JPH0266432A - Optical measuring instrument - Google Patents
Optical measuring instrumentInfo
- Publication number
- JPH0266432A JPH0266432A JP63218165A JP21816588A JPH0266432A JP H0266432 A JPH0266432 A JP H0266432A JP 63218165 A JP63218165 A JP 63218165A JP 21816588 A JP21816588 A JP 21816588A JP H0266432 A JPH0266432 A JP H0266432A
- Authority
- JP
- Japan
- Prior art keywords
- signal
- brightness
- height
- signals
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の概要〕
物体の形状、性状を光学的に多項目同時測定する光学計
測装置に関し、
光学計測装置において更に多くの項目を同時に計測可能
にすることを目的とし、
レーザ光源、ビームスプリッタ、光走査器、被計測物体
から投射光の両側に反射した光に対する側面ミラー、投
射光の経路で戻り前記ビームスプリッタを通過した反射
光を受光する第1の光位置検出器、前記両側に反射した
光を受光する第2、第3の光位置検出器を備える光学系
と、第10光位置検出器の出力を受けて明るさ信号を出
力する第1の処理回路、第2、第3の光位置検出回路の
出力を受けて明るさ信号と高さ信号を出力する第2、第
3の処理回路、第1〜第3の処理回路から明るさ信号を
受けてその最大のものまたは合計したものを出力する明
るさ選択回路、第2、第3の処理回路から明るさ信号と
高さ信号を受けて明るさ信号が大きい方の高さ信号を出
力する高さ選択回路を備え、更に、第1〜第3処理回路
から明るさ信号を受けて傾斜角信号を出力する傾斜角演
算回路およびまたは第1〜第3処理回路から明るさ信号
を受けて散乱度信号を出力する散乱度演算回路を備える
信号処理系とを有するよう構成する。[Detailed Description of the Invention] [Summary of the Invention] Regarding an optical measurement device that optically measures multiple items simultaneously on the shape and properties of an object, an object of the present invention is to enable the optical measurement device to measure more items simultaneously. A laser light source, a beam splitter, an optical scanner, a side mirror for the light reflected from the object to be measured on both sides of the projected light, and a first optical position detector that receives the reflected light that returns along the path of the projected light and passes through the beam splitter. , an optical system including second and third optical position detectors that receive the light reflected on both sides; a first processing circuit that receives the output of the tenth optical position detector and outputs a brightness signal; 2. Second and third processing circuits that receive the output of the third optical position detection circuit and output brightness signals and height signals; receive brightness signals from the first to third processing circuits and output the brightness signals; a brightness selection circuit that outputs the brightness signal or the sum of the brightness signals, and a height selection circuit that receives the brightness signal and the height signal from the second and third processing circuits and outputs the height signal of the one with the larger brightness signal. further comprising a tilt angle calculation circuit that receives brightness signals from the first to third processing circuits and outputs tilt angle signals; and/or a tilt angle calculation circuit that receives brightness signals from the first to third processing circuits and outputs scattering degree signals. and a signal processing system including a scattering degree calculation circuit.
本発明は、物体の形状、性状を光学的に多項目同時測定
する光学計測装置に関する。TECHNICAL FIELD The present invention relates to an optical measurement device that optically measures multiple items simultaneously on the shape and properties of an object.
光学的な計測は多くの用途で行なわれている。Optical measurements are used in many applications.
計測の項目として最も一般的なのは明るさであり、反射
光量によりこれを計測する。また三角法等によって光学
的に物体の高さを計測する装置も開発されている。The most common measurement item is brightness, which is measured by the amount of reflected light. Devices that optically measure the height of objects using trigonometry and the like have also been developed.
光学的に物体の3次元形状を計測する方法は、プリント
板上へ実装された部品の実装状態を自動検査する有力な
方法として利用されている。第8図にその一例を示す。A method of optically measuring the three-dimensional shape of an object is used as an effective method for automatically inspecting the mounting state of components mounted on a printed circuit board. An example is shown in FIG.
これは光切断法と呼ばれるもので、被計測物体10の真
上からシート状の光りを投射して物体10とその台11
に光切断線!を形成させ、これを斜め方向からTV(テ
レビ)カメラ13で撮像し、同図(b)の如き画像を得
る。台11上の輝線2..24をゼロラインとしてこれ
からの輝線1z、lzまでの距離が物体10の高さに対
応しているからこれを求め(各y値毎にX方向走査して
、輝線のあるy値から上記距離を求める)、カメラ13
の位置(角度および距離)などから三角法により物体1
0の高さを算出する。This is called a light cutting method, in which a sheet of light is projected from directly above the object 10 to be measured, and the object 10 and its stand 10 are
A light cutting line! is formed, and this is imaged from an oblique direction with a TV (television) camera 13 to obtain an image as shown in FIG. Bright line 2 on the stand 11. .. 24 is the zero line, and the distance from this to the bright lines 1z and lz corresponds to the height of the object 10, so find this (scan in the X direction for each y value, and calculate the above distance from the y value of the bright line. ), camera 13
Object 1 is determined by trigonometry from the position (angle and distance) of
Calculate the height of 0.
第9図は本発明者が先に提案した3次元形状測定用光学
システムである。レーザ光源21からのレーザビームを
コリメートレンズ22で平行光にし、該平行光で回転多
面鏡23、放物面鏡24、およびミラー25からなる光
学系により被計測物体10を走査し、かつ該光学系で反
射光を結像レンズ26へ送り、光検出器27に受光させ
る。光検出器27の出力を信号処理回路28で処理し、
被計測物体10の高さを示す信号S、及び必要に応じて
明るさを示す信号Szを出力する。FIG. 9 shows an optical system for three-dimensional shape measurement previously proposed by the present inventor. A laser beam from a laser light source 21 is made into parallel light by a collimating lens 22, and the object to be measured 10 is scanned with the parallel light by an optical system consisting of a rotating polygon mirror 23, a parabolic mirror 24, and a mirror 25. The system sends the reflected light to the imaging lens 26 and causes the photodetector 27 to receive the light. The output of the photodetector 27 is processed by a signal processing circuit 28,
A signal S indicating the height of the object to be measured 10 and, if necessary, a signal Sz indicating the brightness are output.
被計測物体の高さを計測する要領を第10図で説明する
に、こ\では該物体10の低い部分をA、高い部分をB
とし、B−Aを高さ、としている。The procedure for measuring the height of an object to be measured will be explained with reference to FIG.
and B-A is the height.
レンズ22からの平行光L1は図示の如く回転多面鏡2
3、放物面鏡24、ミラー28を経て物体10に入射す
る。反射光は、低い部分Aからのそれは実線L2の如く
であり、高い部分Bからのそれは点線L3の如くであり
、光検出器27に入射する位置はA’、B’ となる。The parallel light L1 from the lens 22 passes through the rotating polygon mirror 2 as shown in the figure.
3. The light enters the object 10 via the parabolic mirror 24 and the mirror 28. The reflected light from the low part A is as shown by a solid line L2, and that from the high part B is shown as a dotted line L3, and the positions where the light is incident on the photodetector 27 are A' and B'.
この光検出器上の入射点A’ 、B’ はミラー25の
傾斜角などによっても変るが、基本は部分A、Bの位置
により変り、A’B’間距離・はAB間距離(物体の高
さ)に対応する。そこで光検出器27に例えば光点位置
検出器(PSD)を用いると入射光点A’ 、B’従っ
て被計測物体の高さの検出出力を得ることができる。The incident points A' and B' on the photodetector vary depending on the inclination angle of the mirror 25, etc., but basically they vary depending on the positions of parts A and B, and the distance between A' and B' is the distance between AB (of the object). height). Therefore, if a light spot position detector (PSD), for example, is used as the photodetector 27, a detection output of the incident light points A' and B' and thus the height of the object to be measured can be obtained.
PSDはPN接合と抵抗層を基本としており、第11図
に示すようにスポット光が入射すると、その入射光位置
に応じた光電流Ia、Ibを流す。The PSD is based on a PN junction and a resistance layer, and as shown in FIG. 11, when spot light is incident, photocurrents Ia and Ib flow depending on the position of the incident light.
中央に入ればIa=Ibであり、それより図面上方に入
ればそのずれに応じてIa>Ibになり、下方に入れば
その逆である。物体10の低い部分(物体10が載せら
れている台の上面)Aからの反射光点A′がPSDの中
央にくるようにセットすれば物体の高さは(I a−I
b) / (1a+Ib)で表わされる。なおIa+I
bはPSDへの入射光従って被計測物体の反射光(明る
さ)を示す。従ってこの光学システムでは、被計測物体
の高さと明るさを出力することができる。If it is in the center, Ia=Ib, if it is above the drawing, Ia>Ib according to the deviation, and vice versa if it is below. If the height of the object is set so that the reflected light point A' from the low part of the object 10 (the top surface of the table on which the object 10 is placed) A is at the center of the PSD, the height of the object is (I a - I
b) / (1a+Ib). Note that Ia+I
b indicates the incident light to the PSD and therefore the reflected light (brightness) of the object to be measured. Therefore, this optical system can output the height and brightness of the object to be measured.
従来の光学計測装置では物体の高さ、明るさ(反射率)
などを計測しており、更に多くの項目を同時に計測する
ものではない。Conventional optical measurement devices measure the height and brightness (reflectance) of an object.
etc., and does not measure many more items at the same time.
しかし認識(画像読取り)システム、例えばプリント板
への部品実装状態の正常/異常自動認識システムでは、
物体(部品)の高さ、明るさ、の他に、傾斜角(傾いて
取付けられてはいないか等)、光散乱度(当該部品は予
定のものか否か等)なども重要である。However, in recognition (image reading) systems, such as systems that automatically recognize whether parts are mounted on a printed board as normal or abnormal,
In addition to the height and brightness of the object (component), the angle of inclination (such as whether it is installed at an angle) and the degree of light scattering (such as whether the part in question is the intended one) are also important.
それ故本発明は、光学計測装置において更に多くの項目
を同時に計測可能にすることを目的とするものである。Therefore, an object of the present invention is to enable an optical measuring device to measure more items simultaneously.
本発明では第1図に示す光学系を用い、第2図に示す信
号処理をして明るさ信号および高さ信号の他に、傾斜角
信号及び又は散乱度信号を得る。In the present invention, the optical system shown in FIG. 1 is used and the signal processing shown in FIG. 2 is performed to obtain a tilt angle signal and/or a scattering degree signal in addition to a brightness signal and a height signal.
全図を通してそうであるが、他の図と同じ部分には同じ
符号が付しである。As in all figures, parts that are the same as in other figures are given the same reference numerals.
第1図で(a)は上面図、Φ)は正面図、(C)は側面
図であるが、いずれも概略図(説明図)である。31は
偏光ビームスプリッタで、レーザ光源21からのレーザ
光を回転多面鏡23へ向け、回転多面鏡23からのレー
ザ光をレンズ26へ、ひいては光検出器27へ向ける。In FIG. 1, (a) is a top view, Φ) is a front view, and (C) is a side view, all of which are schematic views (explanatory views). 31 is a polarizing beam splitter which directs the laser beam from the laser light source 21 to the rotating polygon mirror 23, and directs the laser beam from the rotating polygon mirror 23 to the lens 26 and, as a result, to the photodetector 27.
24Aはfθレンズで、放物面鏡24Aと同様の機能を
持つ。ミラー25は第1図(a)(C)に示されるよう
に2個設けられ、被計測物体10への投射光はこれらの
ミラーの中間を通る。物体10での反射光L Za+
L zbはミラー25a、25bで反射し、fθレンズ
24A1回転多面鏡23、レンズ26a、26bを通っ
て光検出器27a、27bに入る。即ちレンズ26及び
光検出器27も各3個設けられ、その左右の各2個が反
射光用、中央の各1個がビームスプリッタ31で分割さ
れたレーザ光源21からの直接光用である。24A is an fθ lens, which has the same function as the parabolic mirror 24A. Two mirrors 25 are provided as shown in FIGS. 1A and 1C, and the light projected onto the object to be measured 10 passes through the middle of these mirrors. Reflected light L Za+ at object 10
L zb is reflected by mirrors 25a and 25b, passes through fθ lens 24A1 rotating polygon mirror 23, lenses 26a and 26b, and enters photodetectors 27a and 27b. That is, three lenses 26 and three photodetectors 27 are provided, two on each side of the lens 26 and three photodetectors 27 for reflected light, and one in the center for direct light from the laser light source 21 split by the beam splitter 31.
第2図で32〜34は処理回路で、光検出器27a〜2
7cの各々に対応して設けられる。35は明るさ選択回
路で、処理回路32〜34からの明るさ信号Ba−Bc
を入力して明るさ信号Bを出力する。36は高さ選択回
路で、処理回路32゜34からの明るさ信号BaとBb
及び高さ信号HaとHbを入力して高さ信号Hを出力す
る。また37は傾斜角演算回路で、処理回路32〜34
からの明るさ信号Ba−Bcを入力し、傾斜角信号Aを
出力する。更に、38は散乱度演算回路で、処理回路3
2〜34からの明るさ信号を入力し、散乱度信号Sを出
力する。In FIG. 2, 32 to 34 are processing circuits, and photodetectors 27a to 2
7c. 35 is a brightness selection circuit, which receives brightness signals Ba-Bc from processing circuits 32 to 34;
is input and brightness signal B is output. 36 is a height selection circuit which receives brightness signals Ba and Bb from processing circuits 32 and 34;
and height signals Ha and Hb are input, and a height signal H is output. Further, 37 is a tilt angle calculation circuit, and the processing circuits 32 to 34
It inputs brightness signals Ba-Bc from , and outputs a tilt angle signal A. Furthermore, 38 is a scattering degree calculation circuit, and the processing circuit 3
The brightness signals from 2 to 34 are input, and the scattering degree signal S is output.
用途によっては傾斜角演算回路と散乱度演算回路のいず
れか一方は除いてもよい。Depending on the application, either the tilt angle calculation circuit or the scattering degree calculation circuit may be omitted.
レーザ光源21からのレーザ光はビームスプリッタ31
で反射して回転多面鏡23へ向けられ、fθレンズ24
Aでスポットビームになって被計測物体10に垂直に入
射する。レーザ光源21からのレーザ光を直線偏光にす
ると(半導体レーザは通常直線偏光)、偏光ビームスプ
リッタ31で効率よく反射する。多面鏡23の回転に伴
なってレーザ光は経路が点線範囲内で移動し、物体10
を走査する。反射光のうちLzi、 Lzbで示され
るものはミラー25a、25b、fθレンズ24A1回
転多面鏡23、レンズ結像用レンズ26a、26bの経
路で光検出器27a、27bに入射する。The laser light from the laser light source 21 passes through the beam splitter 31
It is reflected by the rotating polygon mirror 23, and is reflected by the fθ lens 24.
At point A, the beam becomes a spot beam and enters the object to be measured 10 perpendicularly. When the laser light from the laser light source 21 is linearly polarized (semiconductor lasers are normally linearly polarized), it is efficiently reflected by the polarization beam splitter 31. As the polygon mirror 23 rotates, the path of the laser beam moves within the dotted line range, and the object 10
scan. Among the reflected lights, those indicated by Lzi and Lzb enter the photodetectors 27a and 27b through the mirrors 25a and 25b, the fθ lens 24A1 rotating polygon mirror 23, and the lens imaging lenses 26a and 26b.
反射光L2□ Loは入射光L+に対して対称であり、
この光による検出は物体を左方、右方から見ることにな
る。入射光L1と同じ径路で反射する成分もあり、これ
はビームスプリッタ31を通って結像用レンズ26cに
、更には光検出器27cに入射する。The reflected light L2□ Lo is symmetrical with respect to the incident light L+,
Detection using this light means that the object is viewed from the left and right sides. Some components are reflected along the same path as the incident light L1, and this component passes through the beam splitter 31 and enters the imaging lens 26c, and further enters the photodetector 27c.
fθレンズも放物面鏡も同様な機能(平行光作成/集束
)を有するが、反射光L 2a、 L Hのように左
右対称な光線を扱うにはfθレンズがよく、放物面鏡で
は左右対称に、は原理的に無理である。Both f-theta lenses and parabolic mirrors have similar functions (parallel light creation/focusing), but f-theta lenses are better for handling symmetrical rays like reflected light L2a and LH, while parabolic mirrors have similar functions. It is impossible in principle to be symmetrical.
図示していないが被計測物体10の光入射点部分の高さ
が変ると反射光12mI Lzbの軌跡は変り、光検
出器27a、27bへの光入射点も変わる。Although not shown, if the height of the light incident point portion of the object to be measured 10 changes, the locus of the reflected light 12mI Lzb changes, and the light incident points on the photodetectors 27a and 27b also change.
入射光と同じ経路を辿る反射光は、方向は垂直であるか
ら、高さが変っても変化はない。そこで光検出器にPS
Dを使用すると、左右の光検出器27a、27bから前
記Ta+Ibとして明るさ信号が、また(Ia−1b)
/ (Ia+Ib)として高さ信号が得られ、中央の光
検出器27cからはIa+Ibとして明るさ信号が得ら
れる。第2図の処理回路32〜34はこの処理を行なう
。The direction of reflected light that follows the same path as the incident light is perpendicular, so it does not change even if the height changes. Therefore, the photodetector
When D is used, the brightness signal from the left and right photodetectors 27a and 27b is as Ta+Ib, and (Ia-1b)
A height signal is obtained as / (Ia+Ib), and a brightness signal is obtained as Ia+Ib from the central photodetector 27c. Processing circuits 32-34 in FIG. 2 perform this processing.
第2図の明るさ選択回路35は、処理回路32〜34か
らの明るさ信号Ba−Bcを取込み、最も明るいもの(
最大値)を選択し、これを明るさ信号Bとする。明るさ
信号Ba−Bcの和をとってそれを明るさ信号としても
よく、要はこの明るさ信号は光照射したとき被計測物体
がどの程度間るく見えるかを示す信号である。The brightness selection circuit 35 in FIG.
maximum value) and set this as brightness signal B. The sum of the brightness signals Ba-Bc may be calculated and used as the brightness signal, and the point is that this brightness signal is a signal indicating how dimly the object to be measured appears when irradiated with light.
また高さ選択回路36は処理回路32.34からの明る
さ信号Ba、Bbと高さ信号Ha、Hbを受けて、明る
さ信号が大きい方の高さ信号を選択し、これを求める高
さ信号Hとして出力する。Further, the height selection circuit 36 receives the brightness signals Ba, Bb and the height signals Ha, Hb from the processing circuits 32 and 34, selects the height signal with the larger brightness signal, and selects the height signal to be determined. Output as signal H.
暗い方の高さ信号は、影の部分からのものであって真の
高さを示していない恐れがある。The darker height signal is from the shadow area and may not indicate the true height.
被計測物体の傾斜角は、次のようにして求めることがで
きる。第3図に示すように反射光Ba〜Bc(こ−では
明るさと同じ符号で示す)の反射角をθa〜θCとする
と平均反射角θはθ= (Baθa+Bbθb+Bcθ
c) / (Ba + Bb + Bc)・・・・・・
(1)
である。傾斜角Aは平均反射角の半分、即ち次式とする
(傾斜角は反射角の半分)。The inclination angle of the object to be measured can be determined as follows. As shown in Fig. 3, if the reflection angles of the reflected lights Ba to Bc (indicated by the same symbols as the brightness) are θa to θC, then the average reflection angle θ is θ= (Baθa+Bbθb+Bcθ
c) / (Ba + Bb + Bc)...
(1). The inclination angle A is half the average reflection angle, that is, the following equation (the inclination angle is half the reflection angle).
A=θ/2 ・・・・・・(
2)次に散乱度は各方向への反射光のバラつきの程度を
示すものであり、物体の材質に関係する。これは(3)
式の平均偏差σで表わす。A=θ/2 ・・・・・・(
2) Next, the degree of scattering indicates the degree of dispersion of reflected light in each direction, and is related to the material of the object. This is (3)
It is expressed as the average deviation σ of the equation.
Ba+Bb+Bc ・・・・・・(3) 平均偏差の他に、標準偏差や分散を使ってもよい。Ba+Bb+Bc ・・・・・・(3) In addition to the average deviation, standard deviation and variance may also be used.
第4図に明るさ選択回路35の実施例を示す。 FIG. 4 shows an embodiment of the brightness selection circuit 35.
41.42は比較器、43.44は選択器である。41.42 is a comparator, and 43.44 is a selector.
比較器41は明るさ信号BaとBbを比較し、選択器4
3にその大きい方を通過させる。例えばBa>Bbなら
比較器41は正の出力を生じ、2個のアナログゲートで
ある選択器43はBa側をオンにして該Baを出力する
。比較器42は明るさ信号Bcと選択器43が出力する
明るさ信号Bcとを比較し、同様にして選択器44に大
きい方を通過させる。これで最大値選択が行なわれる。The comparator 41 compares the brightness signals Ba and Bb, and selector 4
Let 3 pass the larger one. For example, if Ba>Bb, the comparator 41 produces a positive output, and the selector 43, which is two analog gates, turns on the Ba side and outputs the Ba. The comparator 42 compares the brightness signal Bc with the brightness signal Bc output by the selector 43, and similarly passes the larger one to the selector 44. Maximum value selection is now performed.
処理はデジタル的に行なってもよい。即ち処理回路32
〜34は明るさ信号及び高さ信号をデジタル値で出力し
、比較器はデジタルコンパレータで構成し、選択器は大
きい方をロードされるしジスタとする。Processing may also be performed digitally. That is, the processing circuit 32
.about.34 outputs a brightness signal and a height signal as digital values, the comparator is constituted by a digital comparator, and the selector is loaded with the larger one and sets it as a register.
傾斜角演算回路37は前記(1)(2)式を計算し、散
乱度演算回路38は前記(3)式を計算するが、これは
プロセッサを用いたデジタル処理の方が簡単、正確であ
る。The tilt angle calculation circuit 37 calculates the above equations (1) and (2), and the scattering degree calculation circuit 38 calculates the above equation (3), but digital processing using a processor is easier and more accurate. .
第5図は高さ選択回路36の実施例を示す。比較器45
は明るさ信号Ba、Bbを受けて例えばBa>Bbなら
正の出力を生じて選択器46にHaを通過させ、Ba<
Bbなら負の出力を生じて選択器46にHbを通過させ
る。FIG. 5 shows an embodiment of the height selection circuit 36. Comparator 45
receives the brightness signals Ba and Bb, and for example, if Ba>Bb, it produces a positive output and passes Ha to the selector 46, and if Ba<
If it is Bb, a negative output is generated and the selector 46 passes Hb.
第6図は光検出器(PSD)の信号処理回路の例を示す
。PSD27は光電流1a、Ibを生じるから、これを
電流電圧変換器51.52で電圧Va、Vbに変換し、
減算器53、加算器54に入力する。加算器54の出力
は明るさ信号Bxになり、除算回路55により減算器5
3の出力を加算器54の出力で割ったものが高さ信号H
xになる。FIG. 6 shows an example of a signal processing circuit for a photodetector (PSD). Since the PSD 27 generates photocurrents 1a and Ib, these are converted into voltages Va and Vb by current-voltage converters 51 and 52,
It is input to a subtracter 53 and an adder 54. The output of the adder 54 becomes the brightness signal Bx, which is sent to the subtracter 5 by the division circuit 55.
3 divided by the output of adder 54 is the height signal H.
Becomes x.
第7図に本発明の計測装置のシステム構成を示す。61
は第1図に示した光学系、62は第2図等に示した信号
処理回路である。63は画像メモリ、64は被計測物体
IOをのせる可動ステージ、65はプロセッサで、これ
らはシステムバス66に゛より接続される。プリント板
の部品実装状態の良/否検査では、該プリント板をステ
ージ64にのせ、光学系61により光走査して前記信号
Ba〜Bc、Ha、)(bを得、信号処理回路62で前
記信号B、H,A、Sを得、これらを逐次画像メモリ6
3に格納する。ステージの移動を含めてプリント板の全
面につき上記信号群を得、画像メモU 63に格納する
。FIG. 7 shows the system configuration of the measuring device of the present invention. 61
1 is the optical system shown in FIG. 1, and 62 is the signal processing circuit shown in FIG. 2, etc. 63 is an image memory, 64 is a movable stage on which the object to be measured IO is placed, and 65 is a processor, which are connected to a system bus 66. In the quality/failure inspection of the component mounting state of a printed board, the printed board is placed on a stage 64 and optically scanned by an optical system 61 to obtain the signals Ba to Bc, Ha, )(b), and the signal processing circuit 62 Signals B, H, A, and S are obtained and these are sequentially stored in the image memory 6.
Store in 3. The above signal group is obtained for the entire surface of the printed board including the movement of the stage, and is stored in the image memo U 63.
良/否検査に当っては、予め画像メモリ63等に格納し
である、正常実装状態のプリント板についての前記信号
群と、上記メモリに格納した信号群とを、逐次メモリ読
出しで比較し、一致/不−致をみる。全て一致しておれ
ば、実装状態は良好、である。プロセッサ65は前記の
デジタル的な信号処理、得られた信号のメモリへの格納
およびステージ移動制御などを行なう。In the pass/fail test, the signal group of the printed board in a normally mounted state, which has been stored in advance in the image memory 63, etc., and the signal group stored in the memory are compared by sequential memory reading, View matches/non-matches. If they all match, the mounting status is good. The processor 65 performs the digital signal processing described above, stores the obtained signals in memory, and controls stage movement.
[発明の効果]
以上説明したように本発明によれば、物体の高さ、明る
さ、傾斜角、光散乱度が同時に計測でき、プリントへの
部品実装状態の検査などに用いて有効である。[Effects of the Invention] As explained above, according to the present invention, the height, brightness, inclination angle, and degree of light scattering of an object can be measured simultaneously, which is effective for use in inspecting the state of component mounting on prints, etc. .
第1図は本発明の詳細な説明図、
第2図は本発明の信号処理系のブロック図、第3図は反
射光の説明図、
第4図は明るさ選択回路の実施例を示すブロック図、
第5図は高さ選択回路の実施例を示すブロック図、
第6図は光位置検出器の信号処理回路のブロック図、
第7図は計測システムの構成を示すブロック図、第8図
は高さ検知法の説明図、
第9図は既提案計測システムの説明図、第10図は高さ
計測原理の説明図、
第11図は光位置検出器の説明図である。
第1図で21はレーザ光源、31はビームスプリッタ、
23は回転多面鏡、24Aはfθレンズ、25はミラー
10は被計測対象、27a〜27Cは光位置検出器で
ある。Fig. 1 is a detailed explanatory diagram of the present invention, Fig. 2 is a block diagram of the signal processing system of the present invention, Fig. 3 is an explanatory diagram of reflected light, and Fig. 4 is a block diagram showing an embodiment of the brightness selection circuit. Fig. 5 is a block diagram showing an embodiment of the height selection circuit, Fig. 6 is a block diagram of the signal processing circuit of the optical position detector, Fig. 7 is a block diagram showing the configuration of the measurement system, and Fig. 8 9 is an explanatory diagram of the height detection method, FIG. 9 is an explanatory diagram of the already proposed measurement system, FIG. 10 is an explanatory diagram of the height measurement principle, and FIG. 11 is an explanatory diagram of the optical position detector. In Fig. 1, 21 is a laser light source, 31 is a beam splitter,
23 is a rotating polygon mirror, 24A is an fθ lens, 25 is a mirror, 10 is an object to be measured, and 27a to 27C are optical position detectors.
Claims (1)
光走査器(23、24A)、被計測物体(10)から投
射光の両側に反射した光(L_2_a、L_2_b)に
対する側面ミラー(25a、25b)、投射光の経路で
戻り前記ビームスプリッタ(31)を通過した反射光を
受光する第1の光位置検出器(27c)、前記両側に反
射した光を受光する第2、第3の光位置検出器(27a
、27b)を備える光学系と、 第1の光位置検出器(27c)の出力を受けて明るさ信
号を出力する第1の処理回路(33)、第2、第3の光
位置検出回路の出力を受けて明るさ信号と高さ信号を出
力する第2、第3の処理回路(32、34)、第1〜第
3の処理回路から明るさ信号を受けてその最大のものま
たは合計したもの(B)を出力する明るさ選択回路(3
5)、第2、第3の処理回路から明るさ信号と高さ信号
を受けて明るさ信号が大きい方の高さ信号(H)を出力
する高さ選択回路(36)を備え、更に、 第1〜第3処理回路から明るさ信号を受けて傾斜角信号
(A)を出力する傾斜角演算回路(37)およびまたは
第1〜第3処理回路から明るさ信号を受けて散乱度信号
(S)を出力する散乱度演算回路(38)を備える信号
処理系とを有することを特徴とする光学計測装置。[Claims] 1. Laser light source (21), beam splitter (31),
Optical scanners (23, 24A), side mirrors (25a, 25b) for the light (L_2_a, L_2_b) reflected from the object to be measured (10) on both sides of the projected light, and the beam splitter (31) that returns along the path of the projected light. a first optical position detector (27c) that receives the reflected light that has passed through the
, 27b), a first processing circuit (33) that receives the output of the first optical position detector (27c) and outputs a brightness signal, and second and third optical position detection circuits. Second and third processing circuits (32, 34) that receive the output and output a brightness signal and a height signal; receive the brightness signals from the first to third processing circuits and calculate the maximum value or the sum of the brightness signals; Brightness selection circuit (3) that outputs the object (B)
5), a height selection circuit (36) receiving the brightness signal and the height signal from the second and third processing circuits and outputting the height signal (H) with the larger brightness signal; A tilt angle calculation circuit (37) receives brightness signals from the first to third processing circuits and outputs a tilt angle signal (A), and/or receives brightness signals from the first to third processing circuits and outputs a scattering degree signal (A). An optical measuring device comprising: a signal processing system including a scattering degree calculation circuit (38) that outputs S).
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63218165A JPH0266432A (en) | 1988-08-31 | 1988-08-31 | Optical measuring instrument |
| AU35277/89A AU598418B2 (en) | 1988-06-04 | 1989-05-29 | Optical system for detecting three-dimensional shape |
| DE68919441T DE68919441T2 (en) | 1988-06-04 | 1989-06-02 | Optical system for determining a three-dimensional shape. |
| EP89305573A EP0346015B1 (en) | 1988-06-04 | 1989-06-02 | Optical system for detecting three-dimensional shape |
| US07/360,878 US5004929A (en) | 1988-06-04 | 1989-06-02 | Optical system for detecting three-dimensional shape |
| KR1019890007738A KR920010013B1 (en) | 1988-06-04 | 1989-06-05 | 3D shape detection optical system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63218165A JPH0266432A (en) | 1988-08-31 | 1988-08-31 | Optical measuring instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0266432A true JPH0266432A (en) | 1990-03-06 |
Family
ID=16715648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63218165A Pending JPH0266432A (en) | 1988-06-04 | 1988-08-31 | Optical measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266432A (en) |
-
1988
- 1988-08-31 JP JP63218165A patent/JPH0266432A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU598418B2 (en) | Optical system for detecting three-dimensional shape | |
| US4650335A (en) | Comparison type dimension measuring method and apparatus using a laser beam in a microscope system | |
| JP2943499B2 (en) | Height measuring method and device | |
| US5430548A (en) | Method and apparatus for pattern detection | |
| JPH04115108A (en) | Three-dimensional scanner | |
| US20020089675A1 (en) | Three-dimensional input device | |
| US6556307B1 (en) | Method and apparatus for inputting three-dimensional data | |
| US5311288A (en) | Method and apparatus for detecting surface deviations from a reference plane | |
| US4906097A (en) | Imaging and inspection apparatus and method | |
| WO1990009560A1 (en) | Distance gauge | |
| US5298976A (en) | Method and apparatus for measuring surface distances from a reference plane | |
| JPH0758172B2 (en) | Shape measuring method and apparatus | |
| US4425041A (en) | Measuring apparatus | |
| US5383025A (en) | Optical surface flatness measurement apparatus | |
| JPH0266432A (en) | Optical measuring instrument | |
| US5039213A (en) | Optical equipment with a semitransparent mirror | |
| JP2531449B2 (en) | Laser displacement meter | |
| JP2531450B2 (en) | Laser displacement meter | |
| JPS6117281B2 (en) | ||
| JP2900940B2 (en) | Optical system for three-dimensional shape measurement | |
| JP2754415B2 (en) | Photoelectric autocollimator | |
| JP3023955B2 (en) | Optical system for three-dimensional shape measurement | |
| KR100341637B1 (en) | Triangulation-based 3d imaging and processing method and system | |
| JPH1096603A (en) | Interferometer | |
| JPH0486548A (en) | Packaged substrate appearance inspection device |