JPH028023B2 - - Google Patents

Info

Publication number
JPH028023B2
JPH028023B2 JP14690782A JP14690782A JPH028023B2 JP H028023 B2 JPH028023 B2 JP H028023B2 JP 14690782 A JP14690782 A JP 14690782A JP 14690782 A JP14690782 A JP 14690782A JP H028023 B2 JPH028023 B2 JP H028023B2
Authority
JP
Japan
Prior art keywords
heater
heat input
control plate
input control
plating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14690782A
Other languages
Japanese (ja)
Other versions
JPS5938381A (en
Inventor
Kenichi Yanagi
Toshio Taguchi
Kanji Wake
Heizaburo Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Nippon Steel Nisshin Co Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd, Nisshin Steel Co Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP14690782A priority Critical patent/JPS5938381A/en
Publication of JPS5938381A publication Critical patent/JPS5938381A/en
Publication of JPH028023B2 publication Critical patent/JPH028023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は、所望のメツキ量を瞬時に変化させる
ことのできる真空蒸着炉に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum deposition furnace that can instantly change the desired plating amount.

鋼帯等の連続的にZn,Al等の金属皮膜を真空
蒸着させるための蒸発源のうち、上部加熱方式と
して現在考えられている蒸着炉は、第1図に示す
ような構造のものである。
Among the evaporation sources for continuously vacuum-depositing metal films such as Zn and Al on steel strips, etc., the deposition furnace currently being considered as an upper-heating method has the structure shown in Figure 1. .

第1図において、4は鋼帯、2は真空容器、3
は蒸着鍋、4は加熱ヒータ、5はメツキ材である
溶融金属、6は蒸着口、7は保温材、11はスノ
ーケル、12は溶解炉である。
In Fig. 1, 4 is a steel strip, 2 is a vacuum container, and 3 is a steel strip.
1 is a vapor deposition pot, 4 is a heater, 5 is a molten metal as plating material, 6 is a vapor deposition port, 7 is a heat insulating material, 11 is a snorkel, and 12 is a melting furnace.

真空容器2内に配置された蒸着鍋3は、その内
部にメツキ材5を保有し、該メツキ材5は加熱ヒ
ータ4によつて加熱されて蒸発し、蒸着口6より
噴出して、その上方を走行している鋼帯1に連続
的にメツキされる。
A vapor deposition pot 3 placed in a vacuum container 2 holds a plating material 5 therein, and the plating material 5 is heated by a heater 4 to evaporate, and is ejected from a vapor deposition port 6 to form a layer above the plating material 5. The steel strip 1 that is traveling is continuously plated.

なお、このメツキ材5は溶解炉12で予め溶解
した後、圧力差によつてスノーケル11を経て蒸
着鍋3内に吸上げられる。
The plating material 5 is melted in advance in the melting furnace 12 and then sucked up into the vapor deposition pot 3 via the snorkel 11 due to the pressure difference.

このような従来の蒸着炉には次のような欠点が
ある。
Such conventional vapor deposition furnaces have the following drawbacks.

例えば、供給される鋼帯の厚みが変化した場
合、鋼帯にメツキすべき量を瞬間的に変化させた
いことがあるが、蒸着炉内のメツキ材及び炉体自
身の熱容量が大きいために、加熱源の加熱量を瞬
間的に変化させても、メツキ材の蒸発速度の応答
が遅れ、整定するまでに規格外の目付量を持つた
製品ができてしまう。
For example, when the thickness of the supplied steel strip changes, you may want to instantaneously change the amount of plating on the steel strip, but because the heat capacity of the plating material in the deposition furnace and the furnace itself is large, Even if the heating amount of the heating source is changed instantaneously, the response of the evaporation rate of the plating material is delayed, and by the time it stabilizes, a product with a non-standard basis weight is produced.

本発明は、このような欠点を排除し、鋼帯にメ
ツキさせたい量を瞬間的に変化させることのでき
る真空蒸着炉を提供するものである。
The present invention eliminates these drawbacks and provides a vacuum deposition furnace that can instantaneously change the desired amount of plating on a steel strip.

すなわち本発明は、炉内上方に加熱源ヒータを
有する真空蒸着炉において、該加熱源ヒータと浴
面との間に回動可能な入熱制御板を設けたことを
特徴とする真空蒸着炉に関するものである。
That is, the present invention relates to a vacuum evaporation furnace having a heat source heater above the furnace, characterized in that a rotatable heat input control plate is provided between the heat source heater and the bath surface. It is something.

第2図は本発明蒸着炉の一実施態様例を示す図
である。
FIG. 2 is a diagram showing an embodiment of the vapor deposition furnace of the present invention.

第2図中、第1図と同一符号は第1図と同一機
能部品を示し、第1図と異なる点は加熱ヒータ4
とメツキ材5との間に回転軸8を中心に回転する
ことのできる入熱制御板9を備えている点であ
る。
In Fig. 2, the same symbols as in Fig. 1 indicate the same functional parts as in Fig. 1, and the difference from Fig. 1 is the heater 4.
A heat input control plate 9 that can rotate about a rotating shaft 8 is provided between the plating material 5 and the plating material 5.

この回転軸8及び入熱制御板9は、図示省略の
炉側に設けられた駆動機構により駆動されるよう
になつている。
The rotating shaft 8 and the heat input control plate 9 are driven by a drive mechanism (not shown) provided on the furnace side.

第2図において、定常運転時には、入熱制御板
9を或る一定の開度(例えば、水平に対し45゜の
位置)に保持する。
In FIG. 2, during steady operation, the heat input control plate 9 is held at a certain opening degree (for example, at a position of 45 degrees with respect to the horizontal).

蒸発レートを変化させたい場合は、加熱ヒータ
4のヒータパワーを瞬間的に変化させる(例え
ば、増加させる)と同時に、入熱制御板9の開度
を変化させる(開く、すなわち加熱ヒータ4から
メツキ材5への有効照射面積を増加させる)。
If you want to change the evaporation rate, change the heater power of the heater 4 instantaneously (for example, increase it), and at the same time change the opening degree of the heat input control plate 9 (open, that is, remove the metal from the heater 4). increase the effective irradiation area on the material 5).

蒸発レートが整定されたならば、入熱制御板9
の開度を徐々に元に戻す。
Once the evaporation rate has been stabilized, the heat input control plate 9
Gradually return to the original opening.

この時の蒸発レートの制御性を第3図により模
式的に説明する。
The controllability of the evaporation rate at this time will be schematically explained with reference to FIG.

第3図中、Aは入熱制御板9の開度を、Bは加
熱ヒータ4のヒータパワーをそれぞれ(1)、(2)、
(3)、(4)の態様で変化させることを示しており、
C,D,E.Fはこの変化に応じてヒータ外表面温
度(周方向に温度分布があり、その平均温度を示
す)C、メツキ材5への入熱D、メツキ材5表面
温度E、蒸発レートFがそれぞれ(1)、(2)、(3)、(4)
の態様で変化することを示している。
In Fig. 3, A indicates the opening degree of the heat input control plate 9, and B indicates the heater power of the heater 4 (1), (2), respectively.
(3) and (4) indicate that the changes are made in the manner of (3) and (4).
C, D, and EF are the outer surface temperature of the heater (there is a temperature distribution in the circumferential direction and its average temperature is shown) according to this change, the heat input D to the plating material 5, the surface temperature E of the plating material 5, and the evaporation rate. F is (1), (2), (3), (4) respectively
This indicates that the change occurs in the following manner.

先ず、第3図の(1)は、入熱制御板9の開度Aを
一定にし、加熱ヒータ4のヒータパワーBのみを
ステツプ変化させる場合であり、ヒータ外表面温
度Cはヒータ4及び炉体2の熱容量のために一次
遅れで応答し、従つてメツキ材5への入熱Dも一
次遅れで変化し、これに伴なつてメツキ材5の表
面温度E及び蒸発レートFが一次遅れに近い応答
を示す。
First, (1) in FIG. 3 is a case where the opening degree A of the heat input control plate 9 is kept constant and only the heater power B of the heater 4 is changed in steps, and the heater outer surface temperature C is the same as that of the heater 4 and the furnace. Due to the heat capacity of the body 2, it responds with a first-order lag, and therefore the heat input D to the plating material 5 also changes with a first-order lag, and along with this, the surface temperature E of the plating material 5 and the evaporation rate F change with a first-order lag. Shows a similar response.

次に、第3図の(2)は、加熱ヒータ4のヒータパ
ワーBを一定にし、入熱制御板9の開度Aのみを
ステツプ変化させる場合であり、ヒータ外表面温
度Cは上記の(1)の場合と同様に一次遅れで応答
し、メツキ材5への入熱Dも一次遅れで応答する
が、ヒータパワーBが一定のままであるから、整
定後の値は変化前と同一になる。メツキ材5の表
面温度E及び蒸発レートFも、メツキ材5への入
熱Dとほぼ同様の応答を示す。
Next, (2) in FIG. 3 is a case where the heater power B of the heater 4 is kept constant and only the opening degree A of the heat input control plate 9 is changed in steps, and the heater outer surface temperature C is the above ((2)). As in case 1), it responds with a first-order lag, and the heat input D to the plating material 5 also responds with a first-order lag, but since the heater power B remains constant, the value after settling is the same as before the change. Become. The surface temperature E and evaporation rate F of the plating material 5 also show substantially the same response as the heat input D to the plating material 5.

第3図の(3)は、加熱ヒータ4のヒータパワーB
と入熱制御板9の開度Aとを同時にステツプ変化
させる場合であり、メツキ材5への入熱D及びメ
ツキ材5の表面温度Eは図示のようにステツプ変
化に近い応答を示し、そして入熱制御板9の開度
Aを図示するように段階的に徐々に元に戻すと上
記の(2)の入熱制御板9の開度のみをステツプ変化
させる場合に相当するので蒸発レートFは図示の
ように応答する。
(3) in Figure 3 is the heater power B of the heater 4.
This is a case where the opening degree A of the heat input control plate 9 is simultaneously changed in steps, and the heat input D to the plating material 5 and the surface temperature E of the plating material 5 show a response close to a step change as shown in the figure. If the opening degree A of the heat input control plate 9 is gradually returned to its original value in stages as shown in the figure, this corresponds to the case where only the opening degree of the heat input control plate 9 is changed in steps in (2) above, so the evaporation rate F responds as shown.

第3図の(4)は、加熱ヒータ4のヒータパワーB
と入熱制御板9の開度Aとを同時にステツプ変化
させた後に、入熱制御板9の開度Aを連続的に滑
らかに元に戻す場合であり、蒸発レートFは先ず
上記の(3)の場合と同様にステツプ的に変化する
が、その後は上記の(3)のようなステツプ変化は示
さず、図示するように変化した値をそのまま保持
する。
(4) in Figure 3 is the heater power B of the heater 4.
This is a case where the opening degree A of the heat input control plate 9 is changed in steps at the same time, and then the opening degree A of the heat input control plate 9 is continuously and smoothly returned to the original value. As in the case of ), the value changes stepwise, but after that, the stepwise change as in (3) above is not shown, and the changed value is maintained as is as shown in the figure.

このように、加熱ヒータ4のヒータパワーBと
入熱制御板9の開度Aとを同時にステツプ変化さ
せ、所望の蒸発レートが整定された後に、入熱制
御板9の開度を第3図(4)のように連続的に滑らか
に元に戻せば、蒸発レートFをヒータパワーBの
変化に対して遅れなく変化させることができるの
である。
In this way, the heater power B of the heater 4 and the opening degree A of the heat input control plate 9 are changed in steps at the same time, and after the desired evaporation rate is established, the opening degree of the heat input control plate 9 is changed as shown in FIG. If the evaporation rate F is returned to its original state continuously and smoothly as shown in (4), the evaporation rate F can be changed without delay in response to changes in the heater power B.

以上詳述したことから明らかなように、本発明
蒸着炉においては、鋼帯等へのメツキ量を瞬時に
変化させることができ、工業上極めて有益であ
る。
As is clear from the detailed description above, the deposition furnace of the present invention can instantly change the amount of plating on a steel strip, etc., and is extremely useful industrially.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の真空蒸着炉を示す図、第2図本
発明蒸着炉の一実施態様例を示す図、第3図は本
発明蒸着炉による作用効果を説明するための図で
ある。
FIG. 1 is a diagram showing a conventional vacuum deposition furnace, FIG. 2 is a diagram showing an embodiment of the deposition furnace of the present invention, and FIG. 3 is a diagram for explaining the effects of the deposition furnace of the present invention.

Claims (1)

【特許請求の範囲】[Claims] 1 炉内上方に加熱源ヒータを有する真空蒸着炉
において、前記加熱源ヒータと浴面との間に回動
可能な入熱制御板を設けたことを特徴とする真空
蒸着炉。
1. A vacuum deposition furnace having a heating source heater above the furnace, characterized in that a rotatable heat input control plate is provided between the heating source heater and the bath surface.
JP14690782A 1982-08-26 1982-08-26 Vacuum deposition furnace Granted JPS5938381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14690782A JPS5938381A (en) 1982-08-26 1982-08-26 Vacuum deposition furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14690782A JPS5938381A (en) 1982-08-26 1982-08-26 Vacuum deposition furnace

Publications (2)

Publication Number Publication Date
JPS5938381A JPS5938381A (en) 1984-03-02
JPH028023B2 true JPH028023B2 (en) 1990-02-22

Family

ID=15418264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14690782A Granted JPS5938381A (en) 1982-08-26 1982-08-26 Vacuum deposition furnace

Country Status (1)

Country Link
JP (1) JPS5938381A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008117690A1 (en) * 2007-03-26 2008-10-02 Ulvac, Inc. Evaporation source, vapor deposition apparatus and method of film formation
KR101885245B1 (en) * 2012-05-31 2018-09-11 삼성디스플레이 주식회사 Depositing apparatus and method for manufacturing organic light emitting diode display using the same

Also Published As

Publication number Publication date
JPS5938381A (en) 1984-03-02

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