JPH0268988A - Surface mounting printed wiring board - Google Patents
Surface mounting printed wiring boardInfo
- Publication number
- JPH0268988A JPH0268988A JP22087688A JP22087688A JPH0268988A JP H0268988 A JPH0268988 A JP H0268988A JP 22087688 A JP22087688 A JP 22087688A JP 22087688 A JP22087688 A JP 22087688A JP H0268988 A JPH0268988 A JP H0268988A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wiring board
- printed wiring
- copper
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 15
- 238000007790 scraping Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 2
- 238000009713 electroplating Methods 0.000 abstract 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装プリント配線板に関し、特に平面的に
電子部品が搭載される導電性パッドを有する表面実装プ
リント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface mount printed wiring board, and more particularly to a surface mount printed wiring board having conductive pads on which electronic components are mounted two-dimensionally.
従来、この種の表面実装用プリント配線板は第３図で示
すようにプリント配線板１３上に電子部品実装用パッド
１４を持つ構造となっていた。Conventionally, this type of surface mounting printed wiring board has had a structure in which electronic component mounting pads 14 are provided on a printed wiring board 13, as shown in FIG.
上述した従来の表面実装用プリント配線板は電子部品実
装用導電性パッドが平面上に並んでいるため、電子部品
をハンダ付けする際に隣接したパッドにハンダが接触し
ショートする可能性がある。これを予防する方法として
導電性パッド間にソルダーレジストをつけ、パッド間を
分離する方法があるがこれではパッド間げきがせまい場
合ソルダーレジストを信頼性の問題なしにプリント配線
板に接着することができずはがれやすい状態となってし
まうため無理である。部品の高密度化でだんだん電子部
品のピンの間隔が狭くなってきていることを考えるとパ
ッド間にソルダーレジストを付けるのは困難になってお
り、したがってハンダによる導電性パッド間ショートは
おこりやすいという欠点を持っている。In the above-described conventional surface-mount printed wiring board, conductive pads for mounting electronic components are arranged on a flat surface, so when soldering electronic components, the solder may come into contact with adjacent pads and cause a short circuit. One way to prevent this is to apply solder resist between the conductive pads to separate the pads, but if the gap between the pads is narrow, it is not possible to bond the solder resist to the printed wiring board without reliability problems. This is impossible because it will not be possible and will be in a state where it will peel off easily. Considering that the spacing between the pins of electronic components is becoming narrower due to the increasing density of components, it is becoming difficult to apply solder resist between pads, and therefore short circuits between conductive pads due to solder are likely to occur. have shortcomings.
本発明はプリント配線板上の電子部品実装部に部分的に
凸凹を持ち、前記凸凹部全面に銅メッキを施し、前記凸
凹部分の銅メッキを上部から選択的に削ることによって
作られる複数の表面実装部品取付け用パッドを有してい
る。The present invention provides a plurality of surfaces that are created by partially having unevenness in an electronic component mounting area on a printed wiring board, applying copper plating to the entire surface of the uneven area, and selectively scraping the copper plating on the uneven area from the top. It has pads for mounting components.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）〜（ｅ）は本発明の一実施例のプリント配
線板の製造方法を示した断面図である。FIGS. 1(a) to 1(e) are cross-sectional views showing a method of manufacturing a printed wiring board according to an embodiment of the present invention.
第１図において、本発明の一実施例はプリント配線板１
の一部に第１図（ａ）のように複数の７字型の溝を形成
する。パッドと電気的接続の必要な物については小径の
六３をあける。In FIG. 1, one embodiment of the present invention shows a printed wiring board 1.
A plurality of 7-shaped grooves are formed in a part of the groove as shown in FIG. 1(a). For pads and items that require electrical connection, open a small diameter hole 63.
このように形成した７字型の部分すべてに第１図（ｂ）
で示すように銅メッキ４を施す。このとき小径のホール
３のメッキされ、スルーホールメッキ５が施される。Figure 1(b) is applied to all the 7-shaped parts formed in this way.
Copper plating 4 is applied as shown in . At this time, the small-diameter holes 3 are plated, and through-hole plating 5 is applied.
このメッキの上にさらに第１図（Ｃ）のように銅メッキ
４を施す。ここで第１図（ｄ）のように銅メッキ上面を
削り、この上からエツチングを行なうことにより、導電
性パッド６．７．８は第１図（ｅ）のようにそれぞれ分
離する。On top of this plating, copper plating 4 is further applied as shown in FIG. 1(C). By scraping the top surface of the copper plating as shown in FIG. 1(d) and etching from above, the conductive pads 6, 7, 8 are separated from each other as shown in FIG. 1(e).
第２図は本発明の一実施例の斜断面を示す。FIG. 2 shows a perspective cross-section of an embodiment of the invention.
第２図において、本実施例はプリント配線板１の表面に
７字型の溝２を複数本設け、この７字型の溝２に銅メッ
キ４を施して得た導電性パッド６゜７．８．１１を設け
る。導電性パッド６には電気的に接続可能のように小径
の六３に銅メッキによりスルーホールメッキ５が施され
る。なお、導電性パッドの上部ｒ−０には電子部品が搭
載されるように構成されている。In FIG. 2, in this embodiment, a plurality of 7-shaped grooves 2 are provided on the surface of a printed wiring board 1, and the 7-shaped grooves 2 are plated with copper 4 to form a conductive pad 6. 8.11 will be established. Through-hole plating 5 is applied to the conductive pad 6 by copper plating on a small diameter 63 so as to enable electrical connection. Note that electronic components are configured to be mounted on the upper part r-0 of the conductive pad.
このように本実施例は導電性パッド６．７．８が第１図
（ｅ）の断面を見てもわかるようにプリント配線板の基
材白部分によって区切られているためハンダの流れこみ
によるショートを起こりにくくするものである。導電性
パッドとの電気的接続はスルーホール５で行ない、この
スルーホール５を外層または内層の信号層と接続するこ
とにより電気的に接続できる、なお、外層および内層信
号層との接続は本発明と直接関係ないためその説明を省
略する。As described above, in this embodiment, the conductive pads 6, 7, and 8 are separated by the white part of the base material of the printed wiring board, as can be seen from the cross section of FIG. This makes short circuits less likely to occur. Electrical connection with the conductive pad is made through a through hole 5, and electrical connection can be made by connecting this through hole 5 with the signal layer of the outer layer or the inner layer.The connection with the outer layer and the inner signal layer can be made according to the present invention. Since it is not directly related to this, its explanation will be omitted.
以上説明したように本発明はプリント配線板上に設けた
凸凹部の凹部分につけた銅メッキ部分を電子部品実装用
のパッドとして利用し、かつ凸部をパッド間の分離に利
用することによりハンダの流れこみによるパッド間のシ
ョートをなくし、かつパッド間の凸部を利用し電子部品
の実装時にリードの位置あわせが容易にできるという効
果がある。As explained above, the present invention utilizes the copper-plated portion attached to the concave portion of the concave and convex portion provided on the printed wiring board as a pad for mounting electronic components, and uses the convex portion to separate the pads, thereby making it possible to solder. This has the effect of eliminating short-circuits between pads due to inflow, and making use of the protrusions between pads to facilitate positioning of leads when mounting electronic components.
第１図（ａ）〜（ｅ）は本発明の実施例のプリント配線
板製造法を示す断面図、第２図は本発明の実施例を示す
斜断面図、第３図は従来の技術を示すプリント配線板を
示す断面図である。
１・・・表面実装用プリント配線板、２・・・７字型の
みぞ、３・・・小径のスルーホール、４・・・銅メッキ
、５・・・スルーホール、６，７，８．１１・・・形成
された導電性パッド、１０・・・部品取付け面、１３・
・・従来の表面実装用プリント配線板、１４・・・導電
性パッド。
代理入弁理士内原 音1(a) to (e) are cross-sectional views showing a printed wiring board manufacturing method according to an embodiment of the present invention, FIG. 2 is a perspective cross-sectional view showing an embodiment of the present invention, and FIG. 3 is a conventional technique. FIG. 2 is a cross-sectional view of the printed wiring board shown in FIG. 1... Printed wiring board for surface mounting, 2... 7-shaped groove, 3... Small diameter through hole, 4... Copper plating, 5... Through hole, 6, 7, 8. 11... Formed conductive pad, 10... Component mounting surface, 13.
... Conventional printed wiring board for surface mounting, 14... Conductive pad. Acting Patent Attorney Oto Uchihara
Claims (1)
面に銅メッキを施し、前記凸凹部分の銅メッキを上部か
ら選択的に削ることにより複数の表面実装部品取り付け
用パッドを作成することを特徴とする表面実装プリント
配線板。A plurality of pads for mounting surface mount components are created by partially providing unevenness on a printed wiring board, applying copper plating to the entire surface of the unevenness, and selectively scraping off the copper plating on the unevenness from the top. Features of surface mount printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22087688A JPH0268988A (en) | 1988-09-02 | 1988-09-02 | Surface mounting printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22087688A JPH0268988A (en) | 1988-09-02 | 1988-09-02 | Surface mounting printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268988A true JPH0268988A (en) | 1990-03-08 |
Family
ID=16757921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22087688A Pending JPH0268988A (en) | 1988-09-02 | 1988-09-02 | Surface mounting printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268988A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1742522A3 (en) * | 2005-07-08 | 2008-09-17 | Samsung Electronics Co., Ltd. | Light emitting diode module, backlight assembly and display device provided with the same |
| WO2011052211A1 (en) * | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
| US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
| US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
| US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
| US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
| US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
| DE112011105766B4 (en) | 2011-10-27 | 2021-11-11 | Mitsubishi Electric Corporation | Program logic controller |
-
1988
- 1988-09-02 JP JP22087688A patent/JPH0268988A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1742522A3 (en) * | 2005-07-08 | 2008-09-17 | Samsung Electronics Co., Ltd. | Light emitting diode module, backlight assembly and display device provided with the same |
| US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
| US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
| US9332650B2 (en) | 2008-04-30 | 2016-05-03 | Panasonic Corporation | Method of producing multilayer circuit board |
| US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
| US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
| WO2011052211A1 (en) * | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
| TWI463930B (en) * | 2009-10-30 | 2014-12-01 | 松下電器產業股份有限公司 | Circuit board and semiconductor device having components mounted on the circuit board |
| US8929092B2 (en) | 2009-10-30 | 2015-01-06 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
| US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
| US9351402B2 (en) | 2009-10-30 | 2016-05-24 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
| DE112011105766B4 (en) | 2011-10-27 | 2021-11-11 | Mitsubishi Electric Corporation | Program logic controller |
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