JPH027882Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a barrel plating device mainly used for forming electrodes of extremely small electronic components such as semiconductor devices.

(Prior Art) Conventionally, in this type of plating device, the article to be plated is stored in a porous barrel made of an electrically insulating material such as plastic, a cathode tangular is inserted, and this barrel is placed in a plating liquid tank. A device configured to be immersed in water and vibrated and rotated is used. In order to uniformly conduct electricity between the articles to be plated, a suitable amount of dummies made of steel balls with a diameter of about 0.5 to 1.0 mm are mixed into the articles to be plated.

(Problems to be solved by the invention) However, in the conventional example having such a configuration, there is a large difference in specific gravity between the article to be plated and the dummy, and the dimensions of the article and the dummy are relatively similar. Then, as the barrel continuously rotates in a certain direction, the article and the dummy are separated, and as shown in FIG. This shows a tendency for so-called blocking to occur frequently. In addition, the objects to be plated tend to gather in area b around the dummy, and the intended purpose due to the inclusion of the dummy cannot be fully achieved, resulting in a decrease in plating efficiency and a high incidence of defective plated items. It was easy to be.

Of course, if you reduce the amount of material to be plated at a time into the barrel and reduce the thickness of the deposit layer at the bottom of the barrel, separation of dummies will be less likely to occur, but this will reduce processing efficiency. do.

The present invention has been developed in view of these circumstances, and it suppresses the separation between the article to be plated and the dummy, enables uniform electrical conduction between the articles, and prevents the dummy from blocking each other. The purpose is to reduce plating defects in products and to reduce current loss by reducing the amount of dummy itself used.

(Means for Solving the Problems) As a means for achieving the above object, in the present invention, the cross-sectional shape of the cathode tangular is substantially similar to the cross-sectional shape of the deposit, and the cross-sectional area is the same as that of the deposit. 20 to 50% of the amount of the deposit, and the tanguiller was inserted into the central portion of the deposit.

(Function) According to the above configuration, the group of articles to be plated that are accumulated and stirred in the lower part of the barrel takes in the tangyular in a relatively thin layer, and there is a space where the dummy is separated from the articles to be plated and aggregated. This results in dummies being uniformly mixed among the objects to be plated.

Furthermore, by increasing the size of the tangyular, the surface area increases and the frequency of contact with the article to be plated increases, so the amount of dummies can be reduced accordingly.

(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings. 1 and 3 show a barrel plating device according to an embodiment of the present invention. In this plating device, a porous plastic barrel 3, which accommodates a mixture of articles to be plated and steel ball dummies, is rotated horizontally between a pair of left and right frames 2, 2, which are held for a certain period of time by a stay 1. A gear 4 supported and fixed on one end of the barrel 3 and a motor unit 5 attached to one frame 2 are connected in a gear-interlocking manner to drive and rotate the barrel 3. Further, a pair of insulated cables 6, 6 are inserted into the barrel 3 from the left and right shaft bearings of the barrel 3,
A cathode tangular 7 is suspended and supported along between the tips.

Support arms 8, 8 are attached to the upper outer surfaces of the left and right frames 2, 2 so as to be slidable back and forth, and these support arms 8, 8 are placed on and supported by a cathode bar 10 held in a plating tank 9. I'm starting to let them do it.

The above basic configuration is the same as that of the conventional one, and in the present invention, the cathode tangyular 7 used is approximately similar in cross-sectional shape to the deposit, and its cross-sectional area is the same as that of the deposit.
It has a cross-sectional shape that accounts for 20 to 50% of the deposit, and is characterized in that such a tanguiller 7 is inserted and placed in the central part of the deposit.

With such a configuration, the tanguiller 7 can be attached to the barrel 3 as shown in FIG.
The objects to be plated accumulated inside the dummy occupy a relatively large volume in the central part of the dummy,
Thereby, as the barrel 3 rotates, a state in which dummies are evenly mixed among the articles to be plated can be easily obtained.

(Effects of the invention) As described above, according to the invention, even with the simple improvement of rationally setting the shape of the cathode tangular that is inserted into the barrel, it is possible to separate and collect the dummies mixed in the article to be plated. It has become possible to perform uniform plating by uniformly applying electricity to each article to be plated.

In addition, by adopting a large, large-area cathode tangular, blocking between dummies can be eliminated.
The amount of the dummy itself mixed in can be reduced, and as a result, current loss is reduced, which is also effective in reducing running costs.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway front view of the plating device according to the present invention, Fig. 2 is a sectional view showing the internal state of the barrel during operation, and Fig. 3 is an overall perspective view of the plating device.
FIG. 4 is a sectional view showing the internal state of the barrel during operation of the conventional device. 1 is a stay, 2 is a frame, 3 is a porous barrel, 4 is a gear, 5 is a motor unit, 6 is an insulated cable, 7 is a cathode tangular, 8 is a support arm, 9 is a plating tank, and 10 is a cathode bar.

Claims (1)

[Claims for Utility Model Registration] A porous barrel in which an article to be plated and a dummy made of a conductive material are mixed and deposited is immersed in a plating solution and driven to rotate, and a cathode is provided in the deposit in the barrel. In a barrel plating device for inserting and arranging a tanguiller, the cross-sectional shape of the cathode tanguiller is substantially similar to the cross-sectional shape of the deposit, and the cross-sectional area is larger than that of the deposit.
20 to 50%, and the barrel plating device is configured such that the tangular is inserted into the center of the deposit.