JPH0272536U - - Google Patents

Info

Publication number
JPH0272536U
JPH0272536U JP1988150745U JP15074588U JPH0272536U JP H0272536 U JPH0272536 U JP H0272536U JP 1988150745 U JP1988150745 U JP 1988150745U JP 15074588 U JP15074588 U JP 15074588U JP H0272536 U JPH0272536 U JP H0272536U
Authority
JP
Japan
Prior art keywords
circuit electrode
metal plate
wiring board
printed wiring
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150745U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150745U priority Critical patent/JPH0272536U/ja
Publication of JPH0272536U publication Critical patent/JPH0272536U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案による金属板の回路電極部の斜
視図、第２図は上記の回路電極部にめつき処理を
施した模式的断面図、第３図は上記の回路電極部
にボンデイング装置のキヤピラリーが降下する模
様を模式的に示す図、第４図は上記のボンデイン
グ後の拡散層形成の模様を示す模式図、第５図は
ワイヤボンデイング法による半導体チツプの実装
部分の断面概念図、第６図は従来例の回路電極部
とボンデイングワイヤとの拡散接合面を示す模式
図、第７図は従来例の回路電極部上のめつき層の
曲面化を示す断面図である。 １：金属板、１ａ：回路電極部、１ｂ：脚部、
１ｃ：切割部、２：絶縁基板、３：半導体チツプ
、４：ボンデイングワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板と、回路を形成する導電性金属板とか
    らなり、該金属板の回路電極部に半導体チツプと
    を直接ワイヤボンドすることにより実装するプリ
    ント配線板において、上記回路電極部が長さ方向
    に平行した２本の脚部が形成されるように切割部
    が設けられてなることを特徴とするプリント配線
    板。
JP1988150745U 1988-11-21 1988-11-21 Pending JPH0272536U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (ja) 1988-11-21 1988-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (ja) 1988-11-21 1988-11-21

Publications (1)

Publication Number Publication Date
JPH0272536U true JPH0272536U (ja) 1990-06-01

Family

ID=31424160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150745U Pending JPH0272536U (ja) 1988-11-21 1988-11-21

Country Status (1)

Country Link
JP (1) JPH0272536U (ja)

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