JPH0267350A - Resin composition and molding product thereof - Google Patents
Resin composition and molding product thereofInfo
- Publication number
- JPH0267350A JPH0267350A JP21626088A JP21626088A JPH0267350A JP H0267350 A JPH0267350 A JP H0267350A JP 21626088 A JP21626088 A JP 21626088A JP 21626088 A JP21626088 A JP 21626088A JP H0267350 A JPH0267350 A JP H0267350A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- printing
- styrene
- molded product
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 6
- 238000000465 moulding Methods 0.000 title abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000007639 printing Methods 0.000 claims abstract description 26
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 230000035515 penetration Effects 0.000 claims abstract description 14
- 125000003118 aryl group Chemical group 0.000 claims abstract description 12
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims abstract description 10
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 9
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 8
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 8
- -1 polybutylene terephthalate Polymers 0.000 abstract description 12
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- 229920002292 Nylon 6 Polymers 0.000 abstract description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 abstract description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229920001890 Novodur Polymers 0.000 description 4
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000007649 pad printing Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920001898 acrylonitrile–EPDM–styrene Polymers 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000004301 calcium benzoate Substances 0.000 description 1
- 235000010237 calcium benzoate Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- HZQXCUSDXIKLGS-UHFFFAOYSA-L calcium;dibenzoate;trihydrate Chemical compound O.O.O.[Ca+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 HZQXCUSDXIKLGS-UHFFFAOYSA-L 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000004650 carbonic acid diesters Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はスチレン系樹脂(A)に熱可塑性ポリエステル
樹脂CB)と芳香族ポリカーボネート樹脂(C)とポリ
アミド樹脂CD)からなる組成物及びその組成物から得
られる成形品に浸透印刷を施してなる成形品に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention provides a composition comprising a styrene resin (A), a thermoplastic polyester resin CB), an aromatic polycarbonate resin (C), and a polyamide resin CD), and its composition. This invention relates to a molded product obtained by applying penetration printing to a molded product obtained from a product.
かかる組成物は優れた耐衝撃性を有し、かつ極めて優れ
た浸透印刷が可能であるので、パソコン、ワープロ、タ
イプライタ−1電話機、電卓などの押ボタンキーの如く
文字、図柄、記号等をキーの表面に浸透印刷して使用す
るキートップに特に好適である。Such compositions have excellent impact resistance and are capable of extremely good penetration printing, so they can be used to print letters, designs, symbols, etc. on push-button keys of computers, word processors, typewriters, telephones, calculators, etc. It is particularly suitable for key tops used by penetrant printing on the surface of keys.
〔従来の技術と問題点]
キートップ成形品の表面に文字、図柄、記号等を成型す
る方法として、ドライオフセット印刷、シルクスクリー
ン印刷、パッド印刷などの印刷による方法や色の異なっ
た成形品素材で第1次に文字、図柄、記号等を射出成形
し次いで第2次に第1次成形品のまわりに素材を流し込
みキートップ成形品にする二色成形法など従来より公知
である。[Conventional techniques and problems] Methods for molding letters, designs, symbols, etc. on the surface of key top molded products include printing methods such as dry offset printing, silk screen printing, and pad printing, and molded product materials of different colors. A two-color molding method is conventionally known, in which letters, designs, symbols, etc. are first injection molded, and then a material is poured around the first molded product to form a key top molded product.
しかし印刷による方法では、成形品の上にインキが付着
しているだけであるので十分な摩耗耐久性を有する文字
、図柄、記号等は成型できずまた二色成形法は第1次及
び第2次の金型が必要なことからコストが高くなり、ま
た複雑な文字、図柄、記号等は難しく成形品の肉厚を薄
くすることには限界があり大変高価なものとなってしま
う。この解決法として、最近は浸透印刷法、すわなち昇
華性染料を練り込んだインキを用いて、転写紙の上にス
クリーン印刷やパッド印刷などの印刷により予め文字、
図柄、記号等を印刷したものを作成し、これをキートッ
プ成型品上にのせて、さらに加熱圧着し、インキ中の染
料を成形体内部に浸透、固着させる方法や、前記特殊イ
ンキを用いてパッド印刷やスクリーン印刷法により成形
品に直接、文字、図柄等を印刷した後、加熱炉等に投入
し加熱処理することにより、インキ中の染料を成形体内
部に浸透固着させ、不要なインキ成分を溶剤洗浄すると
いう方法が実用化されつつある。この様な浸透印刷を行
なえば、染料が樹脂内部にまで浸透するため摩耗耐久性
に優れ、インキ付着によるインキの肉盛りもなく打鍵感
触も良好であり、かつ多種多様の複雑な文字、図柄、記
号等も容易に成形品上に成型でき、コストも低減できる
。しかし、成形品に使用できる樹脂は限定される。即ち
樹脂によっては加熱処理を施すため、樹脂の耐熱不足に
よる成形品の変形、ゆがみを生じ、また染料の浸透性の
悪さからの浸透深度不足による耐久性不良あるいは染料
の拡散による文字、図柄、記号等のにじみが生じる。こ
の為、現在実用化されているのはポリブチレンテレフタ
レート樹脂、ポリエチレンテレフタレート樹脂等の一部
の樹脂である。However, with the printing method, ink is simply attached to the molded product, so it is not possible to mold characters, designs, symbols, etc. with sufficient wear resistance. The cost increases because another mold is required, and it is difficult to make complex characters, designs, symbols, etc., and there is a limit to reducing the thickness of the molded product, making it very expensive. Recently, as a solution to this problem, the penetrant printing method, that is, using ink mixed with sublimable dye, is used to print characters on the transfer paper in advance by screen printing or pad printing.
There is a method in which a pattern, symbol, etc. is printed, placed on a molded key top, and further heat-pressed to allow the dye in the ink to penetrate and fix inside the molded product, or by using the special ink mentioned above. After printing letters, designs, etc. directly on the molded product using pad printing or screen printing methods, the dye in the ink penetrates into the inside of the molded product by heating it in a heating furnace, etc., and removes unnecessary ink components. A method of cleaning with a solvent is being put into practical use. If this type of penetrant printing is performed, the dye penetrates into the inside of the resin, so it has excellent abrasion durability, there is no buildup of ink due to ink adhesion, and the touch of the key is good, and it can print with a wide variety of complex characters, designs, etc. Symbols and the like can be easily molded onto the molded product, reducing costs. However, the resins that can be used for molded products are limited. In other words, depending on the resin, heat treatment is applied, which may cause deformation or distortion of the molded product due to the resin's lack of heat resistance, poor durability due to insufficient penetration depth due to poor dye penetration, or characters, designs, and symbols due to dye diffusion. smearing occurs. For this reason, only some resins such as polybutylene terephthalate resin and polyethylene terephthalate resin are currently in practical use.
また、ポリブチレンテレフタレート樹脂、ポリエチレン
テレフタレート樹脂であっても結晶性ポリマーである為
、成形の難しさが伴うし、成形品の結晶状態が類似して
いないとインキ浸透後の成形品の色彩が異なることとな
り、キーボード上に並んだ隣り同士のキーの色彩が異な
り、見ぐるしいものとなってしまう。In addition, since polybutylene terephthalate resin and polyethylene terephthalate resin are crystalline polymers, molding is difficult, and if the crystalline states of the molded products are not similar, the color of the molded products after ink penetration will be different. As a result, adjacent keys on the keyboard have different colors, making it visually confusing.
さらに、これらポリブチレンテレフタレート樹脂やポリ
エチレンテレフタレート樹脂などのポリアルキレンテレ
フタレート樹脂に他の樹脂、例えばABS樹脂等を配合
し、成形品へ印刷を施している(特開昭63−9848
2)が、上記の如き問題点があり、さらには単にポリア
ルキレンテレフタレートとABS樹脂とを配合したもの
では熱安定性が悪く成形品を得るのが大変器しい。また
、得られた成形品は耐衝撃強度、曲げ強度等が充分なも
のではなく、充分な機械的、物理的、化学的性質も兼ね
備えた実用に耐える樹脂の開発が切望されている。Furthermore, other resins such as ABS resin are blended with these polyalkylene terephthalate resins such as polybutylene terephthalate resin and polyethylene terephthalate resin, and printing is applied to molded products (Japanese Patent Laid-Open No. 63-9848
However, the method 2) has the above-mentioned problems, and furthermore, a product simply blending polyalkylene terephthalate and ABS resin has poor thermal stability, making it very difficult to obtain a molded product. Furthermore, the obtained molded products do not have sufficient impact strength, bending strength, etc., and there is a strong desire to develop a resin that has sufficient mechanical, physical, and chemical properties and is durable for practical use.
本発明者らはかかる問題点を解決し、優れた浸透印刷可
能な樹脂組成物及び成形品を得るため鋭意検討を重ねた
結果、スチレン系樹脂(A)10〜90重量%に熱可塑
性ポリエステル樹脂(B)10〜90重量%と芳香族ポ
リカーボネート樹脂(C)1〜80重量%とポリアミド
樹脂1〜80重量%からなる組成物を得て、これが優れ
た物性を有し、かつ、浸透印刷が可能であることを見出
し、本発明に達した。The present inventors have made extensive studies to solve these problems and obtain excellent penetration printable resin compositions and molded products. As a result, we have found that 10 to 90 wt. (B) 10 to 90% by weight, aromatic polycarbonate resin (C) 1 to 80% by weight, and polyamide resin 1 to 80% by weight. We have discovered that this is possible and have arrived at the present invention.
本発明に用いるスチレン系樹脂(A)とはスチレン重合
体又はスチレン共重合体であり、例えばアクリロニトリ
ル−ブタジェン−スチレン(ABS)樹脂、アクリロニ
トリル−スチレン(As)樹脂、メチルメタクリレート
−ブタジェン−スチレン(MBS)樹脂、アクリロニト
リル−EPDM−スチレン(AES)樹脂、ブタジェン
−スチレン(HI PS)樹脂、ポリスチレン樹脂など
であり、これらのスチレンの部分の一部あるいは全[α
−メチルスチレン、又はN−フェニルマレンイミドに置
き換えることは通常行なわれる手段であり、本発明成形
品においても、この様な改質スチレン系樹脂を用いうる
。これらの樹脂は単独又は2種以上混合して使用される
。The styrenic resin (A) used in the present invention is a styrene polymer or styrene copolymer, such as acrylonitrile-butadiene-styrene (ABS) resin, acrylonitrile-styrene (As) resin, methyl methacrylate-butadiene-styrene (MBS). ) resin, acrylonitrile-EPDM-styrene (AES) resin, butadiene-styrene (HIPS) resin, polystyrene resin, etc., and some or all of these styrene parts [α
-Methylstyrene or N-phenylmaleimide is a commonly used method, and such modified styrenic resins can also be used in the molded articles of the present invention. These resins may be used alone or in a mixture of two or more.
次に、本発明において、スチレン系樹脂に配合される熱
可塑性ポリエステル樹脂(B)とは、ジカルボン酸化合
物とジヒドロキシ化合物の重縮合、オキシカルボン酸化
合物の重縮合あるいは、これら3成分混合物の重縮合等
によって得られるホモポリエステル、コポリエステル等
であり、好ましくはポリアルキレンテレフタレートであ
り、ポリブチレンテレフタレート及びポリエチレンテレ
フタレートが単独及び混合して使用され、顕著な効果を
示す。Next, in the present invention, the thermoplastic polyester resin (B) blended into the styrene resin is the polycondensation of a dicarboxylic acid compound and a dihydroxy compound, the polycondensation of an oxycarboxylic acid compound, or the polycondensation of a mixture of these three components. They are homopolyesters, copolyesters, etc. obtained by methods such as polyalkylene terephthalate, preferably polyalkylene terephthalate, and polybutylene terephthalate and polyethylene terephthalate can be used alone or in combination, and exhibit remarkable effects.
また、本発明においてスチレン系樹脂に配合される芳香
族ポリカーボネートは、2価フェノールとホスゲンまた
は炭酸ジエステルとの反応によって製造することができ
る。2価フェノールとしては、ビスフェノール類が好ま
しく、特に2.2−ビス(4−ヒドロキシフェニル)プ
ロパンが好ましい、芳香族ポリカーボネートは、2価フ
ェノールのホモポリマー、2種以上の2価フェノールか
らのコポリマーまたは炭酸の一部を他の2塩基酸(たと
えばテレフタル酸、イソフタル酸)で置換したコポリマ
ーの中から選ばれるが、2種以上組合せてもよい。Further, the aromatic polycarbonate to be blended with the styrenic resin in the present invention can be produced by reacting dihydric phenol with phosgene or carbonic acid diester. As the dihydric phenol, bisphenols are preferable, and 2,2-bis(4-hydroxyphenyl)propane is particularly preferable.The aromatic polycarbonate is a homopolymer of dihydric phenols, a copolymer of two or more types of dihydric phenols, or It is selected from copolymers in which a portion of carbonic acid is replaced with other dibasic acids (eg, terephthalic acid, isophthalic acid), but two or more types may be combined.
また、本発明に用いられるポリアミドはラクタムの自己
重縮金物、ジアミンと二塩基酸の重縮金物、ω−アミノ
酸の自己重縮合物またはそれらの共重合物であり、たと
えば6ナイロン、11ナイロン、6.6ナイロン、6/
6.6ナイロン、6/10ナイロンなどが挙げられ、耐
熱性、機械的強度、剛性の点で6ナイロンおよび6.6
ナイロンが適しているが特に限定されるものではない。Further, the polyamide used in the present invention is a self-polymerized metal of lactam, a polycondensed metal of diamine and dibasic acid, a self-polycondensed product of ω-amino acid, or a copolymer thereof, such as nylon 6, nylon 11, 6.6 nylon, 6/
Examples include 6.6 nylon, 6/10 nylon, etc., and 6.6 nylon and 6.6 nylon
Nylon is suitable, but is not particularly limited.
本発明は、上記の如きスチレン系樹脂(A)と熱可塑性
ポリエステル樹脂(B)と芳香族ポリカーボネート樹脂
(C)とポリアミド樹脂(D)とを配合してなる成形品
に浸透印刷を施し、優れた浸透印刷の施された成形品を
得ることを特徴とするものであるが、この成形品を得る
ための各成分の配合比は、スチレン系樹脂(A)/熱可
塑性ポリエステル樹脂(B)/芳香族ポリカーボネート
樹脂(C)/ポリアミド樹脂(D)−10〜90/10
〜90/1〜80/1〜80(重量%)、好ましくは2
0〜80/20〜8015〜6015〜60(重量%)
、より好ましくは20〜70/20〜7015〜501
5〜50(重量%)、更に言えば20〜60/20〜6
015〜4015〜40の範囲に最適値がある場合が多
い。In the present invention, a molded product made by blending the above-mentioned styrene resin (A), thermoplastic polyester resin (B), aromatic polycarbonate resin (C), and polyamide resin (D) is subjected to penetrant printing, and an excellent This method is characterized by obtaining a molded product with permeation printing, and the blending ratio of each component for obtaining this molded product is styrene resin (A)/thermoplastic polyester resin (B)/ Aromatic polycarbonate resin (C)/polyamide resin (D) -10 to 90/10
~90/1~80/1~80 (wt%), preferably 2
0~80/20~8015~6015~60 (weight%)
, more preferably 20-70/20-7015-501
5-50 (wt%), more specifically 20-60/20-6
The optimum value is often in the range of 015-4015-40.
また、本発明においては、成形品を構成する上記の組成
物に、浸透印刷性を大幅に損わない範囲で、公知の添加
物及び/又は充填材を添加できる。Further, in the present invention, known additives and/or fillers can be added to the above-mentioned composition constituting the molded article within a range that does not significantly impair the penetrant printability.
例えば、タルク、石こう、シリカ、炭酸カルシウム、ア
ルミナ、二酸化チタン、微粉砕金属、粉末ガラス、カー
ボンブラック、グラファイト、ポリオレフィン、安息香
酸カルシウム、ステアリン酸マグネシウム、及びテフロ
ンなどの結晶化促進剤や酸化防止剤、各種安定剤、滑剤
、可塑剤、離型剤、帯電防止剤、界面活性剤等である。Crystallization promoters and antioxidants such as talc, gypsum, silica, calcium carbonate, alumina, titanium dioxide, finely divided metals, powdered glass, carbon black, graphite, polyolefins, calcium benzoate, magnesium stearate, and Teflon. , various stabilizers, lubricants, plasticizers, mold release agents, antistatic agents, surfactants, etc.
本発明における組成物の調整法としては、特に制限はな
く一般に常用されている方法で作成することができる。There are no particular restrictions on the method for preparing the composition of the present invention, and any commonly used method can be used.
たとえば全組成成分を一度に混合した後、押出し機によ
り溶融混練しペレット化し、しかる後に成形する。For example, after all the components are mixed at once, they are melt-kneaded and pelletized using an extruder, and then molded.
また、本発明における浸透印刷法も特に限定されるもの
ではなく、昇華性染料を練り込んだ特殊インキを用いて
転写紙の上に文字、図柄、記号等を印刷した後、印刷し
た転写紙を成形品上にのせて加熱圧着し、インキ中の染
料を成形品内部に浸透固着させる方法、あるいは上記イ
ンキを用いてパッド印刷、スクリーン印刷等の方法で成
形品に直接文字、図柄、記号等を印刷した後、加熱炉等
により固着させる方法等を用いることができる。Furthermore, the penetrant printing method used in the present invention is not particularly limited, and after printing letters, designs, symbols, etc. on transfer paper using special ink mixed with sublimable dye, the printed transfer paper is Letters, designs, symbols, etc. can be printed directly onto the molded product by placing it on the molded product and heat-pressing it, allowing the dye in the ink to penetrate into the inside of the molded product, or by pad printing, screen printing, etc. using the above ink. After printing, a method of fixing using a heating furnace or the like can be used.
本発明を実施例により具体的に説明する。尚、以下に示
す実施例及び比較例における浸透印刷法及び評価法等は
次の通りである。The present invention will be specifically explained with reference to Examples. The penetration printing method, evaluation method, etc. in the Examples and Comparative Examples shown below are as follows.
(1) 造粒は株式会社中央機械製作所製VC−40
(ベント付単軸押出機)によりベレットを得た。(1) Granulation is VC-40 manufactured by Chuo Kikai Seisakusho Co., Ltd.
A pellet was obtained using a vented single-screw extruder.
(2)得られたペレットを用いて、成形物を作成して物
性評価を行ない、同時に浸透印刷評価用の成形品を得た
。(2) Using the obtained pellets, a molded article was prepared and the physical properties were evaluated, and at the same time a molded article for permeation printing evaluation was obtained.
(3)浸透印刷評価試験片
キートップ成形品 18X18X7■
(1,00倍キー)シボ付
(4)浸透印刷法
東洋インキ(株)製 SMX PBT (墨)F1イ
ンキをシルクスクリーン印刷により文字を印刷した転写
紙を作成し、予め約150°Cにて180秒間予熱して
あったキートップ成形品上に乗せ、その上から180°
Cに加熱してあった耐熱ゴム製パッドを60秒間印圧し
て、成形品内部に染料を浸透させ、固着させた。(3) Penetration printing evaluation test piece key top molded product 18X18X7■ (1,00x key) with grain (4) Penetration printing method Toyo Ink Co., Ltd. SMX PBT (black) F1 ink is used to print characters by silk screen printing Create a transfer paper, place it on the molded key top that has been preheated at about 150°C for 180 seconds, and then heat it 180° from above.
A heat-resistant rubber pad heated to C was applied pressure for 60 seconds to penetrate the dye into the molded product and fix it.
(5)評価法
i)印刷部の摩耗耐久性
ライオン事務機(株)製電動消ゴム用砂消ゴム阻201
を用いて荷重350gで、印刷面を往復移動させ、文字
の一部が消えるまでの往復の移動回数が5000回以上
のものをA、 5000回未満3000回以上のものを
B、3000回未満1000回以上のものをC,100
0回未満のものをDとして評価した。(5) Evaluation method i) Abrasion durability of printing section Sand eraser blocker 201 for electric eraser manufactured by Lion Office Machinery Co., Ltd.
The printed surface is reciprocated using a load of 350g, and the number of reciprocating movements until some of the characters disappear is 5,000 times or more. A: Less than 5,000 times, 3,000 times or more. B: Less than 3,000 times, 1,000 times. C,100 times or more
Less than 0 times were evaluated as D.
ii)外観及び品位
浸透印刷直後及び浸透印刷されたキートップ成形品を7
5°C195%RHの恒温恒湿槽中に240時間放置し
た後、外観及び品位を肉眼及び拡大鏡で観察し、1〜5
段階で評価した。印刷した文字の幅に対してにじみが文
字の幅の20%以下のものを1.40%以下のものを2
.60%以下のものを3.80%以下のものを4.80
%を越えるものを5とした。ii) Appearance and quality of the key top molded product immediately after penetrant printing and after penetrant printing.
After leaving it in a constant temperature and humidity chamber at 5°C and 195% RH for 240 hours, the appearance and quality were observed with the naked eye and with a magnifying glass.
Evaluated in stages. If the bleeding is less than 20% of the width of the printed characters, it is 1. If the bleeding is less than 40%, it is 2.
.. 60% or less: 3.80% or less: 4.80
Those exceeding % were given a score of 5.
1ii)浸透度
浸透化を図ったキートップを液体窒素中に浸漬し、キー
トップ素材樹脂のTg点以下に温度を下げてからキート
ップ表面の印刷した文字、記号及び図形の箇所で破断し
、断面を東京光学機械(株)製、TUM−200BD万
能工具顕微鏡にて観察し、インキの浸度を読み取った。1ii) Penetration: The permeated key top is immersed in liquid nitrogen, the temperature is lowered to below the Tg point of the key top material resin, and the key top is broken at the printed characters, symbols and figures on the key top surface, The cross section was observed using a TUM-200BD universal tool microscope manufactured by Tokyo Kogaku Kikai Co., Ltd., and the degree of ink immersion was read.
そして浸透度が30μm以上あるものをA、30μm未
満20μm以上のものをB120μm未満10am以上
のものを0110μm未満のものをDで表わした。Those with a permeability of 30 μm or more are represented by A, those with a permeability of less than 30 μm and 20 μm or more are represented by B, those with a permeability of less than 120 μm and 10 am or more are represented by D, and those with a permeability of less than 110 μm are represented by D.
iv)樹脂表面の変化
転写紙をキートップ表面に乗せ、耐熱ゴム製パッドで印
圧したとき、キートップ表面のシボ面の変化を観察した
。このとき転写によりシボの状態に変化のないものをA
、シボの状態が変化は認められるが注意して初めてわか
るものをB、シボの状態が変化して明らかなものをC、
シボの状態が変化してシボが消失してしまうものをDで
表わした。iv) Change in Resin Surface When a transfer paper was placed on the key top surface and a heat-resistant rubber pad was used to apply pressure, changes in the grained surface of the key top surface were observed. At this time, A
, B indicates that the condition of the grain has changed but can only be noticed by paying attention, and C indicates that the condition of the grain has clearly changed.
A case where the condition of the grain changes and the grain disappears is indicated by D.
以下、本発明の実施例を示すが、本発明はこれに限定さ
れるものではない、また、実施例及び比較例に示す%は
、全て重量を基準とするものである。Examples of the present invention are shown below, but the present invention is not limited thereto. All percentages shown in the Examples and Comparative Examples are based on weight.
実施例1、比較例1
表1にスチレン系樹脂の組成を示す。いずれも重量%を
示す数値である。表1のスチレン系樹脂とポリエチレン
テレフタレート(PET)樹脂(日本ユニペット(株)
製、RT−523C)とポリブチレンテレフタレート(
PBT)樹脂(アグゾ社製、TO6−202)と芳香族
ポリカーボネート(pc)樹脂(三菱化成(株)製、A
7020)IF)とポリアミド(PA)樹脂(東しく
株)製、CM−1017)とを表2の割合で造粒した。Example 1, Comparative Example 1 Table 1 shows the composition of the styrene resin. All values indicate weight %. Table 1 Styrenic resin and polyethylene terephthalate (PET) resin (Nippon Unipet Co., Ltd.)
RT-523C) and polybutylene terephthalate (
PBT) resin (manufactured by Agzo Corporation, TO6-202) and aromatic polycarbonate (PC) resin (manufactured by Mitsubishi Kasei Corporation, A
7020) IF) and polyamide (PA) resin (manufactured by Toshiku Co., Ltd., CM-1017) were granulated in the proportions shown in Table 2.
次いで、このペレットの一部を物性測定用に使用し、残
りで射出成形によた試験片(キートップ)を作成し、浸
透印刷を施し、評価した。結果とともに表2に示す。Next, a part of this pellet was used for measuring physical properties, and the rest was used to make a test piece (key top) by injection molding, which was subjected to penetration printing and evaluated. The results are shown in Table 2.
実施例2、比較例2〜4
表1中の(A−3)、(A−4)、(A−6)成分にさ
らに(A−5)、(A−7)のそれぞれを混合したB成
分を作成し、表3に示した。このB成分をスチレン系樹
脂として、さらにPET樹脂、PBT樹脂、PC樹脂、
PA樹脂を実施例1と同様の処理を行ない評価した。結
果とともに表4に示す。Example 2, Comparative Examples 2 to 4 B in which each of (A-5) and (A-7) was further mixed with the components (A-3), (A-4), and (A-6) in Table 1. The components were prepared and shown in Table 3. This B component is used as a styrene resin, and further PET resin, PBT resin, PC resin,
The PA resin was subjected to the same treatment as in Example 1 and evaluated. The results are shown in Table 4.
実施例3、比較例5
スチレン系樹脂として表3中のB−3を用いて、実施例
1と同様の処理を行ない評価した。結果とともに表5に
示す。Example 3, Comparative Example 5 Using B-3 in Table 3 as the styrene resin, the same treatment as in Example 1 was performed and evaluated. The results are shown in Table 5.
以上の実施例及び比較例によって明らかな如く、スチレ
ン系樹脂と熱可塑性ポリエステル樹脂と芳香族ポリエス
テル樹脂とポリアミド樹脂を含有する組成物は、スチレ
ン系樹脂と熱可塑性ポリエステル樹脂の2種よりなる組
成物や、芳香族ポリカーボネート樹脂を含まないスチレ
ン系樹脂と熱可塑性ポリエステル樹脂とポリアミド樹脂
組成物との組成物よりも物性的にも優れ、本発明の組成
物の成形品に浸透印刷したものは、上記2種の組成物の
成形品に浸透印刷したものに比べ、浸透印刷性が改良さ
れ、加熱処理等によりインキのにじみが著しく少なく、
キートップ表面のシボの変化も著しく少なく、摩耗耐久
性にも優れた浸透印刷成形品を得ることが可能となった
。As is clear from the above Examples and Comparative Examples, the composition containing a styrene resin, a thermoplastic polyester resin, an aromatic polyester resin, and a polyamide resin is a composition consisting of two types of styrene resin and a thermoplastic polyester resin. It also has better physical properties than a composition of a styrene resin, a thermoplastic polyester resin, and a polyamide resin composition that does not contain an aromatic polycarbonate resin. Compared to penetrant printing on molded products of two types of compositions, the penetrant printability is improved, and the ink bleeds significantly less due to heat treatment, etc.
It has become possible to obtain a penetrant-printed molded product with significantly less variation in the grain on the key top surface and excellent abrasion durability.
特許出願人 電化化学工業株式会社Patent applicant Denka Kagaku Kogyo Co., Ltd.
Claims (1)
ポリエステル樹脂(B)10〜90重量%と芳香族ポリ
カーボネート樹脂(C)1〜80重量%とポリアミド樹
脂(D)1〜80重量%からなる樹脂組成物。 2、特許請求の範囲第1項に記載の組成物の成形品に浸
透印刷を施した成形品。[Claims] 1. 10-90% by weight of styrene resin (A), 10-90% by weight of thermoplastic polyester resin (B), 1-80% by weight of aromatic polycarbonate resin (C), and 1-80% by weight of polyamide resin (D). ) A resin composition consisting of 1 to 80% by weight. 2. A molded article obtained by performing penetration printing on a molded article of the composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21626088A JPH0267350A (en) | 1988-09-01 | 1988-09-01 | Resin composition and molding product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21626088A JPH0267350A (en) | 1988-09-01 | 1988-09-01 | Resin composition and molding product thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267350A true JPH0267350A (en) | 1990-03-07 |
Family
ID=16685767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21626088A Pending JPH0267350A (en) | 1988-09-01 | 1988-09-01 | Resin composition and molding product thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267350A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5653451A (en) * | 1995-12-21 | 1997-08-05 | Ishikawa Gasket Co., Ltd. | Metal gasket with independent and eccentric support bead |
-
1988
- 1988-09-01 JP JP21626088A patent/JPH0267350A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5653451A (en) * | 1995-12-21 | 1997-08-05 | Ishikawa Gasket Co., Ltd. | Metal gasket with independent and eccentric support bead |
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