JPH0263546U - - Google Patents

Info

Publication number: JPH0263546U
Authority: JP; Japan
Prior art keywords: support; integrated circuit; utility; scope; registration request
Prior art date: 1989-11-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1989128335U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-11-01

Filing date

1989-11-01

Publication date

1990-05-11

1989-11-01 Application filed filed Critical

1989-11-01 Priority to JP1989128335U priority Critical patent/JPH0263546U/ja

1990-05-11 Publication of JPH0263546U publication Critical patent/JPH0263546U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Die Bonding (AREA)

JP1989128335U 1989-11-01 1989-11-01 Pending JPH0263546U (cs)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1989128335U JPH0263546U (cs)	1989-11-01	1989-11-01

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1989128335U JPH0263546U (cs)	1989-11-01	1989-11-01

Publications (1)

Publication Number	Publication Date
JPH0263546U true JPH0263546U (cs)	1990-05-11

Family

ID=31381581

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1989128335U Pending JPH0263546U (cs)	1989-11-01	1989-11-01

Country Status (1)

Country	Link
JP (1)	JPH0263546U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55153042A (en) *	1979-05-17	1980-11-28	Ricoh Co Ltd	Position input device
JPS5666086A (en) *	1979-11-05	1981-06-04	Hitachi Ltd	Electrically insulating board

1989
- 1989-11-01 JP JP1989128335U patent/JPH0263546U/ja active Pending

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55153042A (en) *	1979-05-17	1980-11-28	Ricoh Co Ltd	Position input device
JPS5666086A (en) *	1979-11-05	1981-06-04	Hitachi Ltd	Electrically insulating board

Publication	Publication Date	Title
JPH0263546U (cs)	1990-05-11
JPS62182555U (cs)	1987-11-19
JPH038455U (cs)	1991-01-28
JPH0397939U (cs)	1991-10-09
JPH01179435U (cs)	1989-12-22
JPS62193757U (cs)	1987-12-09
JPH01154646U (cs)	1989-10-24
JPS62184774U (cs)	1987-11-24
JPH03109352U (cs)	1991-11-11
JPS6310572U (cs)	1988-01-23
JPS61205309U (cs)	1986-12-25
JPS6365259U (cs)	1988-04-30
JPS6395244U (cs)	1988-06-20
JPH01113338U (cs)	1989-07-31
JPH01113339U (cs)	1989-07-31
JPH03117928U (cs)	1991-12-05
JPH01112052U (cs)	1989-07-27
JPS61102050U (cs)	1986-06-28
JPH01140170U (cs)	1989-09-26
JPH0313735U (cs)	1991-02-12
JPH01107126U (cs)	1989-07-19
JPH0260249U (cs)	1990-05-02
JPH0273746U (cs)	1990-06-05
JPH01143127U (cs)	1989-10-02
JPS6190251U (cs)	1986-06-12