JPH0271507A - Chip type film capacitor - Google Patents

Abstract

PURPOSE:To enhance a rated potential by a method wherein electrodes of adjacent unit capacitor sheets are arranged in such a way that they are individually at the same potential. CONSTITUTION:An electrode 13b at the lower part of an uppermost unit capacitor sheet 11 and an electrode 13b at the upper part of a second unit capacitor sheet 11 are faced so as to be of the same potential; in addition, an electrode 13a at the lower part of the second unit capacitor sheet 11 and an electrode 13a at the upper part of a third unit capacitor sheet 11 are faced so as to be of the same potential; these electrodes are laminated one after another in this manner; the electrodes of the adjacent unit capacitor sheets 11 are arranged via coating layers 14, 14 so as to be of the same potential. In a chip-type film capacitor 10 constituted in this manner, a potential difference is caused only between the electrodes 13a, 13b of a unit capacitor sheet 11; the coating layers 14, 14 situated between the adjacent unit capacitor sheets 11, 11 do not function as subdielectrics. Accordingly, since the chip-type film capacitor 10 is not affected by a material, a film thickness, a bonding state and the like of the coating layer 14, it is possible to enhance a temperature characteristic, to prevent a dielectric loss tangent from being deteriorated and to enhance 1 rated potential of a capacitor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type film capacitor used in electronic equipment, electrical equipment, and the like.

[Conventional technology]

In recent years, chip-type film capacitors have come into widespread use as electronic devices, electrical devices, etc. have become smaller and lighter.

As shown in FIG. 2, a conventional chip-type film capacitor 1 has electrodes 3a and 3b for holding static electricity formed on both sides of a dielectric 2 made of a plastic film using vapor-deposited metal such as aluminum. On the outer surface of the electrodes 3a and 3b,
Each unit capacitor 5, each provided with a coating layer 4.4 made of polycarbonate resin or the like, is connected to an adjacent electrode 3a.

A plurality of capacitor leaves 5, 5 are successively stacked and pressed together so that capacitors 3b have different potentials, and a protective film 6.6 is provided on the outer surface of the outermost unit capacitor leaves 5, 5.

[Problem to be solved by the invention]

Therefore, by reducing the thickness of the dielectric 2 or the coating layer 4, the capacitor can be made smaller; are arranged alternately, a potential difference is generated between the electrodes 3a and 3b facing each other via the coating layers 4, 4, and the coating layer 4 acts as a subdielectric.

On the other hand, since the coating layer 4 also has an adhesive function for joining and integrating a plurality of unit capacitors 5, the material of the coating layer 4 and the coating layer 4 The balance between the thickness of the capacitor and the dielectric 2 may lead to poor temperature characteristics, deterioration of the dielectric loss tangent, etc., and the bonding condition due to the adhesive function may significantly affect the reliability of the capacitor. There was an inconvenience. For this reason, it has been difficult to manufacture capacitors with a high rated potential.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a chip-type film capacitor that solves these inconveniences and is easy to manufacture as a capacitor with a high rated potential.

[Means to solve the problem]

The present invention was made in view of the above points, and consists of forming electrodes for maintaining capacitance using vapor-deposited metal on both sides of a dielectric material made of a plastic film, and providing a coating layer on the outer surface of the electrodes to form a unit. A chip-type film capacitor in which a capacitor leaf is formed and a plurality of unit capacitor leaves are laminated and crimped to form one unit, and the electrodes of adjacent unit capacitor leaves are arranged so as to have the same potential. .

[For production]

With this configuration, the coating layer no longer functions as a conductor, but only functions as an adhesive that physically joins the unit capacitor leaves together.

〔Example〕

Hereinafter, an example of the present invention will be explained based on FIG. 1.

In the chip-type film capacitor 1o, each unit capacitor leaf 11 is made up of a dielectric material 12 made of a plastic film and electrodes made of vapor-deposited metal such as aluminum formed on both surfaces of the dielectric material 12 to maintain capacitance, as in the conventional case. 13a, 1
3b, and a coating layer 1 made of polycarbonate resin or the like provided on the outer surface of the electrodes 13a and 13b, respectively.
4 and 14, and the adjacent unit capacitor leaves 11゜11'ij1 poles 13a, 13a each other, and the voltage ff11
3b.

Coating layer 14.1 so that 13b have the same potential
A plurality of unit capacitor leaves 11 are stacked and pressed together so that they face each other with 4 in between, and the outer surfaces of the outermost unit capacitor leaves 11, 11 are covered with a protective film 15.15.

That is, in FIG. 1, the electrode 13b at the bottom of the uppermost unit capacitor plate 11 and the second unit capacitor plate 11
The upper electrode 13b is made to face each other so that they have the same potential, and the electrode 13a at the bottom of the second unit capacitor 11 and the electrode 13a at the top of the third unit capacitor 11 are made to face each other so that they have the same potential. are sequentially laminated so that the electrodes of adjacent unit capacitor leaves 11 have the same potential through the coatings 114 and 14.

With this configuration, the chip-type film capacitor 10 has the electrodes 13a and 13 of the unit capacitor leaf 11.
The coating 114.14 located between the electrodes of adjacent unit capacitors 11.11 does not act as a liJ dielectric, since only a potential difference occurs between b.

Therefore, the coating layer 14 has a unit capacitor leaf 11,
It only serves as an adhesive to physically bond the 11 pieces together.

Therefore, in the chip-type film capacitor 10 according to this embodiment, the material of the coating layer 14 is different.

Since it is not affected by layer thickness, bonding condition, etc., it improves temperature characteristics and prevents deterioration of dielectric loss tangent.
Since the reliability of capacitor performance is improved, the rated potential of the capacitor can be increased.

〔Effect of the invention〕

As described above, in the chip-type film capacitor according to the present invention, since the electrodes of adjacent unit capacitors are arranged through the coating layer so that they have the same potential, the coating layer only needs to function as an adhesive. The reliability of capacitor performance is improved by improving characteristics and preventing deterioration of dielectric loss tangent. Therefore, it becomes easy to manufacture a capacitor with a high rated potential.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. 10... Chip type film capacitor 11...
Intermediate condenser υ莱 12...dielectric 13a. 13b... Electrode 14... Coating layer 15
···Protective film

Claims (1)

[Claims] 1. Electrodes for capacitance retention are formed using vapor-deposited metal on both sides of a dielectric made of plastic film, a coating layer is provided on the outer surface of the electrodes to form a unit capacitor leaf, and a plurality of unit capacitor leaves are laminated. A chip-type film capacitor that is integrated by crimping and is characterized in that the electrodes of adjacent unit capacitor leaves are arranged so that they have the same potential.