JPH0272529U - - Google Patents
Info
- Publication number
- JPH0272529U JPH0272529U JP15224588U JP15224588U JPH0272529U JP H0272529 U JPH0272529 U JP H0272529U JP 15224588 U JP15224588 U JP 15224588U JP 15224588 U JP15224588 U JP 15224588U JP H0272529 U JPH0272529 U JP H0272529U
- Authority
- JP
- Japan
- Prior art keywords
- radius
- wafer
- contour
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
Description
第１図は本考案の一実施例のシリコンウエハの
平面図、第２図は従来のＯＦつきシリコンウエハ
の平面図である。
１：シリコンウエハ、２：ＯＦ、４：レジスト
膜の厚い部分、５：回転方向、６：曲線部分。
FIG. 1 is a plan view of a silicon wafer according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional silicon wafer with an OF. 1: Silicon wafer, 2: OF, 4: Thick part of resist film, 5: Rotation direction, 6: Curved part.
Claims (1)
部分との間にウエハ半径より曲率半径の大きい曲
線部分を有する輪郭をもつことを特徴とする半導
体ウエハ。 1. A semiconductor wafer having a contour having a curved portion having a radius of curvature larger than the wafer radius between a chord portion of an orientation flat and a circumferential portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15224588U JPH0272529U (en) | 1988-11-22 | 1988-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15224588U JPH0272529U (en) | 1988-11-22 | 1988-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272529U true JPH0272529U (en) | 1990-06-01 |
Family
ID=31427000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15224588U Pending JPH0272529U (en) | 1988-11-22 | 1988-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272529U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012051743A (en) * | 2010-08-31 | 2012-03-15 | Showa Denko Kk | Wafer, method for manufacturing template substrate for semiconductor light-emitting element, method for manufacturing semiconductor light-emitting element substrate, template substrate for semiconductor light-emitting element, semiconductor light-emitting element substrate, and resist coating method |
-
1988
- 1988-11-22 JP JP15224588U patent/JPH0272529U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012051743A (en) * | 2010-08-31 | 2012-03-15 | Showa Denko Kk | Wafer, method for manufacturing template substrate for semiconductor light-emitting element, method for manufacturing semiconductor light-emitting element substrate, template substrate for semiconductor light-emitting element, semiconductor light-emitting element substrate, and resist coating method |