JPH0270439U - - Google Patents

Info

Publication number
JPH0270439U
JPH0270439U JP1988087677U JP8767788U JPH0270439U JP H0270439 U JPH0270439 U JP H0270439U JP 1988087677 U JP1988087677 U JP 1988087677U JP 8767788 U JP8767788 U JP 8767788U JP H0270439 U JPH0270439 U JP H0270439U
Authority
JP
Japan
Prior art keywords
bonding
detection means
tool
wire
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988087677U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988087677U priority Critical patent/JPH0270439U/ja
Publication of JPH0270439U publication Critical patent/JPH0270439U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1988087677U 1988-06-30 1988-06-30 Pending JPH0270439U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988087677U JPH0270439U (2) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988087677U JPH0270439U (2) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH0270439U true JPH0270439U (2) 1990-05-29

Family

ID=31312278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988087677U Pending JPH0270439U (2) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH0270439U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置

Similar Documents

Publication Publication Date Title
JPH0270439U (2)
JPH01174930U (2)
JPS6323899U (2)
JPH0313740U (2)
JPS63195730U (2)
JPH01173939U (2)
JPS61200224U (2)
JPS5891484U (ja) 揺動選別機の自動制御装置
JPS6359325U (2)
JPS63189585U (2)
JPS5979238U (ja) 穀類搗精装置
JPS62169810U (2)
JPS6321543U (2)
JPH01107134U (2)
JPS6211625U (2)
JPS6363780U (2)
JPS623715U (2)
JPS6449932U (2)
JPS58141322U (ja) 田植機における縦送り装置
JPS63180502U (2)
JPS62199949U (2)
JPH01110445U (2)
JPS6242932U (2)
JPS60187537U (ja) 自動ワイヤボンダ
JPS61147151U (2)