JPH0263546U - - Google Patents

Info

Publication number
JPH0263546U
JPH0263546U JP1989128335U JP12833589U JPH0263546U JP H0263546 U JPH0263546 U JP H0263546U JP 1989128335 U JP1989128335 U JP 1989128335U JP 12833589 U JP12833589 U JP 12833589U JP H0263546 U JPH0263546 U JP H0263546U
Authority
JP
Japan
Prior art keywords
support
integrated circuit
utility
scope
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989128335U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128335U priority Critical patent/JPH0263546U/ja
Publication of JPH0263546U publication Critical patent/JPH0263546U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図である。 図において、１は支持体、９は集積回路基板で
ある。

Claims (1)

    【実用新案登録請求の範囲】
  1. 支持体上にシリコン半導体からなる集積回路基
    板を添着した集積回路装置において、上記支持体
    をβ―シリコンカーバイドで形成したことを特徴
    とする集積回路装置。
JP1989128335U 1989-11-01 1989-11-01 Pending JPH0263546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128335U JPH0263546U (ja) 1989-11-01 1989-11-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128335U JPH0263546U (ja) 1989-11-01 1989-11-01

Publications (1)

Publication Number Publication Date
JPH0263546U true JPH0263546U (ja) 1990-05-11

Family

ID=31381581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128335U Pending JPH0263546U (ja) 1989-11-01 1989-11-01

Country Status (1)

Country Link
JP (1) JPH0263546U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153042A (en) * 1979-05-17 1980-11-28 Ricoh Co Ltd Position input device
JPS5666086A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Electrically insulating board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153042A (en) * 1979-05-17 1980-11-28 Ricoh Co Ltd Position input device
JPS5666086A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Electrically insulating board

Similar Documents

Publication Publication Date Title
JPH0263546U (ja)
JPS62182555U (ja)
JPS62120355U (ja)
JPH038455U (ja)
JPH0397939U (ja)
JPS622254U (ja)
JPH01179435U (ja)
JPH01154646U (ja)
JPS62184774U (ja)
JPH03109352U (ja)
JPS6310572U (ja)
JPS61205309U (ja)
JPS6365259U (ja)
JPS6395244U (ja)
JPH01113338U (ja)
JPH01113339U (ja)
JPH03117928U (ja)
JPH01112052U (ja)
JPS61102050U (ja)
JPH01140170U (ja)
JPH0313735U (ja)
JPH01107126U (ja)
JPH0260249U (ja)
JPH0273746U (ja)
JPS6319782U (ja)