JPH0265218A - Manufacture of laminated ceramic capacitor - Google Patents

Abstract

PURPOSE:To prevent the deterioration of characteristics due to chip-to-chip contact by a method wherein a laminated body, which is formed by laminating and pressure- bonding a plurality of ceramic sheets carrying plural internal electrodes, is fixed to the surface of a substrate using an organic bonding agent, slits 7 are provided on the laminated material, and after the laminated material has been cut into a plurality of chips, a calcinating work is conducted thereon. CONSTITUTION:A laminated body 3 is formed by laminating and pressure-bonding a plurality of ceramic sheets 2 whereon inner electrodes 1 are formed. Said laminated body 3 is fixed to a substrate 5 using an organic bonding agent 4. A substrate whereon zirconia is coated on SiC, marmina and mulite, which do not react with the laminated body 3, is used. After the laminated body 3 has been fixed to the substrate 5, slits 7 are formed only on the laminated body 3 using a dicing machine 6, and the laminated body 3 is cut into chips 8. The desirable width of the slits 7 is 50 to 200mum or thereabout. After the laminated body 3 has been cut, the chips 8 are calcinated in the state wherein they are arranged on the substrate 5. The organic bonding agent 4 can be vapor deposited by the heat of calcination, and the chips 8 can be exforiated from the substrate easily. The chips 8 can be formed by cutting the substrate 5 with the laminated body 3 fixed thereto.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a multilayer ceramic chip capacitor.

(Prior Art) Conventionally, in order to manufacture multi-N ceramic chip capacitors, a laminate of ceramic sheets is cut into chips of predetermined dimensions, and then the chips are arranged on a substrate or buried in powder and fired. .

(Problems to be Solved by the Invention) However, this conventional method has the drawback of low work efficiency. Additionally, the chips tend to come into contact with each other during firing, causing a reaction between the internal electrodes of the ceramic sheet and the dielectric portion, resulting in deterioration of characteristics.

The present invention improves the above-mentioned drawbacks and provides a multilayer ceramic chip capacitor that is easy to manufacture and has improved characteristics.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a multilayer ceramic chip capacitor, in which: i) a plurality of ceramic sheets each having a plurality of internal electrodes formed thereon are laminated; 11) fixing the laminate to a substrate surface that does not react with the laminate during firing with an organic adhesive; and iii) forming a plurality of slits in the laminate. The present invention provides a method for manufacturing a multilayer ceramic chip capacitor, which comprises sequentially performing the steps of: cutting the chip into chips; and iv) firing the chip.

(Function) In the present invention, a laminate is provided with slits and cut, and the formed chips are fixed to a substrate in advance with an organic adhesive.

Therefore, the chips can be fired while maintaining a predetermined distance without coming into contact with each other.

(Example) Hereinafter, the present invention will be explained based on examples.

First, as shown in FIG. 1, a plurality of ceramic sheets 2 having internal electrodes 1 formed thereon are laminated and pressed together to form a laminate 3.

Next, as shown in FIG. 2, the laminate 3 is fixed to the substrate 5 with an organic adhesive 4. The substrate 5 should not react with the laminate 3 during firing, and is made of, for example, 3iC, Marumina, or Murai l~ coated with zirconia.

After fixing the laminate 3 to the substrate 5, as shown in FIG. 3, a dicing machine 6 forms slits 7 only in the laminate 3 and cuts it into individual chips 8. The width of slit 7 is 50
The thickness is preferably about 200 μm.

After cutting, the laminate 3 is fired with the depth 8 disposed on the substrate 5, as shown in FIG. Due to the heating during firing,
The organic adhesive 4 can be deposited, and the chip 8 can be easily peeled off from the substrate 5.

In the above embodiment, the chip 8 can be formed by cutting the laminate 3 while being fixed to the substrate 5. Therefore, the chips 8 can maintain a predetermined distance without coming into contact with each other.

(Effects of the Invention) As described above, according to the present invention, it is possible to form a chip that is fixed to a substrate, so the work is easy and the deterioration of characteristics due to contact between chips can be prevented. A manufacturing method is obtained.

[Brief explanation of the drawing]

Figures 1 to 4 show diagrams of the manufacturing process of the present invention, where Figure 1 is a front view of the laminate, Figure 2 is a front view of the laminate fixed to a substrate, and Figure 3 is the laminate. FIG. 4 is a perspective view of the chip being cut away, and FIG. 4 is a front view of the chip being placed on the substrate. 1... Internal electrode, 2... Ceramic sheet, 3...
...Laminated body, 4...Organic adhesive, 5...Substrate, 7...Slit, 8...Chip. Patent applicant Hitachi Capacitor Co., Ltd.

Claims (1)

[Claims] (1) A method for manufacturing a multilayer ceramic chip capacitor, which includes: i) laminating and pressing a plurality of ceramic sheets each having a plurality of internal electrodes formed thereon to form a laminate; and ii) performing the steps described above when firing the laminate. fixing with an organic adhesive on the surface of the substrate that does not react with the laminate; iii) forming slits in the laminate and cutting it into a plurality of chips; iv) firing the chips. A method for manufacturing a multilayer ceramic chip capacitor characterized by sequential steps.