JPH0264044U - - Google Patents
Info
- Publication number
- JPH0264044U JPH0264044U JP14367588U JP14367588U JPH0264044U JP H0264044 U JPH0264044 U JP H0264044U JP 14367588 U JP14367588 U JP 14367588U JP 14367588 U JP14367588 U JP 14367588U JP H0264044 U JPH0264044 U JP H0264044U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- rubber
- heat sink
- flexible substrate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルプリンタのサーマル
ヘツド固定構造を表す断面図、第２図は従来のサ
ーマルヘツド固定構造を表す断面図、第３図は本
考案のサーマルヘツド固定構造を表す斜視図であ
る。
１……サーマルヘツド、２……ＩＣ、３……放
熱板、４……ＩＣカバー、５……導電ゴム、６…
…ねじ、７……サーマルヘツドのＧＮＤ、８……
ＦＰＣのＧＮＤ、９……スルホール、１０……Ｆ
ＰＣ、１１……ねじ、１２……アース。
Fig. 1 is a sectional view showing the thermal head fixing structure of the thermal printer of the present invention, Fig. 2 is a sectional view showing the conventional thermal head fixing structure, and Fig. 3 is a perspective view showing the thermal head fixing structure of the present invention. be. 1... Thermal head, 2... IC, 3... Heat sink, 4... IC cover, 5... Conductive rubber, 6...
...Screw, 7...Thermal head GND, 8...
FPC GND, 9...through hole, 10...F
PC, 11...screw, 12...ground.
Claims (1)
圧接力によつて放熱板に固定し、サーマルヘツド
端子部とフレキシブル基板の導通を取るサーマル
ヘツド固定構造において、前記ゴムを導電ゴムと
したことを特徴とするサーマルヘツドの固定構造
。 (2) 前記ＩＣが実装されてるサーマルヘツドの
ＧＮＤ、フレキシブル基板、導電ゴムＩＣカバー
ねじ、さらに放熱板まで同時に導通することを特
徴とする実用新案登録請求の範囲第１項記載のサ
ーマルヘツドの固定構造。[Claims for Utility Model Registration] (1) In a thermal head fixing structure in which a thermal head on which an IC is mounted is fixed to a heat sink by the pressure contact force of rubber, and electrical conduction is established between the thermal head terminal part and a flexible substrate, A thermal head fixing structure characterized by using conductive rubber as rubber. (2) Fixing of the thermal head according to claim 1 of the utility model registration claim, characterized in that the GND of the thermal head on which the IC is mounted, the flexible substrate, the conductive rubber IC cover screws, and even the heat sink are electrically connected at the same time. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14367588U JPH0264044U (en) | 1988-11-02 | 1988-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14367588U JPH0264044U (en) | 1988-11-02 | 1988-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0264044U true JPH0264044U (en) | 1990-05-14 |
Family
ID=31410706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14367588U Pending JPH0264044U (en) | 1988-11-02 | 1988-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0264044U (en) |
-
1988
- 1988-11-02 JP JP14367588U patent/JPH0264044U/ja active Pending
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