JPH0280210A - How to manage molding molds - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method of controlling a molding die, and particularly to a technique for realizing improvements in the quality, yield, molding workability, etc. of molded products.

<Conventional technology> In general, resin molding operations are performed based on data regarding molding conditions including molding habits held by each molding die.
This is done by controlling the operation of the molding machine. To this end, the mold must be managed so that the molding machine can be properly controlled and operated based on data regarding molding conditions.

Conventionally, as a management method for this type of molding mold, a code (number) is displayed on the mold, and data regarding the molding conditions of the mold corresponding to the code is written in a notebook, for example, or on a magnetic card or It is stored in a memory card such as a C card, and when a mold is used, the molding conditions are read from the notebook or memory card based on the code of the mold being used, and molding is performed based on the read data. It controls the operation of the machine.

<Problems to be Solved by the Invention> However, in the conventional mold management method, the mold and the memory means such as a notebook or memory card that records data regarding the molding conditions are stored in separate locations from each other. Therefore, there is a risk that the code displayed on the mold may be misread, or an error may occur when comparing the code on the mold side with the code on the memory means side. Therefore, if the above-mentioned error occurs unintentionally, the operation of the molding machine cannot be properly controlled, the quality and yield will be reduced, and in some cases, the molding operation will be interrupted, resulting in Molding conditions corresponding to the molding die must be checked, which significantly reduces molding workability.

Therefore, it is conceivable to attach a memory means such as a memory card to the mold and integrate it, but since the mold is originally something that is handled roughly,
This rough handling tends to damage the memory means or cause it to fall out of the mold and become unusable. Therefore, it cannot be said that this is an effective solution.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a mold management method that can improve quality and yield, and improve molding workability.

<Means for Solving the Problems> In order to achieve the above object, the present invention embeds a memory element in which data regarding molding conditions are stored in advance in a memory element holding member, and molds the memory element holding member. The memory element holding member is detachably attached to the mold, and the data stored in the memory element is read by a reading means when the memory element holding member is removed from the mold.

Effect> According to the present invention, the memory element that stores data regarding molding conditions in advance is removably connected to the molding die via the memory element holding member, so that the memory element and the memory are connected to the molding die. The relative relationship with the element is not impaired.

Furthermore, since the memory element is embedded in the memory element holding member, damage to the memory element can be avoided.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention. In this figure, 1 indicates a molding die, and a memory element holding member 2 is detachably attached to a mounting flange portion IA of this molding die 1. installed.

The memory element holding member 2 is made of a rigid body. That is, as shown in FIG.
The memory element 3 is embedded in the tip of the metal pipe 2B.

The memory element 3 stores in advance data regarding the type of resin to be molded by the molding die 1, molding temperature, molding pressure, molding speed, resin filling amount, and other molding conditions. Lead terminals 6 placed on the printed circuit board 5 provided on the rear side of the base 4 which is press-fitted into the metal pipe 2B and buried in the front side of the metal pipe 2B are made to face the opening of the metal pipe 2B. It is buried in a state. Then, as shown in FIG. 3, the male threaded part 2a of the memory element holding member 2 is screwed into the upper end female threaded part 7a of the mounting hole 7 formed in the mounting flange part IA of the molding die 1. As a result, the memory element holding member 2 is attached to the molding die 1.
It can be detachably attached to the

According to the present invention, when a predetermined molding die 1 is selected during a molding operation, the memory element holding member 2 is removed from this molding die 1 and inserted into a reading means (not shown), and the molding die 1 is matched. It is possible to read data related to molding conditions and control the operation of the molding machine based on the read data. Therefore, the relative relationship between the molding die 1 and the memory element 3 that stores data regarding the molding conditions of the molding die l is not impaired, and control can always be performed based on appropriate molding conditions. Naturally, the quality of the molded product,
The yield is improved, and the relative relationship between the molding die and the memory means is changed as in the past, so the molding operation is interrupted and the molding conditions corresponding to the molding die attached to the molding machine are changed. Since the work for checking can be omitted, molding workability is improved accordingly.

Furthermore, since the memory element 3 is embedded in the memory element holding member 2 made of a rigid body, and the memory element holding member 2 is detachably attached to the molding die 1, the forming die 1 can be easily transported, stored, etc. Even if the memory element holding member 2 is handled fairly roughly, it is possible to prevent the memory element holding member 2 from being damaged or falling off from the mold l, so that the memory element 3 can be reliably protected.

FIG. 4 shows a modification of the memory element holding member 2. In this example, the memory element holding member 2 is inserted into and removed from a square hole 8 formed in, for example, the mounting flange portion IA of the mold l. It has a configuration including a metal rectangular tube 2D and a flange 2E provided at the base end of the metal rectangular tube 2D, and is provided on the rear side of the base 4 which is press-fitted into the metal rectangular tube 2D. Memory elements 3 are arranged on a printed circuit board 5, and lead terminals 6 protruding from the front side of a base 4 are made to face the opening of a square metal tube 2D. Then, insert the screw 9.9 through the through holes 2e, 2e formed in the flange 2E into the screw hole 10.1.
0, the memory element holding member 2 is detachably attached to the molding die 1.

Even in this case, the same effects as those of the embodiment described above can be achieved.

Note that in the above description, the input/output section of the printed circuit board 5 is the lead terminal 6, but the present invention is not limited to this.
For example, a plurality of microcoils may be provided and these coils may be electromagnetically coupled to the microcoil of the reading means, or an optical coupling means using light emitting and light receiving elements may be used. Furthermore, when the molding die 1 is removed from the molding machine after the molding operation is completed, the memory element holding member 2 is reattached to the removed molding die l, and then the molding die 1 is stored. be.

<Effects of the Invention> As explained above, according to the present invention, a memory element that stores data regarding molding conditions in advance is embedded in a memory element holding member, and is detachably attached to the memory element holding member and a molding die. Since the data is read by inserting the memory element holding member from the mold into the reading means, the data can be read between the mold and the memory element that stores data regarding the molding conditions of the mold in advance. The molding machine can always be controlled based on appropriate molding conditions without damaging the relative relationship between the two. Therefore, the quality and yield of the molded product are improved, and molding work efficiency is improved because interruption of the molding work that would occur if the relative relationship between the molding die and the memory element is impaired can be avoided.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a memory element holding member, FIG. 3 is a cross-sectional view showing an attached state of the memory element holding member, and FIG. 4 is a perspective view showing an example of the memory element holding member. FIG. 7 is a perspective view showing a modification of the memory element holding member. 1... Molding mold, 2... Memory element holding member, 3...
・Memory element.

Claims (1)

[Claims] (1) A memory element in which data related to molding conditions is stored in advance is embedded in a memory element holding member, this memory element holding member is detachably attached to a molding die, and the memory element holding member is removed from the molding die. . A method for managing a molding die, characterized in that data stored in the memory element is read by a reading means.