JPH028048U - - Google Patents
Info
- Publication number
- JPH028048U JPH028048U JP8359888U JP8359888U JPH028048U JP H028048 U JPH028048 U JP H028048U JP 8359888 U JP8359888 U JP 8359888U JP 8359888 U JP8359888 U JP 8359888U JP H028048 U JPH028048 U JP H028048U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- out terminal
- container
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例のパワートランジス
タモジユールの断面図、第２図は従来のパワート
ランジスタモジユールの同様な位置での断面図で
ある。
１：トランジスタチツプ、２：基板、３：側壁
、４：引出し端子、５：上蓋、６：はんだ、９：
樹脂、１０：容器上部、１１：貫通孔。
FIG. 1 is a sectional view of a power transistor module according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional power transistor module at a similar position. 1: Transistor chip, 2: Substrate, 3: Side wall, 4: Output terminal, 5: Top cover, 6: Solder, 9:
Resin, 10: upper part of container, 11: through hole.
Claims (1)
する金属からなる基板上に、半導体素子片および
その素子片の電極と接続される引出し端子の脚部
が固着され、引出し端子は樹脂からなる容器上方
へ引出されるものにおいて、容器の側壁に、引出
し端子が通り注入樹脂が充填される貫通孔が側壁
面に平行に開けられたことを特徴とする半導体装
置。 A semiconductor element piece and the legs of a lead-out terminal connected to the electrodes of the element piece are fixed onto a substrate made of metal that constitutes the container together with an upper lid and side walls made of resin, and the lead-out terminal is pulled out above the container made of resin. 1. A semiconductor device characterized in that a through hole is formed in the side wall of the container, parallel to the side wall surface, through which a lead-out terminal passes and is filled with injected resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8359888U JPH028048U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8359888U JPH028048U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028048U true JPH028048U (en) | 1990-01-18 |
Family
ID=31308311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8359888U Pending JPH028048U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014123618A (en) * | 2012-12-20 | 2014-07-03 | Mitsubishi Electric Corp | Semiconductor module, manufacturing method of the same, and connection method of the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346755A (en) * | 1986-08-15 | 1988-02-27 | Hitachi Ltd | Insulation mold type semiconductor device |
-
1988
- 1988-06-24 JP JP8359888U patent/JPH028048U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346755A (en) * | 1986-08-15 | 1988-02-27 | Hitachi Ltd | Insulation mold type semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014123618A (en) * | 2012-12-20 | 2014-07-03 | Mitsubishi Electric Corp | Semiconductor module, manufacturing method of the same, and connection method of the same |