving as a supply unit for electronic components P is placed in the electronic component supply section 10 . 16 is a mounting table for the wafer 15, and 17 is a gouer ejector. As the table 16 rotates, a desired wafer 15 is moved above the gouer ejector 17. Reference numeral 18 and 19 denote an XY direction moving device, which transports the wafer 15 in the XY direction and moves a desired electronic component P to a pickup position directly above the gouer ejector 17.

Note that the supply unit may be a tray or the like.

The substage 11 is a stage for correcting the positional deviation of the electronic component P in the xyθ directions, recognizing the appearance, and the like.

As shown, the substage 11 is disposed above the wafer 15, so that the wafer 15 is
The sub-stage 11 is conveyed to the direction moving device 18 and 19.
can be freely moved in and out from below, thereby shortening the interval T between the pickup position and the sub-stage 11,
A short lateral stroke D allows the sub-transfer head A to move between the pick-up position and the sub-stage 11.

The positioning unit 12 is an xy direction moving device 112a.

12b, and the board 14 set on top of it is
By moving in the Y force direction, the electronic component P is landed at a predetermined position on the board 14. Next, the detailed structure of the mount head B will be explained with reference to FIGS. 2 and 3. Note that, as described above, the other heads A and C also have the same structure as the mount head B.

Reference numeral 21 denotes a frame which is the main body of the mount head B, and as described above, the fitting body 22 which is slidably fitted into the guide portion 4 is attached to the back side of the frame. 25 is a slider, 26 is a first cam driven by the motor M1, 27 is a cam follower, and 28.29 is a link as a first transmission member. When the cam 26 rotates, the slider 25 reciprocates in the front-rear direction N. Sliding. 31 and 32 are guide members of the slider 25.

M2 is a pulse motor provided on the slider 25, 33
is a second cam driven by this motor M2, 34 is a cam follower, and 35 is a second cam that supports this cam follower 34.
The transmission member 30 is a supporting member thereof. 50 is a computer that controls the pulse motor M2. Reference numeral 36 denotes a drive member that is pivotally supported by a pin 37 on the frame 21, and a roll 38 that is pivotally attached to the lower end of the transmission member 35 is in contact with the upper back surface of the drive member. 39 is the driving member 3
A roller 39 is pivotally attached to the tip of 6, and 51 is this roller 39.
is a plate that is grounded, 52 is a lifting shaft for the nozzle 1 that is vertically installed on this plate 51, 53 is a biasing spring material, 5
4 is a guide shaft.

FIG. 4 shows the elevating means shown in FIG. 3 in a simplified manner for easy understanding, and the elevating and lowering operation of the nozzle 1 will be explained next with reference to this figure. When the first cam 26 rotates, the slider 25 reciprocates in the front-rear direction N. Ll is its sliding stroke. Further, as the second cam 33 rotates, the transmission member 35 also moves in the front-rear direction.

L2 is a sliding stroke due to the rotation of the cam 33, and therefore the transmission member 35 reciprocates in the front-rear direction with a total stroke of L1+L2. The driving member 36 is the transmission member 35
5 (a) and swings around the pin 37.
), when the large diameter side of the cam 33 is in contact with the roller 34, the amount of swing of the drive member 36 is large, and therefore the vertical stroke of the nozzle l is large.

Further, as shown in FIG. 2B, when the small diameter side of the cam 33 is in contact with the roller 34, the vertical stroke of the nozzle 1 is small. Therefore, by adjusting the rotation angle of the cam 33, the vertical stroke of the nozzle 1 can be adjusted. In this way, the first cam 26 and the first transmission members 28 and 29 constitute the first drive device 55 of the drive member 36, and the nozzle 1 is driven by this drive device 55 to maintain a constant Go up and down with a stroke.

Further, the second cam 33 and the second transmission member 35 constitute a second drive device 56, and this second drive device 56 controls the nozzle 1 by changing the rotation angle of the cam 33. It is a lifting stroke adjustment device that can adjust the stroke.

This device has the above-mentioned configuration, and includes a lateral movement device 4
0 is driven, the sub-transfer head A moves between the supply unit 15 and the sub-stage 11, the mount head B moves between the sub-stage 11 and the substrate 14, and the transfer head C moves between the substrate 14 and the bond plate 9. The electronic component P is moved back and forth between the two, corrects the positional deviation of the electronic component P, is mounted on the board 14, and is mounted on the board 1.
4 is performed as a series of operations.

By the way, when picking up the electronic component P on the wafer 15 by the nozzle 1 of the sub-transfer head A,
The directional moving devices 18 and 19 are driven, and the electronic component P to be picked up is moved directly below the nozzle 1. In this way, the wafer 15 moves in the XY force directions, but
As mentioned above, since the wafer 15 can freely move in and out from below the sub-stage 11, the lateral stroke D of the sub-transfer head A is short, and therefore the sub-transfer head A is moved in a short period of time between the pick-up position and the sub-stage 11. You can perform mounting work at high speed by going back and forth between the two locations. In addition, the vertical stroke of the nozzle of sub transfer head A is
When picking up the electronic component P above, it must be made larger, and when landing the electronic component P on the substage 11, it must be made smaller. Such adjustment of the lifting stroke is performed by the lifting stroke adjusting device 56. be able to.

(Effects of the Invention) As explained above, the present invention moves the sub-transfer head and the mount head, which are equipped with nozzles for mounting electronic components, in the lateral direction using a lateral movement device, and moves the sub-transfer head in the X and Y directions. By moving the mount head back and forth between the electronic component supply unit installed in the device and the substage, and between the substage and the substrate installed in the XY direction moving device, the electronic components mounted on the substrate are moved. In an electronic component mounting apparatus that performs a series of operations for correcting component positional deviation and mounting electronic components on a board, the substage is disposed above the supply unit, and the supply unit is moved by the XY direction moving device. The sub-stage is transported to the lower part of the sub-stage and can be moved in and out of the sub-stage, and is equipped with an adjustment device for the vertical stroke of the nozzle of the sub-transfer head.
The lateral strokes of the sub-transfer head and the mounting head are shortened, and therefore the cycle time of the lateral reciprocating motion of both heads is increased, making it possible to perform mounting work at high speed. Furthermore, since the vertical stroke of the nozzle of the sub-transfer head can be adjusted, the electronic components on the supply unit can be reliably picked up and landed on the sub-stage.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a front view of the main parts of an electronic component mounting apparatus, Figs. 2 and 3 are perspective views and side views of a nozzle lifting means, and Fig. 4 is a schematic diagram, 5th
The figure is a plan view of the drive section, and FIG. 6 is a front view of the conventional device. l... Nozzle 11... Sub-stage 12a, 12b... XY direction moving device 14... Substrate 15... Supply unit 18.19... XY direction moving device 40... Lateral direction moving device 56...Elevating stroke adjustment device A...Sub transfer head B...Mount head P...Electronic parts addition 2 lines L to 1 Fig.

Claims (1)

[Claims] A sub-transfer head and a mount head equipped with nozzles for mounting electronic components are reciprocated in the lateral direction by a lateral movement device, and the sub-transfer head is moved between an electronic component supply unit and a mount head disposed on the XY-direction movement device. between the stages,
In addition, by reciprocating the mount head between the sub-stage and the substrate placed on the XY direction moving device, a series of operations are performed to correct the positional deviation of the electronic components mounted on the substrate and to mount the electronic components on the substrate. In the electronic component mounting apparatus, the substage is disposed above the supply unit, and the supply unit is transported by the XY direction moving device so that it can move in and out below the substage. An electronic component mounting apparatus characterized by being provided with a device for adjusting the vertical stroke of a nozzle of a head.