JPH02738U - - Google Patents
Info
- Publication number
- JPH02738U JPH02738U JP7810388U JP7810388U JPH02738U JP H02738 U JPH02738 U JP H02738U JP 7810388 U JP7810388 U JP 7810388U JP 7810388 U JP7810388 U JP 7810388U JP H02738 U JPH02738 U JP H02738U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- heat dissipation
- dissipation device
- wrapping
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図はこの考案の一実施例によるフアクシミ
リー用ＬＳＩ放熱装置を示す平面図、第２図は第
１図の側面図、第３図は第１図の−線におけ
る断面図、第４図は従来のＬＳＩ放熱装置を示す
側面図である。
図中、２はＬＳＩ、３は放熱板、５はバンドで
ある。なお、図中同一符号は同一又は相当部分を
示す。
Fig. 1 is a plan view showing an LSI heat dissipation device for facsimile according to an embodiment of this invention, Fig. 2 is a side view of Fig. 1, Fig. 3 is a sectional view taken along the - line in Fig. 1, and Fig. 4 is a FIG. 2 is a side view showing a conventional LSI heat dissipation device. In the figure, 2 is an LSI, 3 is a heat sink, and 5 is a band. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ＬＳＩと放熱板を接合し、これらの周りに着脱可
能なバンドを巻回して固定してなるＬＳＩ放熱装
置。 In those that bond and fix a heat sink to an LSI,
An LSI heat dissipation device that is made by bonding an LSI and a heat dissipation plate and fixing them by wrapping a removable band around them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7810388U JPH02738U (en) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7810388U JPH02738U (en) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02738U true JPH02738U (en) | 1990-01-05 |
Family
ID=31303052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7810388U Pending JPH02738U (en) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051874A (en) * | 2014-09-02 | 2016-04-11 | トヨタ自動車株式会社 | Semiconductor device and manufacturing method thereof |
-
1988
- 1988-06-13 JP JP7810388U patent/JPH02738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051874A (en) * | 2014-09-02 | 2016-04-11 | トヨタ自動車株式会社 | Semiconductor device and manufacturing method thereof |