JPH02764B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a magnetic head, and particularly to a method of manufacturing a magnetic head suitable for use in a recording-only head that requires a large gap length.

Conventionally, in magnetic recording and reproducing devices, especially video tape recorders, it is necessary to make the magnetic head 0.5μ or less for high frequency recording and reproduction.For this purpose, a film with a desired gap length is deposited by CVD, sputtering, etc. The gap was formed by glass welding using the infiltration method, pressure bonding method, etc.

However, in recent years, as high coercive force magnetic tapes such as metal tapes have come into use, conventional recording and reproducing magnetic heads with small gap lengths have become magnetically saturated and cannot be used satisfactorily. Therefore, a method has been proposed in which separate magnetic heads are used for recording and reproducing, with the recording head having a large gap length and the reproducing head having a small gap length as in the prior art. At this time, when forming the recording head with a gap length of 2μ or more, the film cannot be deposited using conventional CVD or sputtering methods.
Moreover, even if it adhered, the adhesion was insufficient. For this reason, a method of forming the gap using a photo-etching method is considered. According to this photoetching method, when the gap length is relatively small, the gap can be formed with high precision, but when the gap is large, 2 μ or more, it is difficult to form the gap with high precision.

The present invention was developed in view of the above points, and involves forming grooves with a value slightly smaller than the desired gap length in advance by photo-etching, and then depositing a SiO ₂ coating by CVD, sputtering, etc. to obtain the desired gap length. The present invention provides a method for manufacturing a magnetic head in which a gap having a relatively large gap length can be formed with high precision by attaching a magnetic head.

An embodiment of the present invention will be described below with reference to the drawings. 1A and 1B are perspective views of a pair of ferrite wafers, FIGS. 2 to 6 are perspective views showing the manufacturing process of a magnetic head, and FIG. 7 is a perspective view of a head chip.

To explain the method of manufacturing the magnetic head of the present invention,
First, the surfaces of a pair of ferrite wafers 1 and 2 as shown in FIG.
As shown in the figure, a portion of the surface of one wafer 2 that will later become a gap is photoetched to a depth t ₁ of a value slightly smaller than the desired gap length (for example, about 2 μ if the desired gap length is 2.6 μ). Machining the gap length defining groove 3. Next, Figure 3 A,
As shown in B and C, which is a partially enlarged view of B in the figure, a non-magnetic film (such as SiO ₂ ) 4 is applied to both surfaces of the wafer 2 with grooves and the wafer 1 without grooves, and the film thickness of both wafers is The value _t2 added is the depth value of the gap length regulation groove 3 (2μ) from the desired gap length (2.6μ).
(0.6μ) (for example, 0.3μ is deposited on both wafers). This non-magnetic film is deposited by a conventional CVD method, sputtering method, or the like. At this time, if the depth of the gap length defining groove obtained by the photoetching method exceeds 2 μm, the accuracy is not very good, so the remaining value of the groove depth measured after groove processing is used as the film thickness.

After the non-magnetic film is deposited, the gap length defining groove 3 is formed in one wafer 2 as shown in FIGS. 4A and 4B.
Then, on the other wafer 1, a winding groove 6, a bonding material filling groove 7, and a track width defining groove 5 perpendicular to these grooves are formed on the other wafer 1.

Then, by butting both wafers 1 and 2 together, the glass 9
After welding, slicing and radius polishing are performed as shown by dotted lines in FIGS. 5 and 6 to obtain the head tip 8 shown in FIG. 7.

As described above, according to the present invention, the gap of a magnetic head having a relatively large gap length can be formed with high accuracy and good adhesion because photoetching, CVD, sputtering, and other film deposition methods are used in combination. It is possible to obtain a magnetic head with a large gap length that can sufficiently handle high coercive force tapes such as metal tapes.

[Brief explanation of drawings]

The drawings all show one embodiment of the present invention, and FIGS. 1A and 5B are perspective views of a pair of ferrite wafers, and FIGS.
6 are perspective views showing the manufacturing process of the magnetic head, and FIG. 7 is a perspective view of the head chip. Explanation of main drawing numbers, 1, 2...Pair of wafers, 3
...Gap length defining groove, 4...Nonmagnetic film.

Claims (1)

[Claims] 1. A groove with a depth t ₁ , which is slightly smaller than the desired gap length, is formed in the gap area on the surface of one of the wafers of the pair, and a groove is formed on the surface of one or both of the wafers of the pair. After depositing a non-magnetic film with a total film thickness of t ₂ , the two wafers are abutted and the groove is filled with a non-magnetic material to form a gap with a desired gap length t ₁ +t ₂ . A method for manufacturing a magnetic head with special features.