JPH0275723U - - Google Patents

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Publication number
JPH0275723U
JPH0275723U JP15455388U JP15455388U JPH0275723U JP H0275723 U JPH0275723 U JP H0275723U JP 15455388 U JP15455388 U JP 15455388U JP 15455388 U JP15455388 U JP 15455388U JP H0275723 U JPH0275723 U JP H0275723U
Authority
JP
Japan
Prior art keywords
reduced pressure
vapor phase
phase growth
growth apparatus
pressure vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15455388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15455388U priority Critical patent/JPH0275723U/ja
Publication of JPH0275723U publication Critical patent/JPH0275723U/ja
Pending legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例1を示す断面図、第2
図は本考案の実施例2を示す断面図、第3図は従
来のLPCVD装置を示す断面図である。 1…ウエーハ、2…反応管、3,8,10…加
熱炉、4…ガス供給孔、5…排気管、6…排気ポ
ンプ、7,9…金属網、11,12…バルブ。
Fig. 1 is a sectional view showing the first embodiment of the present invention;
The figure is a sectional view showing a second embodiment of the present invention, and FIG. 3 is a sectional view showing a conventional LPCVD apparatus. DESCRIPTION OF SYMBOLS 1... Wafer, 2... Reaction tube, 3, 8, 10... Heating furnace, 4... Gas supply hole, 5... Exhaust pipe, 6... Exhaust pump, 7, 9... Metal mesh, 11, 12... Valve.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 減圧下での気相成長によつてウエーハ上に薄膜
を形成する減圧気相成長装置において、ウエーハ
を設置する反応管の排気管路に、排気ガス中に含
まれる未反応ガスを酸化物として処理する高温に
加熱した金属網を有することを特徴とする減圧気
相成長装置。
In a reduced pressure vapor phase growth apparatus that forms thin films on wafers by vapor phase growth under reduced pressure, unreacted gases contained in the exhaust gas are treated as oxides in the exhaust pipe line of the reaction tube in which the wafer is installed. A reduced pressure vapor phase growth apparatus characterized by having a metal mesh heated to a high temperature.
JP15455388U 1988-11-28 1988-11-28 Pending JPH0275723U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15455388U JPH0275723U (en) 1988-11-28 1988-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15455388U JPH0275723U (en) 1988-11-28 1988-11-28

Publications (1)

Publication Number Publication Date
JPH0275723U true JPH0275723U (en) 1990-06-11

Family

ID=31431386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15455388U Pending JPH0275723U (en) 1988-11-28 1988-11-28

Country Status (1)

Country Link
JP (1) JPH0275723U (en)

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