JPH0263614A - Enamel substrate and its manufacture - Google Patents
Enamel substrate and its manufactureInfo
- Publication number
- JPH0263614A JPH0263614A JP63215098A JP21509888A JPH0263614A JP H0263614 A JPH0263614 A JP H0263614A JP 63215098 A JP63215098 A JP 63215098A JP 21509888 A JP21509888 A JP 21509888A JP H0263614 A JPH0263614 A JP H0263614A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- substrate
- cut
- enamel
- enamel substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Punching Or Piercing (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多数枚取りのホウロウ基板において、手による
切断が可能で、スペースファクター(基板占有率)の大
きいホウロウ基板およびその効率的な製造方法に関する
。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a multi-layer enamel substrate that can be cut by hand and has a large space factor (substrate occupation rate), and an efficient manufacturing method thereof. Regarding.
従来、多数枚取りのホウロウ基板を作り、これより各単
一の基板を切断するには、ホウロウがけ後にプレスや砥
石を用いた切削による切断機によって切断していた。Conventionally, a multi-layer enameled substrate was made and each single substrate was cut from the enameled substrate by a cutting machine using a press or a grindstone after enameling.
プレスによる切断は、切断部が剪断力を受け、ある程度
変形するのでホウロウが損傷し、導体回路等に悪影響を
与えるおそれがある。したがっである長さをもった切断
部を設ける必要がある。When cutting with a press, the cut portion is subjected to shearing force and deforms to some extent, which may damage the enamel and adversely affect conductor circuits and the like. Therefore, it is necessary to provide a cut portion with a certain length.
また砥石による切断の場合は、砥石の厚さやそれが動く
ための余裕分の長さをもった切断部が必要である。従っ
て第2図に示したように、各単一の基板を運結部で結び
つけた多数枚取りのホウロウ基板とする必要があった。Further, in the case of cutting with a grindstone, the cutting part needs to be long enough to accommodate the thickness of the grindstone and allow for the movement of the grindstone. Therefore, as shown in FIG. 2, it was necessary to create a multi-layer enamel substrate in which each single substrate was connected by a connecting portion.
前記のプレスや砥石による切断方法では、切削粉等で基
板が汚されるので、切断後の洗浄が必要という難点もあ
った。従って回路形成や部品実装後の切断は手間がかか
り、困難であった。また切断部の長さがバラつくため寸
法精度が悪いという難点もあった。The above-mentioned cutting method using a press or a grindstone has the disadvantage that the substrate is contaminated with cutting powder and the like, so cleaning is required after cutting. Therefore, cutting after circuit formation and component mounting is time-consuming and difficult. Another problem was that the length of the cut portion varied, resulting in poor dimensional accuracy.
これに対して、チョコレートを溝に沿って手で折り切断
するように(チョコレート・ブレーク)手によって切断
する方法について、本出願人は先に特願昭63−168
953、ホウロウ基板およびとその製造方法において提
案した。On the other hand, the present applicant previously proposed a method of manually cutting chocolate by manually folding it along the grooves (chocolate break) in Japanese Patent Application No. 63-168.
No. 953, enamel substrate and method for manufacturing the same.
しかしながら、この多数枚取りホウロウ基板においても
、第2図のように各単一の基板を連結する運結部が設け
であるため、多数枚取りのホウロウ基板の中で実際にホ
ウロウ基板となる率である基板占有率(スペースファク
ター)が悪いという問題点があった。またこの連絡部が
切断後の基板にも突出部として残るという難点があった
。However, even in this multi-layer enamel substrate, there is a connection part that connects each single substrate as shown in Figure 2, so the percentage of multi-layer enamel substrates that actually become enamel substrates is low. There was a problem that the substrate occupation rate (space factor) was poor. Further, there is a problem in that the connecting portion remains as a protruding portion on the substrate after cutting.
本発明の目的は多数枚取りのホウロウ基板から、各単一
の基板を手による折り曲げによって切断可能なホウロウ
基板であって、そのスペースファクターが良好で、切断
後の寸法精度もバラつかず、また切断後の基板にも突出
部が残存することのないホウロウ基板およびその効率的
な製造方法を提供することである。The object of the present invention is to provide an enamel substrate that can be cut into single substrates by hand bending from a multi-layer enamel substrate, which has a good space factor, has no variation in dimensional accuracy after cutting, and It is an object of the present invention to provide an enameled substrate in which no protrusion remains on the substrate after cutting, and an efficient manufacturing method thereof.
〔課題を解決するための手段〕
本発明者らは前記課題を解決するため鋭意研究を行った
。[Means for Solving the Problems] The present inventors conducted extensive research in order to solve the above problems.
その結果、多数枚取りしようとする基板は、各単一基板
の間に運結部を設けることなく、連続した形とし、切断
されるべき部分の金属のコアに予め溝を入れたホウロウ
基板とすることにより解決できること、またこの溝を形
成させるには、機械加工(切削)よりも、プレスの方が
スピードの点で優れているが、切断される溝の交点では
プレス型の製作が難しく、また無理な力がかかるために
プレス刃の寿命も短くなる、そこでこれを避けるために
予め、この交点の部分に穴を打抜いておくことにより、
プレスの製作も容易になり、寿命も長くなると共に、ホ
ウロウ基板としても手で折る切断が一段と容易なホウロ
ウ基板とじうろことを見い出し、本発明を完成した。As a result, the boards that are to be cut in large numbers are made in a continuous form without connecting parts between each single board, and are made of enameled boards with grooves pre-grooved in the metal core of the part to be cut. Although pressing is superior in terms of speed to machining (cutting) to form this groove, it is difficult to make a press mold at the intersection of the grooves to be cut. In addition, the life of the press blade will be shortened due to excessive force, so to avoid this, by punching a hole at this intersection in advance,
The present invention was completed by discovering an enamel substrate and a water scale that are easier to manufacture and have a longer lifespan, and which are easier to fold and cut by hand as an enamel substrate.
すなわち本発明は多数枚取りのホウロウ基板において、
切断のための運結部を設けることなく、切断部に切断用
溝を設け、該溝の交点に穴を設けてなるホウロウ基板で
あり、その製造方法としては、ホウロウがけする前の金
属コアの切断予定部に切断用溝をプレスによって形成す
ることを特徴とするホウロウ基板の製造方法である。In other words, the present invention provides a multi-sheet enamel substrate,
This is an enameled substrate in which a cutting groove is provided in the cutting part and a hole is provided at the intersection of the grooves without providing a connecting part for cutting.The method for manufacturing it is to attach a metal core before enameling. This method of manufacturing an enameled substrate is characterized by forming a cutting groove in a portion to be cut using a press.
本発明のホウロウ基板では単一の一枚づつの基板には従
来のように特に細い運結部のような切断部を設けること
をせず連続した形とし、金属コアの切断予定線に沿って
溝を形成し、溝の交点は予め打抜いて穴としておく。In the enamel substrate of the present invention, each single substrate has a continuous shape without providing particularly thin cutting parts such as connecting parts as in the past, and the metal core is cut along the cutting line of the metal core. Grooves are formed, and the intersections of the grooves are punched out in advance to form holes.
溝は片面からのみの溝でも、両面からの溝でもよく、形
状も■字形溝、U字形溝など何れでもよい。この溝の巾
は従来の運結部の長さの174以下程度にし得るので、
後記実施例でも明らかな通り、基板としうる面積率、ス
ペースファクターが大巾に増大する。また従来の運結部
をもった基板では、運結部のどの部分で切断されるかに
よって、切断部の長さがバラつき、寸法精度が悪かった
が、本発明では金属コアに溝を形成した段階で切断部は
決定されてしまうので、寸法精度が向上する。また従来
は切断部に連絡部の残りの突起部があったが、本発明で
は突起部は一切形成されない。The grooves may be formed from only one side or from both sides, and may have any shape such as a ■-shaped groove or a U-shaped groove. The width of this groove can be about 174 mm or less, which is the length of the conventional connecting part, so
As is clear from the examples described later, the area ratio and space factor that can be used as a substrate are greatly increased. In addition, with conventional boards with connecting parts, the length of the cut part varies depending on which part of the connecting part is cut, resulting in poor dimensional accuracy, but in the present invention, grooves are formed in the metal core. Since the cutting portion is determined in stages, dimensional accuracy is improved. Further, although conventionally there was a protrusion remaining at the connecting part at the cut part, in the present invention, no protrusion is formed at all.
製造方法としては、溝の交叉点には穴を打抜いた形状と
しであるので、直線刃型のプレスとすることができ、プ
レス型の製作も容易であり、またプレス刃の寿命も、交
叉部の無理な力がかかる部分がないので、長くなる。As for the manufacturing method, a hole is punched out at the intersection of the grooves, so it is possible to use a straight-edge type press, and the press die is easy to manufacture. It is longer because there is no part that is subject to excessive force.
以下に実施例によって、本発明を具体的に説明するが、
本発明はこの実施例によって何等限定されるものではな
い。The present invention will be specifically explained below with reference to Examples.
The present invention is not limited in any way by this example.
10m5+角の基板を多数枚取りする基板について説明
する。A board from which a large number of 10m5+ square boards are taken will be explained.
多数枚取り基板の金属コアを第1図の如き形状とし、従
来の運結部をなくし、端部に切断予定部にくさび状の切
り込みと、切断線の交点に1NR角の矩形の穴を設ける
。該切断線にはプレスにより両面からくさび形の溝部を
形成させておく。この形状でホウロウがけ、回路形成、
部品の実装を行う。完成後、切断に当っては、手による
折り曲げによって容易に切断し得る。The metal core of the multi-chip board is shaped as shown in Figure 1, the conventional connection part is eliminated, and a wedge-shaped cut is made at the end where the cutting is planned, and a rectangular hole of 1NR square is provided at the intersection of the cutting lines. . Wedge-shaped grooves are formed on both sides of the cutting line by pressing. With this shape, enameling, circuit formation,
Mount the parts. After completion, it can be easily cut by hand bending.
比較例として、従来より行われて来た多数枚取り基板と
して第2図の如く、各車−の基板を運結部で連結した金
属コアを使用した。ホウロウがけ、回路形成等は実施例
と同様に行った。As a comparative example, as shown in FIG. 2, a metal core in which the boards of each car were connected by connecting parts was used as a conventional multi-chip board. Enameling, circuit formation, etc. were performed in the same manner as in the examples.
完成後の切断は回転砥石による切断を行った。After completion, cutting was performed using a rotating grindstone.
この場合には切削粉の後洗浄を必要とする。In this case, cleaning after cutting powder is required.
両者の切断、スペースファクター、寸法精度、切断部の
突起について比較すると数表の通りとなる。A comparison of the cutting, space factor, dimensional accuracy, and protrusion of the cut portion between the two is as shown in the table below.
本発明のホウロウ基板は、多数枚取り基板の金属コアに
予め、プレス等により切断予定部に溝を形成させておき
、その切断予定線の交点には穴を穿っである。従って従
来の多数枚取り基板のように各単一基板を連結する運結
部がなく、ホウロウや導体等焼付後や部品実装後におい
て、手によって容易に折って切断することができる。こ
の時従来法の基板をプレス切断する場合にはホウロウに
ひびが入ったり、砥石切削切断の場合も、プレス切断の
場合も後洗浄の必要があったが、本発明方法ではホウロ
ウに何等の損傷を与えることなく切断でき、後洗浄の必
要もない。In the enameled substrate of the present invention, grooves are formed in advance at the intended cutting portions by pressing or the like in the metal core of the multi-sheet substrate, and holes are punched at the intersections of the planned cutting lines. Therefore, unlike conventional multi-chip boards, there is no connection part for connecting each single board, and it can be easily folded and cut by hand after baking the enamel, conductors, etc., or after mounting components. At this time, when press-cutting the substrate using the conventional method, the enamel would crack, and cleaning would be required after both grindstone-cutting and press-cutting, but the method of the present invention does not cause any damage to the enamel. It can be cut without any damage, and there is no need for cleaning afterward.
更に運結部がないので、スペースファクター(基板占有
率)が大きくなり、同一のホウロウ焼成炉でも、より多
数枚の単一基板を一度に焼成できることにより、生産効
率が上る。また各単一基板の寸法精度もよくなり、切断
部の突起もなくなるという数々の利点を有する。Furthermore, since there is no connecting section, the space factor (substrate occupation rate) is increased, and even in the same enamel firing furnace, a larger number of single substrates can be fired at once, thereby increasing production efficiency. Furthermore, the dimensional accuracy of each single substrate is improved, and there are no protrusions at the cut portion, which has many advantages.
製造方法としても、プレスによる溝形成が効率的である
が、この時切断線の交点はプレス型の製作が難しく、無
理な力がかかり寿命も短くなる。As for the manufacturing method, forming grooves by pressing is efficient, but in this case, it is difficult to make a press mold at the intersection of the cutting lines, and unreasonable force is applied, which shortens the life.
本発明では交点部分に穴を穿ったホウロウ基板であるの
でプレス型の製作も容易であり、プレス刃の寿命も長く
、効率的に本発明のホウロウ基板を製造できる。Since the present invention is an enameled substrate with holes drilled at the intersection points, it is easy to manufacture a press mold, and the life of the press blade is long, so that the enameled substrate of the present invention can be manufactured efficiently.
第1図は本発明の多数枚取り基板の平面図である(点線
は切断予定の溝を表わす)。
第2図は従来の運結部付きの多数枚取り基板の平面図で
ある。FIG. 1 is a plan view of a multi-chip substrate of the present invention (the dotted lines represent grooves to be cut). FIG. 2 is a plan view of a conventional multi-chip board with a connecting section.
Claims (2)
運結部を設けることなく、切断部に切断用溝を設け、該
溝の交点に穴を設けてなるホウロウ基板。1. An enamel substrate for making multiple sheets, in which cutting grooves are provided in the cutting section and holes are provided at the intersections of the grooves, without providing a connection section for cutting.
断予定部に切断用溝をプレスによって形成することを特
徴とする請求項1記載のホウロウ基板の製造方法。2. 2. The method of manufacturing an enameled substrate according to claim 1, wherein cutting grooves are formed by pressing in the portion of the metal core to be cut before the enameled substrate is enameled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63215098A JPH0263614A (en) | 1988-08-31 | 1988-08-31 | Enamel substrate and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63215098A JPH0263614A (en) | 1988-08-31 | 1988-08-31 | Enamel substrate and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263614A true JPH0263614A (en) | 1990-03-02 |
Family
ID=16666722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63215098A Pending JPH0263614A (en) | 1988-08-31 | 1988-08-31 | Enamel substrate and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263614A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03252191A (en) * | 1990-03-01 | 1991-11-11 | Matsushita Electric Ind Co Ltd | Metal base material insulating board |
| JP2005224854A (en) * | 2004-02-16 | 2005-08-25 | Nippon Steel Corp | Roll forming method for uneven plate without wrinkle or warpage |
| JP2010278309A (en) * | 2009-05-29 | 2010-12-09 | Sanyo Electric Co Ltd | Circuit board manufacturing method and circuit device manufacturing method |
| WO2011145336A1 (en) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| CN103068166A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for forming metal substrate without inner position |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125191A (en) * | 1984-11-22 | 1986-06-12 | 新神戸電機株式会社 | Separation line formation for printed wiring board |
| JPS6320468B2 (en) * | 1982-07-26 | 1988-04-27 | Asahi Chemical Ind |
-
1988
- 1988-08-31 JP JP63215098A patent/JPH0263614A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6320468B2 (en) * | 1982-07-26 | 1988-04-27 | Asahi Chemical Ind | |
| JPS61125191A (en) * | 1984-11-22 | 1986-06-12 | 新神戸電機株式会社 | Separation line formation for printed wiring board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03252191A (en) * | 1990-03-01 | 1991-11-11 | Matsushita Electric Ind Co Ltd | Metal base material insulating board |
| JP2005224854A (en) * | 2004-02-16 | 2005-08-25 | Nippon Steel Corp | Roll forming method for uneven plate without wrinkle or warpage |
| JP2010278309A (en) * | 2009-05-29 | 2010-12-09 | Sanyo Electric Co Ltd | Circuit board manufacturing method and circuit device manufacturing method |
| WO2011145336A1 (en) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| JP2011243813A (en) * | 2010-05-19 | 2011-12-01 | Nhk Spring Co Ltd | Chain article formation method of metal base circuit board, and chain article of metal base circuit board |
| CN102726128A (en) * | 2010-05-19 | 2012-10-10 | 日本发条株式会社 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| KR101297296B1 (en) * | 2010-05-19 | 2013-08-19 | 닛폰 하츠죠 가부시키가이샤 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| CN103068166A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for forming metal substrate without inner position |
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