JPS6367256U - - Google Patents
Info
- Publication number
- JPS6367256U JPS6367256U JP16270486U JP16270486U JPS6367256U JP S6367256 U JPS6367256 U JP S6367256U JP 16270486 U JP16270486 U JP 16270486U JP 16270486 U JP16270486 U JP 16270486U JP S6367256 U JPS6367256 U JP S6367256U
- Authority
- JP
- Japan
- Prior art keywords
- cooling body
- groove
- conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図および第２図はこの考案による冷却体の
それぞれ異なる実施例の側面図、第３図は従来の
冷却体の一例を示す側面図である。
１……プリント配線基板、２……トランジスタ
、４……冷却体、４ａ……溝、６……導体、８…
…樹脂。
1 and 2 are side views of different embodiments of the cooling body according to this invention, and FIG. 3 is a side view showing an example of a conventional cooling body. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Transistor, 4... Cooling body, 4a... Groove, 6... Conductor, 8...
…resin.
Claims (1)
る導体が実装されたプリント配線基板に取付けら
れ加熱片を有する半導体素子が取付けられる冷却
体において、前記プリント配線基板と対向する取
付け面に開口した溝を形成し、この溝内に前記導
体を絶縁を保つて挿通させたことを特徴とする冷
却体。 (2) 実用新案登録請求の範囲第１項記載の冷却
体において、溝の内壁と導体とが熱伝導の良好な
合成樹脂の充填により固定されていることを特徴
とする冷却体。[Claims for Utility Model Registration] (1) A cooling body that is attached to a printed wiring board on which conductors are mounted that are connected to at least some parts of a conductive pattern, and on which a semiconductor element having a heating piece is attached, which faces the printed wiring board. A cooling body characterized in that an open groove is formed in a mounting surface of the cooling body, and the conductor is inserted into the groove while maintaining insulation. (2) A cooling body according to claim 1 of the utility model registration, characterized in that the inner wall of the groove and the conductor are fixed by filling a synthetic resin with good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16270486U JP2524127Y2 (en) | 1986-10-23 | 1986-10-23 | Cooling body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16270486U JP2524127Y2 (en) | 1986-10-23 | 1986-10-23 | Cooling body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367256U true JPS6367256U (en) | 1988-05-06 |
| JP2524127Y2 JP2524127Y2 (en) | 1997-01-29 |
Family
ID=31090222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16270486U Expired - Lifetime JP2524127Y2 (en) | 1986-10-23 | 1986-10-23 | Cooling body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524127Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108007A (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat dissipating structure of heat generating electronic component and manufacturing method thereof |
-
1986
- 1986-10-23 JP JP16270486U patent/JP2524127Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108007A (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat dissipating structure of heat generating electronic component and manufacturing method thereof |
| WO2017098703A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2524127Y2 (en) | 1997-01-29 |