JPH0256440U - - Google Patents
Info
- Publication number
- JPH0256440U JPH0256440U JP1988135715U JP13571588U JPH0256440U JP H0256440 U JPH0256440 U JP H0256440U JP 1988135715 U JP1988135715 U JP 1988135715U JP 13571588 U JP13571588 U JP 13571588U JP H0256440 U JPH0256440 U JP H0256440U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- utility
- scope
- back surface
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の第１の実施例の平面図、第２
図は第１図の部分拡大図、第３図は本考案の第２
の実施例の平面図である。
１……ウエハー、２……溝、３……荒らし部。
Figure 1 is a plan view of the first embodiment of the present invention;
The figure is a partially enlarged view of Fig. 1, and Fig. 3 is the second part of the present invention.
FIG. 1... Wafer, 2... Groove, 3... Rough part.
Claims (1)
る半導体装置。 A semiconductor device characterized by having a groove on the back surface of a semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135715U JPH0256440U (en) | 1988-10-17 | 1988-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988135715U JPH0256440U (en) | 1988-10-17 | 1988-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256440U true JPH0256440U (en) | 1990-04-24 |
Family
ID=31395591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988135715U Pending JPH0256440U (en) | 1988-10-17 | 1988-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256440U (en) |
-
1988
- 1988-10-17 JP JP1988135715U patent/JPH0256440U/ja active Pending